Match Document Document Title
US20140070392 COMMON DRAIN POWER CLIP FOR BATTERY PACK PROTECTION MOSFET  
A first embodiment is a common drain+clip 20. It has a conventional drain contact on its bottom surface and is flip chip mounted on a half-etched leadframe 40 which has external source, gate and...
US20110298114 STACKED INTERPOSER LEADFRAMES  
A stacked leadframe assembly is disclosed. The stacked leadframe assembly includes a first die having a surface that defines a mounting plane, a first leadframe stacked over and attached to the...
US20120133037 CLIP INTERCONNECT WITH ENCAPSULATION MATERIAL LOCKING FEATURE  
A clip interconnect comprises a columnar part, a bridge part, and a locking feature. The bridge part has a plurality of sides. The columnar part and the bridge part are configured to form an angle...
US20130256807 Integrated Dual Power Converter Package Having Internal Driver IC  
An integrated dual power converter package is disclosed. The package includes a leadframe having a first control FET paddle configured to support a drain of a first control FET, and a second...
US20120119343 STACKED LEADFRAME IMPLEMENTATION FOR DC/DC CONVERTOR POWER MODULE INCORPORATING A STACKED CONTROLLER AND STACKED LEADFRAME CONSTRUCTION METHODOLOGY  
Methods and systems are described for enabling the efficient fabrication of small form factor power converter packages and other devices using stacked leadframes.
US20130147025 METHOD OF STACKING FLIP-CHIP ON WIRE-BONDED CHIP  
A first chip is mounted on a substrate and includes a plurality of bump pads located on an active surface of the first chip. A wire bonds a first bump pad to the substrate. An intermediate layer...
US20130154071 Isolation Barrier Device and Methods of Use  
Systems and methods pertaining to a digital signal isolator device are described. In one embodiment, the device includes an isolation barrier and two metal support paddles. The isolation barrier...
US20140159218 CHIP PACKAGING STRUCTURE OF A PLURALITY OF ASSEMBLIES  
Disclosed herein are chip packaging structures for packaging multiple assemblies therein. In one embodiment, a chip packaging structure can include: (i) a first assembly located at a bottom layer...
US20140252399 ELECTRONIC PACKAGING SUBSTRATE WITH ETCHING INDENTATION AS DIE ATTACHMENT ANCHOR AND METHOD OF MANUFACTURING THE SAME  
An electronics package is disclosed. The electronics package is disclosed as including a substrate core, a metal layer established on top of the substrate core, the metal layer being etched so as...
US20150001646 Pre-mold for a microphone assembly and method of producing the same  
A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the...
US20120018864 BONDING STRUCTURE AND METHOD  
A bonding structure and a method for bonding components, wherein the bonding structure includes a nanoparticle preform. In accordance with embodiments, the nanoparticle preform is placed on a...
US20080173991 PRE-MOLDED CLIP STRUCTURE  
A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first...
US20080211072 Testing and burn-in using a strip socket  
A method and apparatus are provided for using a strip socket in testing or burn-in of semiconductor devices in a strip. In one example of the method, processing of semiconductor devices involves...
US20140097526 PACKAGED IC HAVING PRINTED DIELECTRIC ADHESIVE ON DIE PAD  
A method of assembling a packaged integrated circuit (IC) includes printing a viscous dielectric polymerizable material onto a die pad of a leadframe having metal terminals positioned outside the...
US20120326287 DC/DC CONVERTOR POWER MODULE PACKAGE INCORPORATING A STACKED CONTROLLER AND CONSTRUCTION METHODOLOGY  
Methods and systems are described for enabling the efficient fabrication of small form factor power converters and also the small form factor power converter devices.
US20150235999 CONVERTER HAVING PARTIALLY THINNED LEADFRAME WITH STACKED CHIPS AND INTERPOSER, FREE OF WIRES AND CLIPS  
Power supply system (100) comprises vertically sequentially a QFN leadframe (101), a first chip (110) with FET terminals on opposite sides, a flat interposer (120), and a second chip (130) with...
US20130256859 Dual Power Converter Package Using External Driver IC  
A dual power converter package is disclosed. The package includes a leadframe having a first control FET paddle configured to support a drain of a first control FET, and a second control FET...
US20060145317 Leadframe designs for plastic cavity transistor packages  
The specification describes a plastic cavity package for semiconductor devices that provides additional mechanical integrity for leads that extend from the plastic housing. Portions of the leads...
US20080315380 INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING PERIMETER PADDLE  
An integrated circuit package system comprising: forming a paddle having a hole and an external interconnect; mounting an integrated circuit device having an active side to the paddle with the...
US20100301464 ASTERISK PAD  
A method and structure for a semiconductor device can include a chip support having a one or more elongated structures formed in the chip support The elongated structures, which have a width and a...
US20080111219 PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE  
Embodiments in accordance with the present invention relate to packaging designs for vertical conduction semiconductor devices which include low electrical resistance contacts with a top surface...
US20080150104 LEADFRAME WITH DIFFERENT TOPOLOGIES FOR MEMS PACKAGE  
A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one...
US20120032317 Self-Aligning Structures and Method for Integrated Chips  
A lead frame having a die thereon connects a conductive area on the die to a lead frame contact using a conductive clip that includes a structural portion that is received with a recess-like “tub”...
US20130207250 CHIP ATTACH FRAME  
A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip...
