Matches 351 - 400 out of 422 < 1 2 3 4 5 6 7 8 9 >


Match Document Document Title
US20140239455 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFER  
To improve reliability of a semiconductor device obtained through a dicing step. In a ring region, a first outer ring is provided outside a seal ring, and a second outer ring is provided outside...
US20140225230 SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME  
Provided are semiconductor packages and methods of forming the same. A sidewall of a semiconductor chip in the package is exposed. Thus, the package has a size substantially equal to that of a...
US20140217558 SEMICONDUCTOR ELEMENT  
A semiconductor element includes a substrate and a semiconductor layer. The substrate has a first main face and a second main face. The semiconductor layer is formed on a side of one of the first...
US20140217556 METHODS FOR DICING A COMPOUND SEMICONDUCTOR WAFER, AND DICED WAFERS AND DIE OBTAINED THEREBY  
Methods are provided for using masking techniques and plasma etching techniques to dice a compound semiconductor wafer into dies. Using these methods allows compound semiconductor die to be...
US20140210056 SEMICONDUCTOR DEVICE  
A seal ring structure is formed through a multilayer structure of a plurality of dielectric films in a peripheral part of a chip region to surround the chip region. A dual damascene interconnect...
US20140203411 PRODUCTION METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, AND SEMICONDUCTOR DEVICE  
A semiconductor wafer, includes: a plurality of element regions; a surface electrode that is disposed in each of the plurality of element regions; an insulating layer that is disposed in each of...
US20140183704 SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, AND SEMICONDUCTOR DEVICE  
A method of manufacturing a semiconductor device including a semiconductor substrate having first and second surfaces and a peripheral edge, the first and second surfaces being opposite to each...
US20140091437 CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME  
A package includes a semiconductor device including an active surface having a contact pad. A redistribution layer (RDL) structure includes a first post-passivation interconnection (PPI) line...
US20140070374 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE  
There is provided a method of fabricating a semiconductor device, method including: a) forming semiconductor elements in plural element regions surrounded by assumed dicing lines on a first...
US20140061865 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE  
There is provided a semiconductor device including a semiconductor layer, a protective layer including a transparent material, and a transparent resin layer that seals a gap between the...
US20140061864 SEMICONDUCTOR SUBSTRATE HAVING CRACK PREVENTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME  
Disclosed herein is a semiconductor substrate having a crack preventing structure, the semiconductor substrate including: a plurality of wiring layers and a plurality of insulating layers...
US20140054749 SEMICONDUCTOR DEVICE  
The present invention provides a technique for improving the reliability of a semiconductor device where spreading of cracking that occurs at the time of dicing to a seal ring can be restricted...
US20140015113 Laser Processing Method and Semiconductor Device  
A laser processing method which can reliably form a modified region within an object to be processed along a desirable part in a line to cut is provided. This laser processing method irradiates a...
US20140015112 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR SUBSTRATE  
A method for manufacturing a semiconductor device includes forming at least one stripe-shaped protection film over a multilayer film in a scribe region of a semiconductor substrate having a...
US20140015111 CHIP PACKAGE AND METHOD FOR FORMING THE SAME  
An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and an opposite second surface; a device region disposed in the substrate; a...
US20140015110 SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME  
A semiconductor device includes a plurality of semiconductor chips connected through a scribe lane; a plurality of through electrodes formed in each of the plurality of semiconductor chips; a heat...
US20140008768 SEMICONDUCTOR WAFER AND MANUFACTURING METHOD THEREOF  
A semiconductor wafer having sag formed at an outer periphery at the time of polishing, wherein a displacement of the semiconductor wafer in a thickness direction is 100 nm or less between a...
US20130299948 SEMICONDUCTOR DEVICE  
A seal ring structure is formed through a multilayer structure of a plurality of dielectric films in a peripheral part of a chip region to surround the chip region. A dual damascene interconnect...
US20130256839 SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE  
A semiconductor wafer may include: a disk-shaped wafer body made of silicon; and an identification trench section having at least one trench and provided at a periphery section of the wafer body,...
US20130249061 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND SUBSTRATE  
According to an embodiment, a semiconductor device includes a substrate provided with a first region including an active element, the substrate including a second region containing boron with a...
US20130221493 SEMICONDUCTOR PACKAGE  
Semiconductor packages are disclosed. A semiconductor package includes: a first chip that includes a chip region and scribe regions at edges of the chip region, wherein the chip region comprises...
US20130168831 LASER BEAM MACHINING METHOD AND SEMICONDUCTOR CHIP  
An object to be processed 1 comprising a substrate 4 and a plurality of functional devices 15 formed on a front face 3 of the substrate 4 is irradiated with laser light L while locating a...
US20130161795 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, PROCESSING METHOD OF SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER  
A disclosed method of manufacturing a semiconductor device includes forming a groove on a first surface of a semiconductor wafer along an outer periphery of the semiconductor wafer, forming a...
US20130147019 Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die  
A plurality of semiconductor die is mounted to a temporary carrier. An encapsulant is deposited over the semiconductor die and carrier. A portion of the encapsulant is designated as a saw street...
US20130127018 Semiconductor Device and Method of Forming Reconstituted Wafer with Larger Carrier to Achieve More EWLB Packages per Wafer with Encapsulant Deposited Under Temperature and Pressure  
A semiconductor wafer has a plurality of semiconductor die distributed over a surface area. The semiconductor die are singulated from the semiconductor wafer. The semiconductor die are mounted to...
