Matches 401 - 422 out of 422 < 1 2 3 4 5 6 7 8 9


Match Document Document Title
US20110241177 Semiconductor wafer including cracking stopper structure and method of forming the same  
A semiconductor includes a semiconductor substrate having a main face, the semiconductor device having a device region and a dicing line and a stack of insulating layers over the semiconductor...
US20110233735 SEMICONDUCTOR WAFER AND ITS MANUFACTURE METHOD, AND SEMICONDUCTOR CHIP  
A semiconductor wafer includes: a first semiconductor chip area formed with a semiconductor element; a second semiconductor chip area formed with a semiconductor element; and a scribe area...
US20110233625 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME  
A semiconductor device includes a semiconductor chip; and a scribe line disposed in an adjacent way to and around the semiconductor chip. The scribe line comprises an interlayer insulating film...
US20110221043 Semiconductor device and manufacturing method therefor  
Provided is a semiconductor device suitable for preventing film peeling due to dicing and preventing abnormal discharge. The semiconductor device includes a scribe region (003) and an IC region...
US20110221042 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME  
A wafer structure (88) includes a device wafer (20) and a cap wafer (60). Semiconductor dies (22) on the device wafer (20) each include a microelectronic device (26) and terminal elements (28,...
US20110221041 Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die  
A plurality of semiconductor die is mounted to a temporary carrier. An encapsulant is deposited over the semiconductor die and carrier. A portion of the encapsulant is designated as a saw street...
US20110210343 SEMICONDUCTOR WAFER  
A semiconductor wafer includes a substrate, a first separating structure and a semiconductor stacked layer structure. The substrate has a first surface. The first separating structure is formed on...
US20110198731 Apparatus and Method for Defining Laser Cleave Alignment  
An apparatus includes a crystalline substrate. A cleaving guide on the substrate is positioned over a cleave plane of the crystalline substrate and positioned in a known location with respect to a...
US20110156220 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE  
A method to prevent contamination of the principal surface side in a process of grinding the back surface side of a semiconductor wafer. At an intersection of a scribe region of a semiconductor...
US20110156219 SEMICONDUCTOR DEVICE  
A semiconductor device is disclosed which can prevent interlayer cracking of interlayer dielectric films while improving the adhesion between the interlayer dielectric films in a dicing process...
US20110147898 METHOD FOR DICING A SEMICONDUCTOR WAFER, A CHIP DICED FROM A SEMICONDUCTOR WAFER, AND AN ARRAY OF CHIPS DICED FROM A SEMICONDUCTOR WAFER  
A method for dicing a semiconductor wafer, including: cutting a reference slot in a back main surface of the wafer; cutting a back slot in the back main surface, the back slot positioned with...
US20110133186 PROCESS FOR MANUFACTURING A SEMICONDUCTOR WAFER HAVING SOI-INSULATED WELLS AND SEMICONDUCTOR WAFER THEREBY MANUFACTURED  
A process for manufacturing a semiconductor wafer including SOI-insulation wells includes forming, in a die region of a semiconductor body, buried cavities and semiconductor structural elements,...
US20110127647 SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME  
A semiconductor device includes a semiconductor substrate having a main surface in which a semiconductor element region where a plurality of functional elements are formed is formed; a multilevel...
US20110121432 Semiconductor Device and Method of Forming Holes In Substrate to Interconnect Top Shield and Ground Shield  
A semiconductor device includes a multi-layer substrate. A ground shield is disposed between layers of the substrate and electrically connected to a ground point. A plurality of semiconductor die...
US20110108957 Semiconductor substrate, semiconductor device and method of manufacturing the same  
A semiconductor substrate (1) includes a plurality of semiconductor elements (2) in which functional elements are constructed and which is formed in a grid pattern, wherein continuous linear...
US20110057297 SEMICONDUCTOR CHIPS HAVING GUARD RINGS AND METHODS OF FABRICATING THE SAME  
Provided is a semiconductor chip. The semiconductor chip includes a semiconductor substrate including a main chip region and a scribe lane region surrounding the main chip region. An insulating...
US20110042781 CHIP PACKAGE AND FABRICATION METHOD THEREOF  
The invention is related to a chip package including: a semiconductor substrate having at least one bonding pad region and at least one device region, wherein the semiconductor substrate includes...
US20110037149 METHOD OF CUTTING A WAFER-LIKE OBJECT AND SEMICONDUCTOR CHIP  
A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work,...
US20110024882 SEMICONDUCTOR DEVICE  
A semiconductor device includes a semiconductor substrate, a diffusion layer conductive film formed on the semiconductor substrate, an interlayer insulating film layered on the semiconductor...
US20110006403 SEMICONDUCTOR DEVICE AND THE METHOD FOR MANUFACTURING THE SAME  
A semiconductor device is disclosed which includes active section 100, edge termination section 110 having a voltage blocking structure and disposed around active section 100, and separation...
US20100308442 SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER AND MANUFACTURING METHOD OF THE SAME  
In a state where an adhesive tape is attached onto a main surface of a semiconductor wafer, a trench is formed in a rear surface of the semiconductor wafer. For forming the trench in the rear...
US20100301459 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE  
The warpage of a semiconductor wafer or a semiconductor chip is inhibited. A method includes a step of successively forming, pads formed over the main surface of the semiconductor chip, an...

Matches 401 - 422 out of 422 < 1 2 3 4 5 6 7 8 9