Matches 1 - 50 out of 98 1 2 >
Match Document Document Title
US20090294931 Methods of Making an Electronic Component Package and Semiconductor Chip Packages  
An electronic component package having an EMI shielded space is disclosed. The package comprises a substrate having an electronic component located on its surface and a conductive enclosure having...
US20090289339 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME  
A semiconductor package includes a carrier, a chip, a stiffener and an encapsulant. The chip is disposed on the carrier. The stiffener is disposed around the chip, directly contacts the carrier,...
US20090289338 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME  
A semiconductor package includes a carrier, a chip, a stiffener and an encapsulant. The chip is disposed on the carrier. The stiffener is disposed around the chip, directly contacts the carrier,...
US20090267203 MULTI-CHIP PACKAGE FOR REDUCING TEST TIME  
A multi-chip package is provided. The multi-chip package includes semiconductor chips. The multi-chip package receives selection signals for selecting two or more chips in response to the selection...
US20090243063 PACKAGING METHOD OF MICRO ELECTRO MECHANICAL SYSTEM DEVICE AND PACKAGE THEREOF  
Disclosed are a micro electro mechanical system (MEMS) device and a package thereof. The packaging method of a MEMS device comprises: sequentially forming a sacrificial layer, a support layer, and...
US20090243062 IC TAG AND MANUFACTURING METHOD OF THE SAME  
An IC tag comprises a substrate on which a wiring pattern is formed, an IC chip which is bonded and mounted to the substrate by bringing a bump into press-contact with the wiring pattern, a...
US20090236716 RECTIFYING DIODE PACKAGE STRUCTURE  
A rectifying diode package structure includes a base which has a holding deck to hold a diode chip and a protective portion on the perimeter of the base to form sealing space filled by a filling...
US20090236715 SEMICONDUCTOR PACKAGE STRUCTURE WITH LAMINATED INTERPOSING LAYER  
The invention relates to microelectronic semiconductor chip assemblies having vertically stacked layers. In a disclosed example of a preferred embodiment, a vertically stacked semiconductor chip...
US20090236678 SENSOR DEVICE AND PRODUCTION METHOD THEREFOR  
A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame...
US20090230530 SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE  
A back side of the silicon semiconductor substrate is roughly ground and is finishing-ground by using a whetstone having a copper content of less than 1 ppm, the back side being an opposite side of...
US20090224356 Method and apparatus for thermally aware design improvement  
Thermally aware design improvement enables increasing performance, reliability, and other related metrics by performing a multi-dimensional thermal analysis of a design of an electronic component...
US20090221925 Microelectronic Device With Integrated Energy Source  
An apparatus including an electronic device having a plurality of substantially collocated components, the plurality of components including an antenna, an energy supply and an integrated circuit...
US20090212406 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME  
When manufacturing a semiconductor device by mounting a semiconductor chip 2 on a substrate 1 with a flip-chip method, projections 9 are formed between pads 4 arranged in multiple annular...
US20090206473 System and Method for Integrated Waveguide Packaging  
A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit...
US20090194860 Chip Housing Having Reduced Induced Vibration  
A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an...
US20090189265 METHOD AND APPARATUS FOR MAKING SEMICONDUCTOR DEVICES INCLUDING A FOIL  
A method for manufacturing a semiconductor device including covering a portion of at least one semiconductor device with a foil, including covering at least one target region of the semiconductor...
US20090184407 METHOD TO RECOVER UNDERFILLED MODULES BY SELECTIVE REMOVAL OF DISCRETE COMPONENTS  
Methods and reworked intermediate and resultant electronic modules made thereby, whereby a component in need of rework is located and removed from the module to reveal encapsulated solder...
US20090166830 Metallic cover of miniaturization module  
A metallic cover of a miniaturization module includes a substrate, a SMD chip unit and a metallic cover, the metallic cover embracing the SMD chip unit and having at least one sizing hole and a...
US20090160040 LOW TEMPERATURE CERAMIC MICROELECTROMECHANICAL STRUCTURES  
A method of providing microelectromechanical structures (MEMS) that are compatible with silicon CMOS electronics is provided. The method provides for processing and manufacturing is steps limiting...
US20090152698 INTEGRATED MATCHING NETWORKS AND RF DEVICES THAT INCLUDE AN INTEGRATED MATCHING NETWORK  
An integrated matching network includes a first die on a substrate, a second die on the substrate, and a metallization layer on the first and second dies. The second die has a capacitance, the...
US20090146281 SYSTEM IN PACKAGE AND FABRICATION METHOD THEREOF  
There is provided a system-in-package including: a substrate of a sawed base wafer on which a semiconductor circuit is formed; a conductive post formed on a top surface of the substrate; at least...
US20090140404 HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS  
A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations....
US20090121334 MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS  
A required number of wiring layers 32 are formed on a temporary substrate 31 of which thermal expansion coefficient differs from that of a semiconductor chip 38 by 2×10 −6 /° C. or less...
US20090121333 Flexible substrates having a thin-film barrier  
Methods and apparatus provide for: applying an inorganic barrier layer to at least a portion of a flexible substrate, the barrier layer being formed from a low liquidus temperature (LLT) material;...
US20090115008 MANUFACTURING METHOD OF AN ELECTRONIC DEVICE INCLUDING OVERMOLDED MEMS DEVICES  
A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated,...
US20090108473 DIE-ATTACH MATERIAL OVERFLOW CONTROL FOR DIE PROTECTION IN INTEGRATED CIRCUIT PACKAGES  
Methods, systems, and apparatuses for integrated circuit packages are provided. An integrated circuit package includes a metal layer, an integrated circuit die, and an adhesive material. The metal...