US20130105949 LAMINATED SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME  
In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines....
US20130087891 SEMICONDUCTOR CHIP AND FABRICATING METHOD THEREOF  
Disclosed is a method of fabricating a semiconductor chip. The method includes forming a silicon layer; forming a first layer formed on the silicon layer and including a first seal ring...
US20130069206 SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE  
A semiconductor device includes wiring layers formed over a semiconductor wafer, a via-layer between the wiring layers, conductive films in the wiring layers, and a via-plug in the via-layer...
US20130069205 SEMICONDUCTOR WAFER AND PROCESSING METHOD THEREFOR  
A semiconductor wafer and a method which are capable of reducing chippings or cracks generated during the die sawing process. The semiconductor wafer comprises a plurality of dies formed on the...
US20130043566 SEMICONDUCTOR DEVICE AND FLIP-CHIP PACKAGE  
A semiconductor device includes a substrate having a circuit formation region, an interlayer insulating film formed on the substrate, a first seal ring formed in the interlayer insulating film to...
US20130009285 SEMICONDUCTOR CHIP AND SEMICONDUCTOR WAFER  
A semiconductor wafer includes at least one chip formed on a substrate, and a scribe line region surrounding the chip. The chip includes a device formation region, and a chip boundary region...
US20130009284 SUBSTRATE DIVIDING METHOD  
A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a...
US20120326280 LAMINATED FILM AND USE THEREOF  
Provided is a laminated film wherein the space between semiconductor elements that are three-dimensionally mounted can be filled easily and securely. The laminated film of the present invention is...
US20120306056 Semiconductor wafer and method of producing the same  
A semiconductor wafer (100) having a regular pattern of predetermined separation lanes (102) is provided, wherein the predetermined separation lanes (102) are configured in such a way that the...
US20120286398 SEMICONDUCTOR CHIP MODULE AND PLANAR STACK PACKAGE HAVING THE SAME  
A semiconductor chip module includes a chip unit including at least two semiconductor chips disposed with a scribe lane interposed therebetween and each of which has a first surface on which...
US20120242402 SEMICONDUCTOR DEVICE AND WAFER  
A semiconductor device has a semiconductor substrate. The semiconductor device has a plurality of LSI regions that are formed on the semiconductor substrate and are provided with a first power...
US20120187544 SEMICONDUCTOR APPARATUS HAVING PENETRATION ELECTRODE AND METHOD FOR MANUFACTURING THE SAME  
According to one embodiment, in a semiconductor apparatus, a semiconductor substrate has a first surface and a second surface opposite to the first surface. A semiconductor device is formed in a...
US20120181671 METHOD FOR EVALUATING IMPURITY DISTRIBUTION UNDER GATE ELECTRODE WITHOUT DAMAGING SILICON SUBSTRATE  
A method of manufacturing a semiconductor device forms the semiconductor device in a device region of a semiconductor substrate simultaneously with forming a monitor semiconductor device that...
US20120056310 SEMICONDUCTOR DEVICE AND METHOD FOR INCREASING SEMICONDUCTOR DEVICE EFFECTIVE OPERATION AERA  
A method for increasing semiconductor device effective operation area, comprising following steps: depositing first conductive layer on the substrate; using laser for scribing a plurality of the...
US20120025355 LAMINATED SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME  
In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines....
US20120025354 LAMINATED SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME  
In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines....
US20110316123 Laminated semiconductor substrate, laminated chip package and method of manufacturing the same  
In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines....
US20110304024 VERTICAL CONDUCTIVE CONNECTIONS IN SEMICONDUCTOR SUBSTRATES  
An embodiment of a die comprising: a semiconductor body including a front side, a back side, and a lateral surface; an electronic device, formed in said semiconductor body and including an active...
US20110298096 Semiconductor chip  
A semiconductor wafer 10 has a plurality of semiconductor chip areas 10a and a scribe area 10b, each of the semiconductor chip areas 10a having semiconductor elements and electrode pads (electrode...
US20110298095 PASSIVATION LAYER EXTENSION TO CHIP EDGE  
Embodiments of the invention provide a semiconductor chip having a passivation layer extending along a surface of a semiconductor substrate to an edge of the semiconductor substrate, and methods...
US20110272790 SEMICONDUCTOR CHIP AND SEMICONDUCTOR WAFER  
A semiconductor wafer includes at least one chip formed on a substrate, and a scribe line region surrounding the chip. The chip includes a device formation region, and a chip boundary region...
US20110272692 SIZE VARIABLE TYPE SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE USING THE SAME  
A size variable semiconductor chip includes a semiconductor chip area formed with a circuit layer and at least one cutting area extending parallel to at least one side of the semiconductor chip...
US20110266657 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME  
A semiconductor device wherein destruction of a sealing ring caused by cracking of an interlayer dielectric film is difficult to occur, as well as a method for manufacturing the semiconductor...
US20110254136 SEMICONDUCTOR DEVICE  
A seal ring structure is formed through a multilayer structure of a plurality of dielectric films in a peripheral part of a chip region to surround the chip region. A dual damascene interconnect...
US20110241178 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME  
An organic protective film 23′ is formed on the periphery of a chip region 12 on a substrate 11 so as to continuously surround the internal part of the chip region 12. A passivation film 22 and an...

Matches 351 - 400 out of 422 < 1 2 3 4 5 6 7 8 9 >