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US20130285219 INTEGRATED CIRCUIT POWER GRID WITH IMPROVED ROUTING RESOURCES AND BYPASS CAPACITANCE  
An integrated circuit power grid is provided with improved routing resources and bypass capacitance. A power grid for an integrated circuit comprises a plurality of thick metal layers having a...
US20060076654 Lead frame and physical amount sensor  
A lead frame for a physical sensor is made of sheet metal and includes a stage for mounting a physical sensor chip, a frame having a plurality of leads disposed peripherally around the stage, and...
US20070090501 Lead frame  
A lead frame base is coated with a four-layer plating. The four-layer plating includes an underlayer plating (Ni), a palladium plating, a silver plating and a gold plating arranged in this order...
US20130277811 STACKED INTERPOSER LEADFRAMES  
A method of manufacturing integrated circuit (IC) devices includes the steps of providing a first frame that has openings each having a perimeter with shaped notches, placing a first die in at...
US20110272794 PRE-MOLDED CLIP STRUCTURE  
A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first...
US20060208344 Lead frame panel and method of packaging semiconductor devices using the lead frame panel  
A lead frame panel (40) includes a body (42) having an array of die support areas (44) for receiving respective semiconductor dies. The die support areas (44) are surrounded by leads (46)....
US20070069341 Radio recognition semiconductor device and its manufacturing method  
A plurality of radio semiconductor chips each having a plurality of electrodes on a surface thereof is provided. By establishing connection between the respective electrodes of the semiconductor...
US20130307129 WIRING MEMBER AND SEMICONDUCTOR MODULE HAVING THE SAME  
A wiring member includes a first leg portion, a second leg portion, a third leg portion, a first connecting wall and a second connecting wall. The first leg portion is electrically connected to a...
US20110180913 METHOD OF STACKING FLIP-CHIP ON WIRE-BONDED CHIP  
Some of the embodiments of the present disclosure provide apparatuses, systems, and methods for stacking chips. A first chip may be mounted on a substrate, wherein an active surface of the first...
US20070029649 Plastic lead frame with snap-together circuitry  
A plastic lead frame with snap-together electrical connectors, electrical component system, and method using plastic-injection, plating, and known photolithography techniques is disclosed. The...
US20070138604 HEAT FIXTURE FOR WIRE BONDING  
A heat fixture is adapted to support a leadframe, and the leadframe includes a die pad and a plurality of leads. The heat fixture includes a fixture body and an isolating element. The fixture body...
US20140117518 Control and Driver Circuits on a Power Quad Flat No-Lead (PQFN) Leadframe  
According to an exemplary implementation, a power quad flat no-lead (PQFN) leadframe includes U-phase and W-phase power switches situated on the PQFN leadframe and respectively connected to a...
US20090267171 PRE-ENCAPSULATED CAVITY INTERPOSER  
A pre-encapsulated cavity interposer, a pre-encapsulated frame, for a semiconductor device.
US20120119230 LED DEVICE HAVING A TILTED PEAK EMISSION AND AN LED DISPLAY INCLUDING SUCH DEVICES  
An LED package and a lead frame include a reflector cup having a bottom surface with an LED asymmetrically positioned on the bottom surface and a wall surface inclined relative to the bottom...
US20130256859 Dual Power Converter Package Using External Driver IC  
A dual power converter package is disclosed. The package includes a leadframe having a first control FET paddle configured to support a drain of a first control FET, and a second control FET...
US20100072507 Lead frame, and light emitting diode module having the same  
A light emitting diode (LED) module includes a lead frame having a number (N) of conducting arms spaced apart from each other, where N≧3, and at least one LED die mounted on one of any two...
US20080157297 Stress-Resistant Leadframe and Method  
Leadframes resistant to stress and semiconductor devices incorporating such leadframes are described, including but not limited to QFN packages and the like. According to preferred embodiments...
US20090134502 LEADFRAME BASED FLASH MEMORY CARDS  
A leadframe design for forming leadframe-based semiconductor packages having curvilinear shapes is disclosed. The leadframes may each include one or more curvilinear slots corresponding to...
US20140061882 ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATION  
A circuit assembly includes a plurality of integrated circuits having stud bumps at each input/output pad, an interconnection circuit having wells filled with solder, said wells corresponding in a...
US20090072359 STACKED SYNCHRONOUS BUCK CONVERTER  
A multichip module buck converter 10 has a high side power mosfet 12, a low side power mosfet 22 and a pre-molded leadframe 40 between the two mosfets for connecting the source of mosfet 12 to the...
US20100084748 THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS  
Methods for minimizing warpage of a welded foil carrier structure used in the packaging of integrated circuits are described. Portions of a metallic foil are ultrasonically welded to a carrier to...
US20050269673 Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same  
A copper foil which is substantially free of generation of voids even if fusing treatment is conducted on a tin-plated layer and which is excellent in etching properties is provided. To achieve...
US20080237814 ISOLATED SOLDER PADS  
An integrated circuit package is described that includes a die and a lead frame that includes recessed regions for preventing the undesired spread of solder during reflow. The die includes a...
US20060249819 Lead frame having contacting pins of different thickness  
A lead frame has contacting pins of different thickness arranged around a die pad and spaced from one another and the die pad to fit the demands of the designed integrated circuit, for enabling...
