Matches 201 - 250 out of 422 < 1 2 3 4 5 6 7 8 9 >


Match Document Document Title
US20120235284 FILM-LIKE WAFER MOLD MATERIAL, MOLDED WAFER, AND SEMICONDUCTOR DEVICE  
A film-like wafer mold material for molding a wafer in a lump, the material including a multilayer structure constituted of at least a first film layer and a second film layer provided on the...
US20120056309 SEMICONDUCTOR DEVICE WITH REDUCED HEAT-INDUCED LOSS  
A semiconductor device which is capable of reducing a heat-induced loss includes a substrate and a circuit element disposed on the substrate. The substrate is of a rectangular shape with beveled...
US20090212399 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME  
An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a...
US20060087007 Wafer treating apparatus and method  
A wafer treating apparatus includes a support for supporting a plate-like base, a heating mechanism for heating the base placed on the support, a first coating mechanism for coating a fixing...
US20100283128 Dicing Structures for Semiconductor Substrates and Methods of Fabrication Thereof  
Dicing structures for semiconductor substrates and methods of fabrication thereof are described. In one embodiment, a semiconductor wafer includes a first chip disposed in a substrate, a second...
US20100096730 PASSIVATION TECHNIQUE  
A method of semiconductor wafer fabrication. The wafer is fabricated by receiving a semiconductor wafer having a substrate layer and at least one processed layer, cutting a trench into the wafer,...
US20080283971 Semiconductor Device and Its Fabrication Method  
A semiconductor device and a fabrication method thereof are disclosed. The method includes attaching a wafer with a plurality of chips on a carrier board having an insulating layer, a plurality of...
US20150091138 Die Seal Layout for VFTL Dual Damascene in a Semiconductor Device  
A semiconductor may include several vias located in an active region and a die seal region. In the active region, a photoresist can be patterned with openings corresponding to the vias. In the die...
US20140312465 Die Seal Layout for VFTL Dual Damascene in a Semiconductor Device  
A semiconductor may include several vias located in an active region and a die seal region. In the active region, a photoresist can be patterned with openings corresponding to the vias. In the die...
US20140284771 Method for Manufacturing a Plurality of Chips  
A method for manufacturing a plurality of chips comprises the step of providing a wafer comprising a plurality of chip areas separated by one or more dicing lines, wherein the chip areas are...
US20140084426 SUBSTRATE MEMBER AND METHOD OF MANUFACTURING CHIP  
A substrate member includes a substrate and a plurality of chip regions formed on the substrate across a scribe line. Each of the plurality of chip regions includes a first region that has contact...
US20130307124 METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC APPARATUS  
A method for manufacturing an electronic component includes mounting a vibrating element on each singulation region of a base substrate, joining the surface of a lid substrate where grooves are...
US20120068312 ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE  
An adhesive sheet comprising a release substrate 10, a substrate film 14, and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14, wherein an annular...
US20110127631 SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGING ELEMENT, AND SEMICONDUCTOR DEVICE  
A solid-state imaging device includes a semiconductor substrate configured to include a solid-state imaging element that is provided with a photoelectric conversion region, and a scribe line...
US20110084364 WAFER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE  
In a wafer, a first chip region and a second chip region are separated from each other by a dicing region. The dicing region includes: a first center region; a first intermediate region located on...
US20100207250 Semiconductor Chip with Protective Scribe Structure  
Apparatus and methods pertaining to die scribe structures are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating an active region of a semiconductor die so...
US20090283870 Semiconductor Device and Method of Conforming Conductive Vias Between Insulating Layers in Saw Streets  
A semiconductor device is made by disposing a plurality of semiconductor die on a carrier and creating a gap between each of the semiconductor die. A first insulating material is deposited in the...
US20090001521 Semiconductor wafer  
A semiconductor wafer includes an insulation substrate with transparency; a silicon semiconductor layer formed on the insulation substrate; a chip forming area defined on the silicon semiconductor...
US20080211063 Semiconductor wafer and manufacturing method of semiconductor device  
A semiconductor wafer includes a semiconductor substrate, a semiconductor layer, and an oxide layer. The semiconductor layer is disposed on a surface of the semiconductor substrate and has a...
US20080197455 Semiconductor device and manufacturing method therefor  
A semiconductor device having a rectangular exterior appearance includes a substrate for arranging an integrated circuit on the surface thereof, at least one rewire electrically connected to the...
US20080179710 SEMICONDUCTOR WAFER WITH IMPROVED CRACK PROTECTION  
A method of manufacturing a semiconductor wafer for dicing includes providing a semiconductor wafer including a substrate and a plurality of upper layers on the substrate that form a formation of...
US20150108611 SEMICONDUCTOR INTEGRATED DEVICE FOR DISPLAY DRIVE  
In a display drive IC chip of an LCD or the like, an alignment mark is arranged in an alignment mark arrangement region on the main surface thereof, a dummy pattern is arranged on a lower layer,...
US20150084164 SEMICONDUCTOR DEVICE  
The present disclosure provides a technique for improving the reliability of a semiconductor device where spreading of cracking that occurs at the time of dicing to a seal ring can be restricted...
US20140264770 METHOD OF FORMING THROUGH SUBSTRATE VIAS (TSVS) AND SINGULATING AND RELEASING DIE HAVING THE TSVS FROM A MECHANICAL SUPPORT SUBSTRATE  
Accessing a workpiece object in semiconductor processing is disclosed. The workpiece object includes a mechanical support substrate, a release layer over the mechanical support substrate, and an...
US20140203410 DIE EDGE SEALING STRUCTURES AND RELATED FABRICATION METHODS  
Die structures for electronic devices and related fabrication methods are provided. An exemplary die structure includes a diced portion of a semiconductor substrate that includes a device region...
