Matches 1 - 6 out of 6


Match Document Document Title
US20090267223 MEMS Package Having Formed Metal Lid  
A hermetic MEMS device (100) comprising a carrier (110) having a surface (111) including a device (101) and an attachment stripe (122), the stripe spaced from the device and surrounding the...
US20140332947 PACKAGES AND METHODS FOR PACKAGING  
Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or...
US20080001282 Microelectronic assembly having a periphery seal around a thermal interface material  
A microelectronic assembly is provided, comprising at least a first microelectronic die carrying a microelectronic circuit, at least a first periphery seal attached to an edge of a surface of the...
US20060065971 Electronic circuit packages  
This invention relates to electronic circuit packages designed to hold high frequency circuits operating particularly, but not exclusively, in the microwave, millimetre wave, and sub-millimetre...
US20160322280 PACKAGE FOR A SEMICONDUCTOR DEVICE  
A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A sealed metallic enclosure holds the...
US20160322279 PACKAGE FOR A SEMICONDUCTOR DEVICE  
A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A metallic enclosure is arranged for receiving...
Matches 1 - 6 out of 6