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US20130062740 TUNABLE RADIATION SOURCE  
An energy distribution of soft error-inducing radiation likely to be encountered by an electronic circuit during operation is determined. A tuned radiation source having a source energy...
US20110147902 Integrated Circuit Comprising Light Absorbing Adhesive  
The invention relates to a structure 20 comprising a substrate 12, a chip 16 bonded to the substrate by means of a bonding adhesive, wherein the bonding adhesive comprises light absorbing and/or...
US20120139092 MULTI-CHIP STACK STRUCTURE  
A multi-chip stack structure including a first chip, a second chip, a shielding layer, and a plurality of conductive bumps is provided. The second chip is stacked on the first chip. The second...
US20120161300 IONIZING RADIATION BLOCKING IN IC CHIP TO REDUCE SOFT ERRORS  
Methods of blocking ionizing radiation to reduce soft errors and resulting IC chips are disclosed. One embodiment includes forming a front end of line (FEOL) for an integrated circuit (IC) chip;...
US20110089542 Area reduction for electrical diode chips  
Using electrical printing technologies to form package level conductor leads for electrical diode circuit, the preferred embodiments of the present invention significantly reduces the areas of...
US20110089541 Area reduction for electrical diode chips  
Using electrical printing technologies to form package level conductor leads for electrical diode circuit, the preferred embodiments of the present invention significantly reduces the areas of...
US20090294930 Semiconductor packages having electromagnetic interference-shielding function, manufacturing method thereof and jig  
The present invention relates to relates to a semiconductor package having a function of shielding electromagnetic interference (EMI), a manufacturing method thereof and a jig, and more...
US20090243053 STRUCTURE FOR REDUCTION OF SOFT ERROR RATES IN INTEGRATED CIRCUITS  
A structure for reduction of soft error rates in integrated circuits. The structure including: a semiconductor substrate; and a stack of one or more wiring levels stacked from a lowermost wiring...
US20090321898 CONFORMAL SHIELDING INTEGRATED CIRCUIT PACKAGE SYSTEM  
An integrated circuit package system includes: providing a substrate with an integrated circuit mounted thereover; mounting a structure, having ground pads, over the integrated circuit;...
US20080315376 Conformal EMI shielding with enhanced reliability  
An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a molded package panel to a process carrier (10) using a...
US20110006408 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF  
A chip package including a shielding layer conformally covering the underlying molding compound for is provided. The shielding layer can smoothly cover the molding compound and over the rounded or...
US20120126382 MAGNETIC SHIELDING FOR MULTI-CHIP MODULE PACKAGING  
A system comprises a plurality of stacked integrated circuit dice, each integrated circuit die comprising at least one circuit, a package enclosing the plurality of dice, and at least two magnetic...
US20130113089 MODULE IC PACKAGE STRUCTURE HAVING A METAL SHIELDING FUNCTION FOR PREVENTING ELECTRICAL MALFUNCTION INDUCED BY SHORT-CIRCUIT  
A module IC package structure having a metal shielding function includes a substrate unit, an electronic unit, a shielding unit, and an insulative unit. The substrate unit includes a substrate...
US20140225237 CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF  
A chip scale package structure includes a chip, a dam unit, a board body, a plurality of first conductors, an encapsulating glue, a plurality of first conductive layers, an isolation layer, and a...
US20100109103 MEMS PACKAGE  
The invention provides a MEMS package including: a MEMS chip including a first surface, a second surface, a first cavity, and a sensing device, the sensing device defining a first end of the first...
US20150069588 RADIATION HARDENED MICROELECTRONIC CHIP PACKAGING TECHNOLOGY  
A novel radiation hardened chip package technology protects microelectronic chips and systems in aviation/space or terrestrial devices against high energy radiation. The proposed technology of a...
