Matches 301 - 350 out of 422 < 1 2 3 4 5 6 7 8 9 >


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US20160079121 PERFORATION OF FILMS FOR SEPARATION  
A method for separation of semiconductor device cell units from fabricated large-area cell units, together with a corresponding tile unit structure, are provided in which the tile unit is cut...
US20160079117 Sacrificial Carrier Dicing of Semiconductor Wafers  
Mechanisms are provided for sacrificial carrier dicing of semiconductor wafers. A bottom layer of a semiconductor wafer is bonded to a top layer of a sacrificial carrier. The semiconductor wafer...
US20160071767 METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP AND CIRCUIT BOARD AND ELECTRONIC APPARATUS INCLUDING SEMICONDUCTOR CHIP  
A method for manufacturing a semiconductor chip includes forming at least a portion of a front-side groove by anisotropic dry etching from a front surface of a substrate along a cutting region;...
US20160064338 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME  
A semiconductor device includes a substrate comprising a front surface, side surfaces, a back surface, and a recessed edge between the side surfaces and either the front surface or the back...
US20160049348 SEMICONDUCTOR BORDER PROTECTION SEALANT  
A semiconductor package includes a semiconductor unit containing an active circuitry layer. The semiconductor package also includes a plurality of bonding pads on the active circuitry layer, which...
US20160049333 DESIGN METHOD OF TIP SHAPE OF CUTTING MEMBER, SEMICONDUCTOR CHIP MANUFACTURING METHOD, CIRCUIT BOARD, AND ELECTRONIC APPARATUS  
A design method includes a process of preparing plural cutting members having different degrees of taper in a tip portion thereof, a process of preparing plural grooves on a front surface side...
US20160035828 COMPOUND SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SAME, AND RESIN-SEALED TYPE SEMICONDUCTOR DEVICE  
In a semiconductor element having a compound semiconductor layer epitaxially grown on a silicon substrate, an object is to suppress generation of deficiency or problems of reliability deriving...
US20160035577 MULTI-LAYER MASK INCLUDING NON-PHOTODEFINABLE LASER ENERGY ABSORBING LAYER FOR SUBSTRATE DICING BY LASER AND PLASMA ETCH  
Methods of dicing substrates having a plurality of ICs. A method includes forming a multi-layered mask comprising a laser energy absorbing, non-photodefinable topcoat disposed over a water-soluble...
US20160035560 Carrier System For Processing Semiconductor Substrates, and Methods Thereof  
In accordance with an alternative embodiment of the present invention, a method for forming a semiconductor device includes applying a paste over a semiconductor substrate, and forming a ceramic...
US20160027744 METHOD OF FORMING AN INTEGRATED CRACKSTOP  
A method including forming a first dielectric layer above a conductive pad and above a metallic structure, the conductive pad and the metallic structure are each located within an interconnect...
US20160027742 PORTABLE APPARATUS, IC PACKAGING STRUCTURE, IC PACKAGING OBJECT, AND IC PACKAGING METHOD THEREOF  
A portable apparatus, an IC packaging structure, an IC packaging object, and an IC packaging method thereof are disclosed. The IC packaging structure includes an IC packaging object and a...
US20160013615 LASER SUBMOUNTS FORMED USING ETCHING PROCESS  
A wafer is formed having a plurality of laser-to-slider submount features on a first surface. An etching process is used to form scribe lines between the submounts on the first surface of the...
US20160005655 METHOD OF FORMING A SEMICONDUCTOR DIE  
In one embodiment, semiconductor die having non-rectangular shapes and die having various different shapes are formed and singulated from a semiconductor wafer.
US20150372045 Backside Illumination Image Sensor Chips and Methods for Forming the Same  
A die includes a first plurality of edges, and a semiconductor substrate in the die. The semiconductor substrate includes a first portion including a second plurality of edges misaligned with...
US20150371966 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD  
A semiconductor device according to the present invention includes a mount substrate, an adhesive applied to the mount substrate, and a device having its lower surface bonded to the mount...
US20150371957 DIE EDGE SEAL EMPLOYING LOW-K DIELECTRIC MATERIAL  
A semiconductor wafer has a multi-stage structure that damps and contains nascent cracks generated during dicing and inhibits moisture penetration into the active region of a die. The wafer...
