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Match Document Document Title
US20110012254 Air Cavity Package with Copper Heat Sink and Ceramic Window Frame  
An air cavity package is manufactured by attaching a die to a surface of a copper heat sink, dispensing a bead of epoxy around a periphery of the heat sink surface after the die is attached to the...
US20100224991 INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM  
An integrated circuit heat spreader stacking system includes: an integrated circuit on a substrate; a heat spreader having a heat sink dome; a stacking stand-off for the heat spreader; and the...
US20050046012 Leadframe-based mold array package heat spreader and fabrication method therefor  
A method for fabricating a heat spreader is provided. Heat spreaders are formed and surrounded by a frame. The heat spreaders and frame are connected to one another by tie bars, the heat spreaders...
US20110057306 EDGE MOUNTED INTEGRATED CIRCUITS WITH HEAT SINK  
A module has a substrate, first and second integrated circuits, and a heat sink. The integrated circuits each have a first major surface, a second major surface, a first edge, a second edge, and a...
US20050224954 Thermal dissipation in integrated circuit systems  
Integrated circuit systems with thermal dissipation enhancement features are described. In one aspect, an integrated circuit system includes a die incorporating an integrated circuit. The die has...
US20060170094 Semiconductor package integral heat spreader  
An integral heat spreader is disclosed wherein its physical characteristics are modified in regions between adjacent semiconductor devices. The modification improves the reliability of the...
US20050017350 Thermal enhanced extended surface tape for integrated circuit heat dissipation  
A thermal conductive tape article is provided which is adhered to the surface of an integrated circuit device to dissipate heat from the device. The thermal conductive tape article is preferably...
US20060060952 Heat spreader for non-uniform power dissipation  
A heat spreader has first and second regions. The second region lies substantially in a plane. At least a portion of the first region of the heat spreader has an out-of-plane dimension greater...
US20070152321 Fluxless heat spreader bonding with cold form solder  
The formation of electronic assemblies including a heat spreader coupled to at least one die is described. One embodiment relates to a method including positioning a solder on a heat spreader. The...
US20110215457 Dummy TSV to Improve Process Uniformity and Heat Dissipation  
In a stack of chips which each include active circuit regions, a plurality of through-silicon via (TSV) structures are formed for thermally conducting heat from the multi-chip stack by patterning,...
US20070040266 Heat-conducting packaging of electronic circuit units  
The invention relates to a heat-conducting coating of electronic circuit assemblies (102), comprising a coating agent (100), which encloses the electronic circuit assembly (102) and which is...
US20070246822 Hard disk drive preamp heat dissipation methods  
A heatsink architecture employing a combination of stiffeners and flex substrate to improve the sinking of heat from the integrated circuit. The stiffener may be employed in numerous locations,...
US20080220998 REVERSIBLE THERMAL THICKENING GREASE  
A reversible thermal thickening grease for microelectronic packages, in which the grease contains filler particles; at least one polymer; and a binder; in which the filler particles are dispersed...
US20120098116 MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES  
A multi-chip module (MCM) includes chip sub-modules that are fabricated as self-contained testable entities. The chip sub-modules plug into respective sockets in a frame of the MCM. Each chip...
US20070045823 THERMALLY CONDUCTIVE THERMOPLASTICS FOR DIE-LEVEL PACKAGING OF MICROELECTRONICS  
A composition and method for die-level packaging of microelectronics is disclosed. The composition includes about 20% to about 80% of a thermoplastic base matrix; about 20% to about 70% of a...
US20100187670 On-Chip Heat Spreader  
A three dimensional (3D) stacked chip structure with chips having on-chip heat spreader and method of forming are described. A 3D stacked chip structure comprises a first die having a first...
US20140312484 ELECTRONIC ASSEMBLY FOR MOUNTING ON ELECTRONIC BOARD  
An embodiment of an electronic assembly for mounting on an electronic board includes a plurality of electric contact regions exposed on a mounting surface of the electronic board. The electronic...
US20100007012 ELECTRONIC SYSTEM MODULES  
This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths as narrow as 5 microns or...
US20130168843 EMBEDDED HEAT SPREADER FOR PACKAGE WITH MULTIPLE MICROELECTRONIC ELEMENTS AND FACE-DOWN CONNECTION  
A microelectronic package includes a substrate, first and second microelectronic elements, and a heat spreader. The substrate has terminals thereon configured for electrical connection with a...
US20070090517 Stacked die package with thermally conductive block embedded in substrate  
Disclosed are embodiments of a stacked die package including a thermally conductive block disposed in the substrate. The die stack may include a lower die thermally coupled with the conductive...
US20060138643 One step capillary underfill integration for semiconductor packages  
The present invention relates to a semiconductor package containing a package substrate, integrated heat spreader, and semiconductor die. An underfill material is embedded in the semiconductor...
US20070080362 LED with light transmissive heat sink  
An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second...
US20050199998 Semiconductor package with heat sink and method for fabricating the same and stiffener  
A semiconductor package with a heat sink, a method for fabricating the same and a stiffener for the semiconductor package are proposed. At least one chip and the stiffener surrounding the chip are...
US20130154078 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SLUG AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; mounting a conductive connector over the package carrier; forming...
US20070108595 Semiconductor device with integrated heat spreader  
A semiconductor device includes a die, a substrate, a heat spreader and a plurality of signal interconnects extending from the die. The heat spreader has a base and a plurality of fins. The heat...
US20070090518 Microelectronic cooling apparatus and associated method  
An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling apparatus...
