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US20130026466 TESTING ARCHITECTURE OF CIRCUITS INTEGRATED ON A WAFER  
An embodiment of a testing architecture of integrated circuits on a wafer is described of the type including at least one first circuit of a structure TEG realized in a scribe line providing...
US20050269666 Electrical fuses as programmable data storage  
An electrical fuse is disclosed. It is formed by a silicide layer on a polysilicon layer, with a first dielectric section separating the electrical fuse from a semiconductor substrate and a second...
US20090273053 SEMICONDUCTOR DEVICE INCLUDING ANALOG CIRCUITRY HAVING A PLURALITY OF DEVICES OF REDUCED MISMATCH  
In an analog circuit portion, a systematic mismatch between a plurality of circuit elements may be reduced in view of a technology gradient by appropriately positioning the unit devices of the...
US20110156203 INTEGRATED PASSIVE DEVICE ASSEMBLY  
There is provided an integrated passive device assembly. An integrated passive device assembly according to an aspect of the invention may include: a board having a wiring pattern provided...
US20140183690 Guard Ring Design for Maintaining Signal Integrity  
A structure includes a metal feature, and a passivation layer having a portion overlapping the metal feature. The passivation layer includes a non-low-k dielectric material. A polymer layer is...
US20140319649 Lithium Battery, Method for Manufacturing a Lithium Battery, Integrated Circuit and Method of Manufacturing an Integrated Circuit  
A lithium battery includes a cathode, an anode including a component made of silicon, a separator element disposed between the cathode and the anode, an electrolyte, and a substrate. The anode is...
US20120049320 ELECTRONIC DEVICE INCLUDING A FEATURE IN A TRENCH  
A semiconductor substrate can be patterned to define a trench and a feature. In an embodiment, the trench can be formed such that after filling the trench with a material, a bottom portion of the...
US20100079246 INTEGRATED CIRCUIT WITH A RECTIFIER ELEMENT  
An integrated circuit with a rectifier element. One embodiment provides a signal source, an electronic circuit and a rectifier element with a copper layer and a cuprous oxide layer adjacent to and...
US20100025811 INTEGRATED CIRCUIT WITH BUILT-IN HEATING CIRCUITRY TO REVERSE OPERATIONAL DEGENERATION  
An integrated circuit device (100) includes structures (104) that exhibit performance degradation as a function of use (e.g., accumulated defects within the tunneling oxide of a Flash memory cell,...
US20140001597 Voids in Interconnect Structures and Methods for Forming the Same  
A device includes a dielectric layer, a passive device including a portion in the dielectric layer, and a plurality of voids in the dielectric layer and encircling the passive device.
US20110127636 INTEGRATED PASSIVE DEVICE ASSEMBLY  
There is provided an integrated passive device assembly including: a substrate having a wiring pattern disposed therein; a mounting part disposed on an upper surface of the substrate, formed of an...
US20140183550 PARASITIC INDUCTANCE REDUCTION FOR MULTILAYERED BOARD LAYOUT DESIGNS WITH SEMICONDUCTOR DEVICES  
A highly efficient, single sided circuit board layout design providing magnetic field self-cancellation and reduced parasitic inductance independent of board thickness. The low profile power loop...
US20150084157 ELECTRONIC STRUCTURE, A BATTERY STRUCTURE, AND A METHOD FOR MANUFACTURING AN ELECTRONIC STRUCTURE  
According to various embodiments, an electronic structure may be provided, the electronic structure may include: a semiconductor carrier, and a battery structure monolithically integrated with the...
US20080079118 REWORKABLE PASSIVE ELEMENT EMBEDDED PRINTED CIRCUIT BOARD  
A reworkable passive element embedded printed circuit board (PCB) including a board member, first and second fillings, and a first passive element. The board member has first and second through...
US20140035096 METHOD FOR CONTROLLING ELECTRICAL PROPERTY OF PASSIVE DEVICE DURING FABRICATION OF INTEGRATED COMPONENT AND RELATED INTEGRATED COMPONENT  
A method for controlling an electrical property of a passive device during a fabrication of an integrated component includes providing a substrate, manufacturing the passive device on the...
US20150262961 Wedge Bond Foot Jumper Connections  
A semiconductor device includes a substrate, first and second bond pad structures supported by the substrate and spaced from one another by a gap, and a wire bond foot jumper extending across the...
US20140110820 PASSIVE COMPONENT AS THERMAL CAPACITANCE AND HEAT SINK  
Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be...
US20130214385 Package-in-Package Using Through-Hole Via Die on Saw Streets  
A semiconductor device includes a first die having top, bottom, and peripheral surfaces. A bond pad is formed over the top surface. An organic material is connected to the first die and disposed...
US20060017133 Electronic part-containing elements, electronic devices and production methods  
An electronic part-containing element used by being incorporated in an electronic device, in which the electronic part-containing element comprises an insulating support member which does not take...
US20070145523 Integrateable capacitors and microcoils and methods of making thereof  
Method for integrally forming high Q tunable capacitors and high Q inductors on a substrate are described. A variable capacitors may employ stops between a moveable electrode and a fixed electrode...
US20080217732 Carbon memory  
An integrated circuit including a memory cell and methods of manufacturing the integrated circuit are described. The memory cell includes a resistive memory element including a top contact, a...
US20130105938 DEVICE MATCHING LAYOUT AND METHOD FOR IC  
The present invention relates to device matching in an integrated circuit. In one embodiment, an integrated circuit of matched devices can include: N main-devices to be matched by 4×K sub-devices...
US20050176209 Embedded passive components  
The present invention embeds passive components within a multilayer substrate used for mounting integrated circuits and other electronic components to form an electronic module or circuit board....
