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US20120140929 INTEGRATED CIRCUITS SECURE FROM INVASION AND METHODS OF MANUFACTURING THE SAME  
An integrated circuit device that is secure from invasion and related methods are disclosed herein. Other embodiments are also disclosed herein.
US20140048915 SHIELDING STRUCTURE FOR TRANSMISSION LINES  
A shielding structure for transmission lines comprises first and second comb-like structures defined in a first metallization layer on an integrated circuit, the teeth of each comb-like structure...
US20090200647 SHIELDED INTEGRATED CIRCUIT PAD STRUCTURE  
An integrated circuit pad structure includes a ground strip (206) positioned below a pad (101). In one example a conductive element (102) is coupled to the pad (101), and at least two tiled...
US20090283876 ELECTROMAGNETIC INTERFERENCE SHIELD FOR SEMICONDUCTORS USING A CONTINUOUS OR NEAR-CONTINUOUS PERIPHERAL CONDUCTING SEAL AND A CONDUCTING LID  
A semiconductor package structure including a conductive adhesive material which is used to form an electromagnetic interference shield-forming Faraday cage. The Faraday cage incorporates a module...
US20060192276 Integrated circuit and wireless IC tag  
In a wireless IC tag, on which an integrated circuit and a small antenna are integrally mounted, a radiation-shielding material covers only the integrated circuit (IC chip) portion. Thus, the area...
US20110309482 FINGER SENSOR INCLUDING ENCAPSULATING LAYER OVER SENSING AREA AND RELATED METHODS  
A fingerprint sensor may include a substrate, and a finger sensing IC on the substrate and including a finger sensing area on an upper surface thereof for sensing an adjacent finger. The...
US20080283976 Electromagnetic Shielding Device for an Infrared Receiver  
An electromagnetic shielding device in an infrared receiver comprises of a wiring frame (4) of metal and an electromagnetic shielding cover (1) of metal. There is a window (2) in the...
US20110291248 SHIELDING STRUCTURE FOR TRANSMISSION LINES  
A shielding structure comprises first and second comb-like structures defined in a first metallization layer on an integrated circuit, each comb-like structure comprising a plurality of teeth, the...
US20110204493 SHIELDING STRUCTURE FOR TRANSMISSION LINES  
A shielding structure comprises first and second comb-like structures defined in a first metallization layer on an integrated circuit, each comb-like structure comprising a plurality of teeth, the...
US20100301463 REDUCED SOFT ERROR RATE THROUGH METAL FILL AND PLACEMENT  
A method for reducing single event upsets in an integrated circuit includes the step of providing a plurality of levels within the integrated circuit, wherein the plurality of levels within the...
US20140339688 TECHNIQUES FOR THE CANCELLATION OF CHIP SCALE PACKAGING PARASITIC LOSSES  
The present invention generally relates to techniques and structures that cancel or mitigate RF coupling from the RF circuit to the silicon die. To cancel or mitigate the RF coupling, a conductive...
US20130113088 CHIP PACKAGING STRUCTURE, CHIP PACKAGING METHOD, AND ELECTRONIC DEVICE  
The present invention relates to the field of chip packaging and discloses a chip packaging structure, a chip packaging method, and an electronic device, which are used to solve a problem that in...
US20120086110 IC PACKAGE  
An IC package which can avoid electromagnetic waves leaked from a side surface of the IC package includes: an electric circuit board on which an IC chip is mounted; a first conductive board...
US20120217614 POWER CONVERTOR DEVICE AND CONSTRUCTION METHODS  
In one aspect, the present invention relates generally to integrated circuit (IC) packages and more specific to some embodiments of IC power convertor technologies. In particular, IC packages that...
US20130328178 SHIELDING DEVICE  
One aspect of the invention relates to a shielding device for shielding from electromagnetic radiation, including a shielding base element, a shielding cover element and a shielding lateral...
US20110260302 SHIELDING DEVICE  
One aspect of the invention relates to a shielding device for shielding from electromagnetic radiation, including a shielding base element, a shielding cover element and a shielding lateral...