US20090008755 STRUCTURE AND METHOD FOR MANUFACTURING SMD DIODE FRAME  
A structure of an SMD (surface mount device) diode frame is provided that comprises a plastic seat and a plurality of metal pins. One side of the plastic seat has a concave functional area and the...
US20060220191 Electronic package with a stepped-pitch leadframe  
A leadframe for an electronic package is provided. The lead frame includes a plurality of leads each having an outer lead bond and an inner lead bond. The plurality of leads are interconnected by...
US20130043575 CHIP-PACKAGING MODULE FOR A CHIP AND A METHOD FOR FORMING A CHIP-PACKAGING MODULE  
A chip-packaging module for a chip is provided, the chip-packaging module including a chip including a first chip side, wherein the first chip side includes an input portion configured to receive...
US20130161805 INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN  
Provided, in one embodiment, is an integrated circuit (IC) leadframe. In one example, the leadframe includes a paddle, wherein the paddle has a surface configured to accept an IC chip and has at...
US20130168841 Programmable Interposer with Conductive Particles  
An exemplary implementation of the present disclosure includes a programmable interposer having top and bottom interface electrodes and conductive particles interspersed within the programmable...
US20090102034 Packaged Microchip with Spacer for Mitigating Electrical Leakage Between Components  
A packaged microchip has a base, at least one spacer coupled to the base, and first and second microchips mounted to the at least one spacer. The at least one spacer is configured to substantially...
US20090212430 CARBON NANOTUBE-BASED CONDUCTIVE CONNECTIONS FOR INTEGRATED CIRCUIT DEVICES  
Electrical connection in an integrated circuit arrangement is facilitated with carbon nanotubes. According to various example embodiments, a carbon nanotube material (120, 135) is associated with...
US20130049181 LEAD FRAME HAVING A FLAG WITH IN-PLANE AND OUT-OF-PLANE MOLD LOCKING FEATURES  
A semiconductor device lead frame having enhanced mold locking features is provided. The lead frame has a flag with bendable edge features along the edge of the flag. Each edge feature is shaped...
US20120032315 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIE PADDLE AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a single integral structure with a paddle central portion surrounded by a paddle...
US20090121330 Clip Mount For Integrated Circuit Leadframes  
A leadframe having a die thereon connects a high current conductive area on the die to a leadframe contact using copper clip that include a structure portion that is received with a recess-like...
US20140070390 MULTI-CHIP PACKAGING STRUCTURE AND METHOD  
Disclosed are multi-chip packaging structures and methods. In one embodiment, a multi-chip packaging structure can include: (i) N chips, where N is an integer of at least two, and where an upper...
US20070105280 BRACE FOR WIRE LOOP  
A method of connecting a lead frame (12) lead finger (16a) to a bond pad (18a) on an integrated circuit (IC) die (10) includes bonding a first bonding wire (20a) from the lead finger (16a) to an...
US20130214399 DC/DC Converter Power Module Package Incorporating a Stacked Controller and Construction Methodology  
Methods and systems are described for enabling the efficient fabrication of small form factor power converters and also the small form factor power converter devices.
US20090166826 LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES  
Disclosed are die paddle structures for leadframes and methods of attaching die to the die paddles. An exemplary die paddle comprises a sloped wall disposed around an attachment area for a die,...
US20130161804 INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN  
Provided, in one embodiment, is an integrated circuit (IC) leadframe. In one example, the leadframe includes a paddle, wherein the paddle has a surface configured to accept an IC chip and has at...
US20090065916 SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING  
A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the...
US20110108966 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONCAVE TRENCHES AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: providing a conductive layer having a first surface and a second surface; forming first concave trenches in the first...
US20090174045 Bump Pad Metallurgy Employing An Electrolytic Cu / Electorlytic Ni / Electrolytic Cu Stack  
An electroless Cu layer is formed on each side of a packaging substrate containing a core, at least one front metal interconnect layer, and at least one backside metal interconnect layer. A...
US20090026592 SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCIATED SYSTEMS AND METHODS  
Semiconductor dies with recesses, associated leadframes, and associated systems and methods are disclosed. A semiconductor system in accordance with one embodiment includes a semiconductor die...
US20140138803 CHIP ARRANGEMENTS AND METHODS FOR MANUFACTURING A CHIP ARRANGEMENT  
A chip arrangement is provided, the chip arrangement including: a carrier; a chip disposed over the carrier, the chip including one or more contact pads, wherein a first contact pad of the one or...
US20140138706 ELECTRONIC CIRCUIT, PRODUCTION METHOD THEREOF, AND ELECTRONIC COMPONENT  
An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat...
US20080116548 WIRE BOND AND METHOD OF FORMING SAME  
In a semiconductor package having a plurality of wire bond interconnections between a semiconductor chip and a chip carrier, a wire bond (20) including a first stitch bond (22) formed at a first...
US20090224382 SEMICONDUCTOR PACKAGE WITH MOLD LOCK VENT  
A semiconductor package including a leadframe having first and second major surfaces and a mold lock opening extending between the first and second major surfaces. The semiconductor package...
US20090294939 LEAD FRAME AND SEMICONDUCTOR DEVICE UTILIZING THE SAME  
A lead frame and semiconductor device providing improved bond strength from wave bonding such as of wires in lead frames manufactured with depressed inner leads. The lead frame comprises an outer...
US20080290486 LEADFRAME PACKAGE  
A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the...
US20100072591 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ANTI-PEEL PAD  
An integrated circuit package system includes: forming an anti-peel pad having both a concave ring and an external terminal with the concave ring, having a peripheral wall, surrounding the...