US20130341764 METHOD FOR MANUFACTURING A DIODE, AND A DIODE  
In a method for manufacturing a diode, a semiconductor crystal wafer is used to produce a p-n or n-p junction, which extends in planar fashion across the top side of a semiconductor crystal wafer....
US20130256840 Semiconductor Device and Method of Forming Protective Coating Material Over Semiconductor Wafer to Reduce Lamination Tape Residue  
A semiconductor device has a build-up interconnect structure formed over an active surface of a semiconductor wafer containing a plurality of semiconductor die separated by a saw street. An...
US20130181329 SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE  
A semiconductor device includes: a substrate in which a product region and scribe regions are defined; a 1st insulation film formed above the substrate; a metal film in the 1st insulation film,...
US20130113083 RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD THEREOF  
A resin composition which can be formed into a film for use in molding a large diameter thin film wafer is provided. The composition comprises components (A) a silicone resin containing repeating...
US20120286399 LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE  
In one embodiment, a method is provided for packaging a semiconductor die. A leadframe having a die-pad and one or more lead-pads is placed (502) on an assembly surface. The die-pad has a base...
US20120181670 SEMICONDUCTOR DEVICE HAVING SEAL WIRING  
A semiconductor device includes: an interlayer insulating film formed on a substrate; a wiring formed in the interlayer insulating film in a chip region of the substrate; a seal ring formed in the...
US20120119334 LASER MACHINING METHOD AND CHIP  
While reliably cutting an object to be processed, the strength of the resulting chips is improved. An object to be processed 1 is irradiated with laser light L, so as to form modified regions 17,...
US20110304025 NITRIDE COMPOUND SEMICONDUCTOR ELEMENT AND PRODUCTION METHOD THEREFOR  
A nitride compound semiconductor element according to the present invention is a nitride compound semiconductor element including a substrate 1 having an upper face and a lower face and a...
US20110266656 Semiconductor Device and Method of Forming Protective Coating Material Over Semiconductor Wafer to Reduce Lamination Tape Residue  
A semiconductor device has a build-up interconnect structure formed over an active surface of a semiconductor wafer containing a plurality of semiconductor die separated by a saw street. An...
US20110140214 PATTERN ARRANGEMENT METHOD, SILICON WAFER AND SEMICONDUCTOR DEVICE  
A pattern arrangement method including using a stepper to arrange a plurality of chip patterns arranged parallel to a first direction and a second direction on a silicon wafer using a reticule...
US20110068435 Semiconductor Chip with Crack Deflection Structure  
Various die crack deflection structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating a semiconductor chip including...
US20100283129 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME  
An upper surface of a semiconductor substrate includes a first portion where a dielectric film is provided, and a second portion where the dielectric film is not provided, wherein the second...
US20100283127 METHOD FOR PACKING SEMICONDUCTOR COMPONENTS AND PRODUCT PRODUCED ACCORDING TO THE METHOD  
A method for packing semiconductor components is provided, in which a first side of a first wafer is connected to at least one further wafer, wherein at least one of the wafers has a plurality a...
US20100270656 Semiconductor Device and Method of Forming Conductive Pillars in Recessed Region of Peripheral Area Around the Device for Electrical Interconnection to Other Devices  
A semiconductor wafer contains a plurality of semiconductor die each having a peripheral area around the die. A first insulating layer is formed over the die. A recessed region with angled...
US20100252916 STRUCTURE FOR IMPROVING DIE SAW QUALITY  
A semiconductor device is provided that includes a semiconductor substrate, a plurality of dies formed on the semiconductor substrate, the plurality of dies being separated from one another by a...
US20100207252 Manufacturing method of semiconductor device  
An adhesive layer of which thickness is over 25 μm and a dicing tape are laminated on a rear surface of a semiconductor wafer. The semiconductor wafer is cut together with a part of the adhesive...
US20100200959 SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE, SEMICONDUCTOR PLATE AND METHOD OF MANUFACTURING THE SAME  
A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: insulating layers formed in the plurality of groove portions; a...
US20100181650 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE  
With a general wafer level package process, in order to prevent corrosion of an aluminum type pad electrode in a scribe region in a plating process, the pad electrode is covered with a pad...
US20100164053 SEMICONDUCTOR DEVICE  
A semiconductor device includes a semiconductor wafer in which semiconductor chip forming regions and a scribe region located between the semiconductor chip forming regions are formed, a plurality...
US20100155582 SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD OF THE SAME, ELECTRONIC EQUIPMENT, AND SEMICONDUCTOR DEVICE  
A solid-state imaging device includes: a photodiode formed to be segmented with respect to each pixel in a pixel area in which plural pixels are integrated on a light receiving surface of a...
US20100148315 SEMICONDUCTOR WAFER AND A METHOD OF SEPARATING THE SAME  
A semiconductor wafer includes a plurality of predetermined separation lines extending from an upper surface to a bottom surface; and a semiconductor substrate including a plurality of chip...
US20100148314 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACURING THE SAME  
The present invention provides a semiconductor device and a method for manufacturing the same capable of inhibiting plasma damage. A semiconductor device according to one embodiment includes a...
US20100148313 SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME  
Disclosed herein is a semiconductor apparatus, wherein a technique for manufacturing one semiconductor region by dividing the one semiconductor region into a plurality of divisional regions in...
US20100140747 Semiconductor devices  
In a method of manufacturing a semiconductor device, a pad including at least one insulating interlayer and at least one conductive wiring may be formed in a pad area of a substrate. At least one...
US20100127357 SEMICONDUCTOR DEVICE  
A semiconductor device includes a seal ring formed on an outer circumference of an element forming region when seen from the top in a multilayer interconnect structure formed on a silicon layer,...

Matches 201 - 250 out of 422 < 1 2 3 4 5 6 7 8 9 >