US20070108596 INTEGRATED CIRCUIT PACKAGE SYSTEM USING HEAT SLUG  
An integrated circuit package system includes providing a substrate having an integrated circuit die thereon. A support is provided on the substrate. A heat slug having a tie bar is positioned by...
US20070273023 Integrated circuit package having exposed thermally conducting body  
An apparatus and method for a wire-bond die-up area array package is described. The package includes an integrated circuit (IC) die, a substrate, and a thermally conducting body. A bottom surface...
US20090115052 HYBRID SILICON/NON-SILICON ELECTRONIC DEVICE WITH HEAT SPREADER  
A hybrid electronic device incorporating both Si and non-Si semiconductor components, utilizing SiC, diamond, or another highly thermally conductive material as an underlying heat spreader. The...
US20110285010 Electric power converter  
An electric power converter includes: a heat sink having a heat receiving surface; a semiconductor module including a metal plate having a heat radiation surface, a switching element on the metal...
US20070216022 FIN STRUCTURE FOR A HEAT SINK  
A heat sink includes a base adapted for absorbing heat from a heat-generating component, and a plurality of parallel fins having channels defined therebetween. Each of the fins includes a main...
US20100187680 Heat radiator  
A radiator includes: an insulating substrate, a heating element or a semiconductor chip is mounted; and a heat sink that is provided the insulating substrate through a stress relaxation member...
US20080237840 Flexible circuit electronic package with standoffs  
A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk...
US20100163921 SEMICONDUCTOR CHIP ASSEMBLY WITH ALUMINUM POST/BASE HEAT SPREADER AND SILVER/COPPER CONDUCTIVE TRACE  
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and...
US20110024892 THERMALLY ENHANCED HEAT SPREADER FOR FLIP CHIP PACKAGING  
A flip chip microelectronic package having a heat spreader is provided. In one embodiment, the microelectronic package comprises a die having a first surface and a second surface, the first...
US20060151872 Connection between a semiconductor housing and a base plate comprising a passage opening for fastening to a heat sink  
A semiconductor module has a housing (2) and a metal base plate (3). A reliable yet easily producible force-transmitting connection between a semiconductor module and an external heat sink is...
US20110241199 PROGRAMMABLE SYSTEM IN PACKAGE  
Some embodiments of the invention provide a programmable system in package (“PSiP”). The PSiP includes a single IC housing, a substrate and several IC's that are arranged within the single IC...
US20060249835 Package for receiving electronic parts, and electronic device and mounting structure thereof  
A package for receiving electronic part has a heat radiating plate having a mounting area where the electronic part is mounted at a center portion of one main surface, a frame body adhered to the...
US20090057878 SEMICONDUCTOR DIE PACKAGE INCLUDING HEAT SINKS  
A semiconductor die package including at least two heat sinks. The semiconductor die package includes a first heat sink, a second heat sink coupled to the first heat sink, and a semiconductor die...
US20070235860 Power semiconductor module with flush terminal elements  
A power semiconductor module includes a housing, terminal elements leading to the outside of the housing, an electrically insulated substrate arranged inside the housing, with the substrate being...
US20070217160 Memory Module Including a Cooling Element, Method for Producing the Memory Module Including a Cooling Element, and Data Processing Device Comprising a Memory Module Including a Cooling Element  
A memory module includes a cooling element with a board. The board includes a surface on which at least one first electronic component and at least one second electronic component are arranged, a...
US20060249836 Chip-scale package  
A semiconductor package including a conductive clip preferably in the shape of a can, a semiconductor die, and a conductive stack interposed between the die and the interior of the can which...
US20050146060 Peltier module and manufacturing method therefor  
A Peltier module comprising a plurality of thermoelectric semiconductor elements between substrates in connection with electrodes. It is manufactured by four steps, namely, an application step in...
US20060273450 Solid-diffusion, die-to-heat spreader bonding methods, articles achieved thereby, and apparatus used therefor  
A die and heat spreader are bonded with an intermetallic thermal interface material (TIM). The bonding process is carried out in a tool that can control conditions such that fluxing is not...
US20060273451 Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing method  
A semiconductor IC includes a semiconductor IC main body having a predetermined circuit formed on a main surface, a metal layer selectively provided on substantially the whole back surface of the...
US20080122067 HEAT SPREADER FOR AN ELECTRICAL DEVICE  
A heat spreader for electrical device is disclosed, a portion of said heat spreader is above and corresponding to a chip which is coupled with a base of electrical device. An embodiment for the...
US20060043578 Semiconductor device having heat sink  
A semiconductor device, which may include a heat sink using a thermal induced adhesive is provided. The adhesive strength of the thermal induced adhesive at room temperature may be reduced when...
US20080265403 Hybrid Metal Matrix Composite Packages with High Thermal Conductivity Inserts  
A hybrid package for heat sinking a device is formed of a graphitic material that defines a plurality of cavities for cast-in-rivets and that defines at least one cavity for a cast-in-rivet via....
US20060208354 Thermal interface structure and process for making the same  
A thermal interface structure (10, 20) is provided for a highly conductive thermal interface between an electronic component and a cooling device for dissipating heat generated by the electronic...
US20090014864 THERMAL INTERFACE MATERIAL HAVING CARBON NANOTUBES, COMPONENT PACKAGE HAVING THE SAME AND METHOD FOR MAKING THE COMPONENT PACKAGE  
A thermal interface material includes a carbon nanotube array, a transition structure, and a matrix. The carbon nanotube array includes a plurality of carbon nanotubes. The transition structure...

Matches 1 - 50 out of 247 1 2 3 4 5 >