US20090302438 IC HAVING VOLTAGE REGULATED INTEGRATED FARADAY SHIELD  
An integrated circuit (IC) includes a substrate having a top semiconductor surface and a bottom surface, and integrated circuitry including an analog subcircuit and at least one digital subcircuit...
US20070262422 SHIELDING DEVICE  
One aspect of the invention relates to a shielding device for shielding from electromagnetic radiation, including a shielding base element, a shielding cover element and a shielding lateral...
US20130313692 ANTENNA IN PACKAGE WITH REDUCED ELECTROMAGNETIC INTERACTION WITH ON CHIP ELEMENTS  
A IC package for a wireless device includes an antenna that is attached to the chip. The electrically conductive elements of the antenna are spaced away from the antenna and particularly the...
US20060145119 Field grading material  
A field grading material including a polymeric matrix provided with a filler. The filler includes a field grading effective amount of particles having at least one dimension smaller than or equal...
US20130001596 DEPOSITION OF ESD PROTECTION ON PRINTED CIRCUIT BOARDS  
A method and apparatus for providing electro-static discharge (ESD) protection to light emitting diode (LED) systems on printed circuit boards (PCBs). Protection is provided by ESD diodes...
US20100314726 FARADAY CAGE FOR CIRCUITRY USING SUBSTRATES  
An apparatus and method uses a first Faraday cage portion and a second Faraday cage portion to provide a Faraday cage enclosure surrounding at least one circuit device.
US20120153433 Tuning the Efficiency in the Transmission of Radio-Frequency Signals Using Micro-Bumps  
A device includes a die including a main circuit and a first pad coupled to the main circuit. A work piece including a second pad is bonded to the die. A first plurality of micro-bumps is...
US20140339687 POWER PLANE FOR MULTI-LAYERED SUBSTRATE  
A semiconductor device includes a ground plane and a power plane that lie in spaced, parallel planes. The power plane includes a number of openings formed around its outer edge. A ground ring...
US20090134500 Structures for Preventing Cross-talk Between Through-Silicon Vias and Integrated Circuits  
A semiconductor chip includes a through-silicon via (TSV), a device region, and a cross-talk prevention ring encircling one of the device region and the TSV. The TSV is isolated from substantially...
US20140138803 CHIP ARRANGEMENTS AND METHODS FOR MANUFACTURING A CHIP ARRANGEMENT  
A chip arrangement is provided, the chip arrangement including: a carrier; a chip disposed over the carrier, the chip including one or more contact pads, wherein a first contact pad of the one or...
US20120256305 Integrated Circuit Package Security Fence  
Embodiments of an integrated circuit package security fence are provided. The integrated circuit package includes a substrate, a die, and a security fence coupled to the substrate such that the...
US20130193566 Integrated Circuit Shielding Film and Manufacturing Method Thereof  
An integrated circuit shielding film and a manufacturing method thereof. The manufacturing method provides a plate. A stripping glue is coated on the plate. An integrated circuit is disposed on...
US20110309481 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: fabricating a flip chip integrated circuit die having chip interconnects on an active side; providing a substrate for...
US20130105951 BLOCK POWER SWITCH WITH EMBEDDED ELECTROSTATIC DISCHARGE (ESD) PROTECTION AND ADAPTIVE BODY BIASING  
A block power switch may be embedded with electrostatic discharge (ESD) protection circuitry. A transistor portion of the block power switch may he allocated to act as part of ESD protection...
US20110204495 DEVICE HAVING WIRE BOND AND REDISTRIBUTION LAYER  
A semiconductor device comprises a copper redistribution line, a copper inductor and aluminum wire bond pads and the integration of the resulting device with an integrated circuit on a single...
US20090072357 Integrated shielding process for precision high density module packaging  
An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules (30-33) to a process carrier (10)...
US20140197450 ESD PROTECTION CIRCUIT  
An electrostatic discharge (ESD) protection circuit is coupled between first and second pads to protect an internal circuit therebetween. Under a normal operating condition, a voltage on the first...
US20130127024 INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL  
An integrated circuit chip includes a silicon substrate, a first circuit in or over said silicon substrate, a second circuit device in or over said silicon substrate, a dielectric structure over...