US20130062722 CHIP MODULE AND A METHOD FOR MANUFACTURING A CHIP MODULE  
In various embodiments, a chip module may include a first chip; and a leadframe with a first leadframe area and a second leadframe area, wherein the first leadframe area is electrically insulated...
US20140357022 A QFN WITH WETTABLE FLANK  
Methods of fabricating a QFN with wettable flank are described. In an embodiment, a leadframe is used which comprises regions of reduced thickness dam bar which extend across an edge of a kerf...
US20140070383 Pre-Molded MEMS Device Package with Conductive Shell  
A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. A conductive internal shell with a connection window sits in the cavity. The...
US20090166820 TSOP LEADFRAME STRIP OF MULTIPLY ENCAPSULATED PACKAGES  
A method of fabricating a semiconductor leadframe package from a strip including multiply encapsulated leadframe packages, and a leadframe package formed thereby are disclosed. An entire row or...
US20090091006 Dual Capillary IC Wirebonding  
The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires...
US20050224925 Lead frame having a tilt flap for locking molding compound and semiconductor device having the same  
To enhance the adhesion force between a lead frame and a molding compound of a surface mount semiconductor device, a lead frame having two opposite sides, with at least one tilt flap for locking a...
US20100072584 COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PARTS  
A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is...
US20120001307 Lead Frame and Method For Manufacturing the Same  
A lead frame comprises: a base metal layer; a copper plating layer, including one of a copper layer and an alloy layer including a copper, configured to plate the based metal layer to make a...
US20070222042 SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES  
The device of this invention includes a semiconductor die attached to a bare copper lead frame and electrically coupled to a lead by a metal wire coated with a metallic material. The device would...
US20140117517 Power Quad Flat No-Lead (PQFN) Package Having Control and Driver Circuits  
According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a multi-phase power inverter, a control circuit, and a driver circuit. The driver circuit is configured...
US20060170079 Integrated circuit device having encapsulant dam with chamfered edge  
An integrated circuit device is provided having a substrate, at least one integrated circuit element and a leadframe. The integrated circuit element and the leadframe are disposed on the...
US20120241927 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRANSPARENT ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: forming a substrate having a redistribution line thereon; mounting an integrated circuit to the substrate; and molding a...
US20060113643 Simplified multichip packaging and package design  
A multichip integrated circuit apparatus includes first and second integrated circuit die mounted on opposite sides of a leadframe die paddle, with at least one of the integrated circuit die...
US20070273010 Design and Method for Attaching a Die to a Leadframe in a Semiconductor Device  
The semiconductor device whose structure is formed from a die attached to a leadframe comprises a die having an attachment member, and a leadframe having a recess configured to receive a...
US20080001264 Exposed top side copper leadframe manufacturing  
In a method and system for fabricating a leadframe (100), a thickness of bondable areas (150, 152 and 154) of the leadframe (100) is reduced. A plating finish (160) is applied to a surface of the...
US20080224279 VERTICAL ELECTRICAL INTERCONNECT FORMED ON SUPPORT PRIOR TO DIE MOUNT  
A die assembly includes a die mounted to a support, in which the support has interconnect pedestals formed at bond pads, and the die has interconnect terminals projecting beyond a die edge into...
US20060038263 Semiconductor chip arrangement  
A patterned connection plane between two semiconductor chips which are connected using face-to-face technology is patterned into first pads, second pads, and conductor strips which are...
US20120241926 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEVELING STANDOFF AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: providing a lead; mounting an integrated circuit adjacent the lead; molding an encapsulation encapsulating the lead and...
US20070045789 Latency Adjustment Between Integrated Circuit Chips  
In emulation systems having a plurality of chips, data communicated between the chips needs to be synchronized. A receiver chip may push or pull on incoming data from an emitter chip in order to...
US20090206457 RESIN MOLDING PART AND MANUFACTURING METHOD THEREOF  
A primary molding product is formed by integrally forming a first lead frame and a second lead frame with a primary molding resin portion. In addition, in order to prevent separation of the first...
US20090224377 SEMICONDUCTOR DEVICE WITH WIRE-BONDING ON MULTI-ZIGZAG FINGERS  
A semiconductor device having linear zigzag(s) for wire bonding is revealed, primarily comprising a chip, a plurality of leads made of a lead frame and a plurality of bonding wires electrically...
US20090273064 Semiconductor device and inspection method therefor  
A semiconductor device includes a circuit block formed in a peripheral edge portion of a semiconductor chip, a circuit block pad formed on the circuit block providing an electrical connection for...
US20070096269 LEADFRAME FOR SEMICONDUCTOR PACKAGES  
A leadframe for semiconductor packages. The leadframe includes a die pad, a side rail, a tie bar, and a plurality of leads. The side rail is around the die pad. The tie bar connects the die pad...
US20140070382 Pre-Molded MEMS Device Package  
A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. To accommodate a MEMS microphone, an acoustic aperture extends through the...
US20090294936 FOUR MOSFET FULL BRIDGE MODULE  
A molded, leadless packaged semiconductor multichip module includes 100 has four mosfets 10, 12, 14, 16 for a full bridge circuit. The mosfets may include two N-channel and two P-channel devices...
US20050263861 Integrated circuit leadframe and fabrication method therefor  
An integrated circuit leadframe and a fabrication method for fabricating the integrated circuit leadframe include forming a leadframe having leads around a die pad that has a peripheral die pad...