US20150371902 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR DEVICE  
A method of manufacturing a semiconductor device includes the steps of preparing a semiconductor substrate including a semiconductor layer having a first main surface and a second main surface...
US20150364514 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND STRUCTURE  
A method of manufacturing a semiconductor device is provided. The method includes forming a passivation film on a substrate including a plurality of element regions and a scribe region, forming a...
US20150364510 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND STRUCTURE  
A method of manufacturing a semiconductor device is provided. The method includes forming a passivation film on a substrate including a first element region, a second element region adjacent to...
US20150364376 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF  
A semiconductor device includes a substrate and a bump. The substrate includes a first surface and a second surface. A notch is at the second surface and at a sidewall of the substrate. A depth of...
US20150364374 Semiconductor Device Die Singulation by Discontinuous Laser Scribe and Break  
A method for singulating a semiconductor device dies from a wafer, and a singulated semiconductor device die is disclosed. In one embodiment, the method includes forming a plurality of recesses in...
US20150325531 THROUGH CRACK STOP VIA  
A semiconductor device includes an active inner region and a crack stop region. The active inner region includes a semiconductor substrate, an integrated circuit (IC) device layer formed upon the...
US20150311166 SEMICONDUCTOR DEVICE AND LAYOUT DESIGN SYSTEM  
In a semiconductor device including a seal ring area containing multiple seal rings are coupled to each other at equal intervals via bridge patterns, improper local relocation of bridge patterns...
US20150303112 METHOD FOR SINGULATING AN ASSEMBLAGE INTO SEMICONDUCTOR CHIPS, AND SEMICONDUCTOR CHIP  
A method for singulating an assemblage (1) into a plurality of semiconductor chips (10) is specified, wherein an assemblage comprising a carrier (4), a semiconductor layer sequence (2) and a...
US20150294954 MULTIPLE DIE LAYOUT FOR FACILITATING THE COMBINING OF AN INDIVIDUAL DIE INOTO A SINGLE DIE  
An apparatus includes a wafer portion and a plurality of die fabricated in the wafer portion in a defined pattern such that the die are separated from each other by a dicing area or a street. The...
US20150287639 SEMICONDUCTOR CHIP, BOARD HAVING THE SAME MOUNTED THEREON, AND METHOD OF CUTTING SEMICONDUCTOR WAFER  
A semiconductor chip may include: a semiconductor body having scribe lines formed in both end surfaces thereof; and a metal layer formed on a lower surface of the semiconductor body and the scribe...
US20150270228 CRACK-STOPPING STRUCTURE AND METHOD FOR FORMING THE SAME  
A crack-stopping structure includes a semiconductor wafer comprising a plurality of dies defined by a plurality of scribe line regions, a plurality of metal patterns formed in the scribe line...
US20150262942 Semiconductor Workpiece Having a Semiconductor Substrate with at Least Two Chip Areas  
A semiconductor workpiece includes a semiconductor substrate, at least two chip areas, components of semiconductor devices being formed in the semiconductor substrate in the at least two chip...
US20150228620 BUNDLED MEMORY AND MANUFACTURE METHOD FOR A BUNDLED MEMORY WITH AN EXTERNAL INPUT/OUTPUT BUS  
A bundled memory includes a substrate, a first memory die, a second memory die, a scribe line, and an electrical connection. The first memory die has a first input/output bus, and the second...
US20150206817 CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME  
A package comprises a semiconductor device. The semiconductor device comprises an active surface and side surfaces. The active surface has a contact pad. The package also comprises a mold covering...
US20150194391 SEMICONDUCTOR DEVICE  
A seal ring structure is formed through a multilayer structure of a plurality of dielectric films in a peripheral part of a chip region to surround the chip region. A dual damascene interconnect...
US20150170985 Semiconductor Wafer And Semiconductor Die  
A semiconductor wafer includes a substrate, an integrated circuit and a die seal ring structure. The substrate is with a die region, a die seal ring region surrounding the die region and a scribe...
US20150162284 SEMICONDUCTOR DEVICE  
To improve reliability of a semiconductor device obtained through a dicing step. In a ring region, a first outer ring is provided outside a seal ring, and a second outer ring is provided outside...