US20120028458 ALPHA PARTICLE BLOCKING WIRE STRUCTURE AND METHOD FABRICATING SAME  
An alpha particle blocking structure and method of making the structure. The structure includes: a semiconductor substrate; a set of interlevel dielectric layers stacked from a lowermost...
US20080122047 Collective and synergistic MRAM shields  
Various structures chip packages are disclosed including a magnetoresistive random access memory (“MRAM”) device and a magnetic shield structure. The magnetic shield structure may be made from...
US20080061406 SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC SHIELDING PART  
A semiconductor package includes a semiconductor chip; and an encapsulant for covering the semiconductor chip, such that the encapsulant includes a molding part for covering the semiconductor chip...
US20130221500 System-In-Package with Integrated Socket  
There are disclosed herein various implementations of a system-in-package with integrated socket. In one such implementation, the system-in-package includes a first active die having a first...
US20110215450 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: forming a carrier having a cavity and a carrier top side adjacent to the cavity; mounting an integrated circuit in the...
US20060289970 Magnetic shielding of MRAM chips  
An apparatus comprising a magnetically shielded MRAM chip and a method of manufacturing the same. The apparatus includes an MRAM module and a protective cover. The MRAM module includes a circuit...
US20130207248 DEVICE INCLUDING ELECTRICAL, ELECTRONIC, ELECTROMECHANICAL OR ELECTROOPTICAL COMPONENTS HAVING REDUCED SENSITIVITY AT A LOW DOSE RATE  
A device for a space application, the device including at least one electronic, electromechanical or electro-optical component encapsulated in a package, the package comprising a hydrogen getter...
US20120161266 METHODS AND SYSTEMS OF ISOLATING SEGMENTED RADIATION DETECTORS USING ALUMINA  
Radiation detectors can be made of n-type or p-type silicon. All segmented detectors on p-type silicon and double-sided detectors on n-type silicon require an “inter-segment isolation” to separate...
US20050104165 Semiconductor element, semiconductor device, and method for manufacturing semiconductor element  
A semiconductor chip of the present invention is so arranged that a front face on which an element circuit is formed has electrode pads and a side face and a back face are coated with a shielding...
US20090315156 PACKAGED INTEGRATED CIRCUIT HAVING CONFORMAL ELECTROMAGNETIC SHIELDS AND METHODS TO FORM THE SAME  
Example packaged integrated circuit (IC) chips having conformal electromagnetic shields and methods to form the same are disclosed. A disclosed packaged IC chip comprises an IC attached to a first...
US20090140399 Semiconductor Module with Switching Components and Driver Electronics  
A semiconductor module comprises at least one semiconductor chip having at least one semiconductor switch. The at least one semiconductor chip is arranged on a carrier substrate. At least one...
US20090273062 SEMICONDUCTOR PACKAGE HEAT SPREADER  
A semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing...
US20060055007 Seal ring structure for integrated circuit chips  
A seal ring structure is disclosed for protecting a core circuit region of an integrated circuit chip. The seal ring structure includes a metallization layer, having a bridge sublevel and a plug...
US20120199959 EXTENDED UNDER-BUMP METAL LAYER FOR BLOCKING ALPHA PARTICLES IN A SEMICONDUCTOR DEVICE  
An integrated circuit (IC) has an under-bump metal (UBM) pad disposed between a solder bump and a semiconductor portion of the IC. A UBM layer is disposed between the solder bump and the...
US20120211876 MODULE IC PACKAGE STRUCTURE  
A module IC package structure includes a substrate unit, a radio frequency unit, an inner shielding unit, an insulative package unit, and an outer shielding unit. The substrate unit includes a...
US20090008753 INTEGRATED CIRCUIT WITH INTRA-CHIP AND EXTRA-CHIP RF COMMUNICATION  
An integrated circuit includes a first integrated circuit die having a first circuit and a first intra-chip interface and a second integrated circuit die having a second circuit and a second...