US20090079052 Semiconductor package, apparatus and method for manufacturing the semiconductor package, and electronic device equipped with the semiconductor package  
Provided is a semiconductor package which includes a substrate that includes a chip region having an active surface and an inactive surface, and a dicing region having an active surface and an...
US20090045494 METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE  
The invention relates to a method of packaging an electronic microsystem ( 200 ) and further to such a packaged device. With the method a packaged electronic microsystem ( 200 ) can be manufactured...
US20090001574 Multi-chips Stacked package structure  
A multi-chips Stacked package structure, wherein a plurality of chips are stacked on the substrate with a rotation so that a plurality of metallic ends and the metal pad on each chip on the...
US20080308919 HOLLOW SEALING STRUCTURE AND MANUFACTURING METHOD FOR HOLLOW SEALING STRUCTURE  
A manufacturing method for a hollow sealing structure, includes, a process for filling a recessed portion in a principal surface of a substrate with a first sacrificial layer, a process for forming...
US20080308918 SEMICONDUCTOR PACKAGE WITH PASSIVE ELEMENTS  
The semiconductor package includes a plate having first via patterns formed on a center portion and second via patterns formed on edge portions; a connection wiring formed on a top surface of the...
US20080299288 Durable, heat-resistant multi-layer coatings and coated articles  
A method of providing a durable protective coating structure which comprises at least three layers, and which is stable at temperatures in excess of 400° C., where the method includes vapor...
US20080265387 SMUDGE RESISTANT COATING FOR ELECTRONIC DEVICE DISPLAYS  
An apparatus and method is provided for preventing smudges ( 608 ) including oils and dust from collecting on a portable electronic device display ( 110, 150, 200, 300 ). A plurality of islands (...
US20080258282 LEAD FRAME FREE PACKAGE AND METHOD OF MAKING  
A lead frame free packaged semiconductor device with an exposed heat sink is formed by die bonding the semiconductor device directly to the heat sink and bonding package leads directly to the...
US20080258272 ETCHED LEADFRAME STRUCTURE  
A leadframe structure is disclosed. The leadframe structure includes a first leadframe structure portion with a first thin portion and a first thick portion, where the first thin portion is defined...
US20080246133 Flip-chip image sensor packages and methods of fabricating the same  
There is provided an imager package including an image sensor die attached to a transparent substrate such that sensitive image sensing components on the sensor die face the transparent substrate....
US20080237821 Package structure and manufacturing method thereof  
A package structure and a manufacturing method thereof are provided. The package structure includes a substrate, a shielding plate, a first chip, a first sealant, a second chip and a second...
US20080237820 Package structure and method of manufacturing the same  
A package structure including a substrate, a shielding element, a chip, a sealant layer and a semiconductor device is provided. The substrate has a first surface and a second surface opposite to...
US20080230885 CHIP HERMETIC PACKAGE DEVICE AND METHOD FOR PRODUCING THE SAME  
A chip hermetic package device includes a substrate, a chip, a hermetic lid, a hermetic material and a post. The height of the post is larger than the thickness of the hermetic material. A method...
US20080230883 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLDED STRIP PROTRUSION  
An integrated circuit package system includes an in-line strip, attaching an integrated circuit die over the in-line strip, and applying a molding material with a molded segment having a molded...
US20080224302 Semiconductor Module  
A module includes a semiconductor chip and a conductive layer arranged over the semiconductor chip. The module also includes a spacer structure arranged to deflect the conductive layer away from...
US20080224291 PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS  
Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The...
US20080222876 SYSTEM FOR ATTACHING ELECTRONIC COMPONENTS TO MOLDED INTERCONNECTION DEVICES  
A system for connecting electrical devices to one another is provided. This system includes a horizontal or non-horizontal substrate and an anchor connected to or formed integrally with the...
US20080211073 AIRTIGHT PACKAGE  
An airtight sealed package with a device sealed therein in an airtight manner under vacuum, the device being placed in a space defined in the airtight sealed package by a lid and a substrate,...
US20080197460 PACKAGED IC DEVICE COMPRISING AN EMBEDDED FLEX CIRCUIT, AND METHODS OF MAKING SAME  
A device is disclosed which includes a flexible material including at least one conductive wiring trace, a first die including at least an integrated circuit, the first die being positioned above a...
US20080185700 Adhesive Film and Method for Manufacturing Semiconductor Device Using Same  
The invention provides an adhesive tape which acts as a dicing tape which is excellent in dicing property and pickup property in a dicing step, and as an adhesive tape which is excellent in...
US20080173994 METHOD OF MAKING RELEASE COATINGS FOR COMPOSITE MATERIALS  
A release film for soft composite materials is provided. The release film contains a film with a closely packed self-assembled monolayer. A method of applying soft composite materials to a...
US20080173993 CHIP CARRIER SUBSTRATE CAPACITOR AND METHOD FOR FABRICATION THEREOF  
A chip carrier substrate includes a capacitor aperture and a laterally separated via aperture, each located within a substrate. The capacitor aperture is formed with a narrower linewidth and...
US20080157313 Array capacitor for decoupling multiple voltages  
In some embodiments, an array capacitor for decoupling multiple voltages is presented. In this regard, an array capacitor is introduced having two electrically isolated capacitor regions. Other...
US20080157312 Semiconductor image device package with die receiving through-hole and method of the same  
The present invention discloses a structure of package comprising: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die having micro...
Matches 1 - 50 out of 98 1 2 >