US20150137322 Semiconductor Device and Method of Forming WLCSP Using Wafer Sections Containing Multiple Die  
A semiconductor wafer contains semiconductor die separated by saw streets. The semiconductor wafer is singulated through a portion of the saw streets to form wafer sections each having multiple...
US20150130028 METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND SEMICONDUCTOR DEVICE  
A method of manufacturing a semiconductor chip according to an embodiment includes forming on a semiconductor substrate a plurality of etching masks each including a protection film to demarcate a...
US20150115411 SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME  
A method of producing a semiconductor device includes forming an insulating film on a substrate on which a semiconductor layer is formed; removing a part of the insulating film by etching to form...
US20150108612 METHOD FOR THINNING, METALIZING, AND DICING A SEMICONDUCTOR WAFER, AND SEMICONDUCTOR DEVICE MADE USING THE METHOD  
There is provided a method of fabricating a semiconductor device, method including: a) forming semiconductor elements in plural element regions surrounded by assumed dicing lines on a first...
US20150097272 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF  
A semiconductor device includes a carrier, several dies disposed on a surface of the carrier and several scribing lines defined on the surface of the carrier. The scribing lines include several...
US20150035125 SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE  
A semiconductor device includes wiring layers formed over a semiconductor wafer, a via-layer between the wiring layers, conductive films in the wiring layers, and a via-plug in the via-layer...
US20150004752 SEMICONDUCTOR PACKAGE, SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF  
A semiconductor package is disclosed, which includes: a packaging substrate; a semiconductor element disposed on the packaging substrate in a flip-chip manner; a stopping portion formed at edges...
US20140367836 SEMICONDUCTOR APPARATUS AND SUBSTRATE  
A semiconductor apparatus includes a semiconductor substrate having a main surface, a multilayer structure circuit formed over the main surface of the semiconductor substrate, a protective wall...
US20140367835 Die Seal Ring and Method of Forming the Same  
A die seal ring is provided. The die seal ring includes a substrate and a first layer extruding from the substrate. The first layer has a first fin ring structure and a layout of the first fin...
US20140346641 WAFER DICING WITH WIDE KERF BY LASER SCRIBING AND PLASMA ETCHING HYBRID APPROACH  
Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, approaches for wafer dicing with wide kerf by using a laser scribing and...
US20140339683 Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die  
A plurality of semiconductor die is mounted to a temporary carrier. An encapsulant is deposited over the semiconductor die and carrier. A portion of the encapsulant is designated as a saw street...
US20140339682 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE  
Provided are a semiconductor device in which abrasive grain marks are formed in a surface of a semiconductor substrate, a dopant diffusion region has a portion extending in a direction which forms...
US20140291814 INSULATING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE  
An insulating substrate includes: a transparent insulating layer; a first metal layer that is provided on a first face of the transparent insulating layer; and a second metal layer that is...
US20140273401 SUBSTRATE LASER DICING MASK INCLUDING LASER ENERGY ABSORBING WATER-SOLUBLE FILM  
Methods of dicing substrates having a plurality of ICs. A method includes forming a mask comprising a laser energy absorbing material layer soluble in water over the semiconductor substrate. The...
US20140264716 SEMICONDUCTOR WAFER, SEMICONDUCTOR PROCESS AND SEMICONDUCTOR PACKAGE  
The present invention provides a semiconductor wafer, semiconductor package and semiconductor process. The semiconductor wafer includes a substrate, at least one metal segment and a plurality of...
US20140264368 Semiconductor Wafer and a Process of Forming the Same  
A semiconductor wafer can include a substrate, a poly template layer, and a semiconductor layer. The substrate has a central region and an edge region, the poly template layer is disposed along a...
US20140239456 SEMICONDUCTOR WAFER AND ITS MANUFACTURE METHOD, AND SEMICONDUCTOR CHIP  
A semiconductor wafer includes: a first semiconductor chip area formed with a semiconductor element; a second semiconductor chip area formed with a semiconductor element; and a scribe area...

Matches 301 - 350 out of 422 < 1 2 3 4 5 6 7 8 9 >