US20090194853 SHIELDED STACKED INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of a shielded stacked integrated circuit packaging system includes forming a first integrated circuit structure having a first substrate and a first integrated circuit die;...
US20100109132 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF  
A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly...
US20120012991 Integrated shielding for a package-on-package system  
An electronic package-on-package system with integrated shielding. The package-on-package system includes a first package having a first die and a second package having a second die and a...
US20090194852 SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING  
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) a grounding element...
US20110101509 Wafer Integrated With Permanent Carrier and Method Therefor  
A semiconductor device has a wafer for supporting the device and a conductive layer formed over a top surface of the wafer. A carrier wafer is permanently bonded over the conductive layer. Within...
US20100207258 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF  
A chip package including at least a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer disposed over the top surface of the laminate substrate can...
US20080001262 Silicon level solution for mitigation of substrate noise  
The techniques described herein reduce the substrate noise current that exists when digital and analog components reside on the same microelectronic die. Single or multiple rows of isolation vias...
US20090302439 Semiconductor Device Having Electrical Devices Mounted to IPD Structure and Method of Shielding Electromagnetic Interference  
A semiconductor device is made by forming an integrated passive device (IPD) structure on a substrate, mounting first and second electrical devices to a first surface of the IPD structure,...
US20110001222 ELECTRONIC DEVICE, LAYERED SUBSTRATE, AND METHODS OF MANUFACTURING SAME  
An electronic device comprises an electronic element package and a mounting substrate on which the electronic element package is mounted. The electronic element package has an LGA electrode. The...
US20120104574 INTEGRATED ANTENNAS IN WAFER LEVEL PACKAGE  
A semiconductor module having one or more integrated antennas in a single package is provided herein to comprise a bonding interconnect structure having a plurality of individual bonding elements...
US20100140760 ALPHA SHIELDING TECHNIQUES AND CONFIGURATIONS  
Embodiments of the present disclosure provide an apparatus including a semiconductor die having a plurality of integrated circuit devices, a pad structure electrically coupled to at least one...
US20090180733 SYSTEM PACKAGE USING FLEXIBLE OPTICAL AND ELECTRICAL WIRING AND SIGNAL PROCESSING METHOD THEREOF  
A system package using flexible optical waveguides and electrical wires, and a signal processing method thereof are disclosed. Several rigid substrates having highly integrated electronic elements...
US20080265421 Structure for Electrostatic Discharge in Embedded Wafer Level Packages  
A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises...
US20050133904 Method of forming metal pattern for hermetic sealing of package  
A method of forming a metal multilayer pattern for hermetic sealing of a package. According to the method, a metal multilayer pattern for hermetic sealing of a package is formed by forming latent...
US20110175211 Method And Structure To Reduce Soft Error Rate Susceptibility In Semiconductor Structures  
A method is disclosed that includes providing a semiconductor substrate having one or more device levels including a number of devices, and forming a number of wiring levels on a top surface of...
US20100213584 ULTRA WIDEBAND HERMETICALLY SEALED SURFACE MOUNT TECHNOLOGY FOR MICROWAVE MONOLITHIC INTEGRATED CIRCUIT PACKAGE  
An ultra wideband hermetically sealed surface mount package for a microwave monolithic integrated circuit (MMIC) is provided including: an integrated circuit; a package body being mounted with the...
US20120267768 FORMATION OF ALPHA PARTICLE SHIELDS IN CHIP PACKAGING  
A structure and system for forming the structure. The structure includes a semiconductor chip and an interposing shield having a top side and a bottom side. The semiconductor chip includes N chip...
US20120112327 Semiconductor Device and Method of Forming Prefabricated EMI Shielding Frame with Cavities Containing Penetrable Material Over Semiconductor Die  
A semiconductor device has a plurality of semiconductor die mounted to a temporary carrier. A prefabricated shielding frame has a plate and integrated bodies extending from the plate. The bodies...

Matches 1 - 50 out of 99 1 2 >