US20150162283 INTEGRATED CIRCUIT SHIELDING TECHNIQUE UTILIZING STACKED DIE TECHNOLOGY INCORPORATING TOP AND BOTTOM NICKEL-IRON ALLOY SHIELDS HAVING A LOW COEFFICIENT OF THERMAL EXPANSION  
An integrated circuit shielding technique utilizing stacked die technology incorporating top and bottom nickel-iron alloy shields having a low coefficient of thermal expansion of especial utility...
US20080265038 Antenna in Package with Reduced Electromagnetic Interaction with on Chip Elements  
A IC package for a wireless device includes an antenna that is attached to the chip. The electrically conductive elements of the antenna are spaced away from the antenna and particularly the...
US20080246126 STACKED AND SHIELDED DIE PACKAGES WITH INTERCONNECTS  
According to an example embodiment, a stacked die package 800 includes a first die (806), first active circuitry (808) disposed on an upper surface of the first die, and a first conductive pattern...
US20140327119 INTEGRATED CIRCUIT HAVING SHIELDING STRUCTURE  
An integrated circuit includes a signal line and a plurality of shielding structures. The signal line is routed along a first direction and is in a first metallization layer. Each shielding...
US20090146270 Embedded Package Security Tamper Mesh  
Systems and methods for embedded tamper mesh protection are provided. The embedded tamper mesh includes a series of protection bond wires surrounding bond wires carrying sensitive signals. The...
US20140061877 WIRING BOARD WITH EMBEDDED DEVICE, BUILT-IN STOPPER AND ELECTROMAGNETIC SHIELDING  
In a preferred embodiment, a wiring board with embedded device, built-in stopper and electromagnetic shielding includes a stopper, a semiconductor device, a stiffener with shielding sidewalls, a...
US20130234303 METAL SHIELD FOR INTEGRATED CIRCUITS  
A metal shield structure is provided for an integrated circuit (IC) having at least a first metal contact coupled to a fixed potential and a second metal contact. A first passivation layer is...
US20050167789 Surface mountable hermetically sealed package  
A high reliability package which includes electrical terminals formed from an alloy of tungsten copper and brazed onto a surface of a ceramic substrate.
US20140048914 WIRING BOARD WITH EMBEDDED DEVICE AND ELECTROMAGNETIC SHIELDING  
In a preferred embodiment, a wiring board with embedded device and electromagnetic shielding includes a shielding frame, a semiconductor device, a stiffener, a first build-up circuitry and a...
US20140167232 SEGMENTED CONDUCTIVE GROUND PLANE FOR RADIO FREQUENCY ISOLATION  
A radio frequency (RF) module comprises an electrical reference, or ground, plane to which one or more RF devices disposed on the module are electrically coupled, and may be disposed beneath the...
US20120175752 DEVICES WITH FARADAY CAGES AND INTERNAL FLEXIBILITY SIPES  
A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal...
US20130119523 PACKAGING STRUCTURE AND METHOD AND ELECTRONIC DEVICE  
A packaging structure includes: a substrate (21), where the substrate (21) is arranged with a grounding end (27) and at least two circuit modules; a shielding separator (24) connected to the...
US20080157296 Package having shield case  
A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a...
US20140048916 WIRING BOARD WITH SHIELDING LID AND SHIELDING SLOTS AS ELECTROMAGNETIC SHIELDS FOR EMBEDDED DEVICE  
In a preferred embodiment, a wiring board with embedded device and electromagnetic shielding includes a semiconductor device, a core layer, a shielding lid, shielding slots and build-up circuitry....
US20090057848 REDISTRIBUTION STRUCTURES FOR MICROFEATURE WORKPIECES  
Microfeature dies with redistribution structures that reduce or eliminate line interference are disclosed. The microfeature dies can include a substrate having a bond site and integrated circuitry...
US20090290320 Structure for blocking an electromagnetic interference, wafer level package and printed circuit board having the same  
A structure for blocking electromagnetic interference (EMI) may include at least one electromagnetic wave inducing member and an electromagnetic wave filtering member. The at least one...