US20130168805 Packages with Passive Devices and Methods of Forming the Same  
A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A Post-Passivation Interconnect (PPI) line is disposed over the...
US20140167216 LOW-PROFILE CHIP PACKAGE WITH MODIFIED HEAT SPREADER  
An integrated circuit system includes a heat spreader that is thermally coupled to a semiconductor chip and has a cavity or opening formed in the heat spreader. The cavity or opening is positioned...
US20130214386 SIP SYSTEM-INTEGRATION IC CHIP PACKAGE AND MANUFACTURING METHOD THEREOF  
A system-in-package (SiP) system-integration integrated circuit (IC) chip package and a manufacturing method thereof are provided. The package includes a substrate, a passive device and two IC...
US20120080768 SHEET-MOLDED CHIP-SCALE PACKAGE  
Embodiments include but are not limited to apparatuses and systems including a microelectronic device including a die having a first surface and a second surface opposite the first surface, a...
US20080093702 SEMICONDUCTOR DEVICE HAVING A PASSIVE DEVICE  
The present invention relates to a semiconductor device having a passive device. The semiconductor device includes a substrate and at least one passive device. The substrate has at least one via....
US20130001795 Wafer Level Package and a Method of Forming the Same  
A wafer level package is provided. The wafer level package includes at least one chip with at least one electronic component, and at least one connecting chip with at least one through-silicon...
US20050218473 Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both  
A network electronic component comprises a network-electronic-component substrate, a thin-film passive element provided on the substrate, and a plurality of external connection electrodes provided...
US20060097341 Forming phase change memory cell with microtrenches  
A semiconductor substrate is covered by a dielectric region. The dielectric region accommodates a memory element and a selection element forming a phase change memory cell. The memory element is...
US20060076641 Methods of fabricating phase changeable semiconductor memory devices including multi-plug conductive structures and related devices  
In fabricating a phase changeable memory device, an insulating layer with an opening extending therethrough is formed on a substrate. A conductive structure is formed in the opening. The...
US20110241161 CHIP PACKAGE WITH CHANNEL STIFFENER FRAME  
Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and...
US20050151249 Chip-size package with an integrated passive component  
A passive component is integrated into a product having a rewiring location.
US20100155883 INTEGRATED MEMS AND IC SYSTEMS AND RELATED METHODS  
An integrated MEMS and IC system (MEMSIC), as well as related methods, are described herein. According to some embodiments, a mechanical resonating structure is coupled to an electrical circuit...
US20050189611 High frequency passive element  
An insulator layer is fabricated that is composed of a large number of insulating ridges formed with predetermined mutual spacing on a Si substrate. Then, an inductor conductor layer is formed in...
US20070215976 Integrated passive device substrates  
The specification describes an integrated passive device (IPD) that is formed on a silicon substrate covered with an oxide layer. Unwanted accumulated charge at the silicon/oxide interface are...
US20100059856 Method of configuring a semiconductor integrated circuit involving capacitors having a width equal to the length of active resistors  
A method of configuring a semiconductor integrated circuit (IC) includes arranging a circuit region in the center of a unit cell. Capacitor/resistor regions are arranged along the left and right...
US20080164562 SUBSTRATE WITH EMBEDDED PASSIVE ELEMENT AND METHODS FOR MANUFACTURING THE SAME  
A substrate with an embedded passive element and methods for manufacturing the same are provided, wherein the substrate includes an interlayer circuit board having a first conductive circuit, a...
US20070278614 LATERAL PASSIVE DEVICE HAVING DUAL ANNULAR ELECTRODES  
A lateral passive device is disclosed including a dual annular electrode. The annular electrodes form an anode and a cathode. The annular electrodes allow anode and cathode series resistances to...
US20110169126 In-situ passivation methods to improve performance of polysilicon diode  
A nonvolatile memory cell including a storage element in series with a diode steering element. At least one interface of the diode steering element is passivated.
US20140071566 OVERVOLTAGE PROTECTION FOR MULTI-CHIP MODULE AND SYSTEM-IN-PACKAGE  
In one embodiment, an apparatus includes a package that encompasses at least a first integrated circuit die and a second integrated circuit die. The first integrated circuit die is attached to the...
US20090236734 Semiconductor Device With Cross-Talk Isolation Using M-CAP and Method Thereof  
A semiconductor device is made by forming an oxide layer over a substrate and forming a first conductive layer over the oxide layer. The first conductive layer is connected to ground. A second...
US20110272786 ENERGY STORAGE SYSTEM  
An energy storage device (300), the device (300) comprising a substrate (102), a steric structure (104) formed on and/or in a main surface (106) of the substrate (102), a current collector stack...
US20090065894 Electronic circuit device having silicon substrate  
An electronic circuit device comprises a silicon substrate having front and rear surfaces, a semiconductor element formed on the front surface, and at least one through-hole penetrating through...
US20080308899 TRIANGULAR SPACE ELEMENT FOR SEMICONDUCTOR DEVICE  
Provided is a semiconductor device including a substrate. A gate formed on the substrate. The gate includes a sidewall. A spacer formed on the substrate and adjacent the sidewall of the gate. The...
US20090101990 Simiconductor integrated circuit device and method of manufacturing the same  
A semiconductor integrated circuit device includes a first dopant region in a semiconductor substrate, an isolation region on the semiconductor substrate, the isolation region surrounding the...
US20130127011 Passive Devices For 3D Non-Volatile Memory  
Passive devices such as resistors and capacitors are provided for a 3D non-volatile memory device. In a peripheral area of a substrate, a passive device includes alternating layers of a dielectric...
US20100127345 3-D CIRCUITS WITH INTEGRATED PASSIVE DEVICES  
3-D ICs (18, 18′, 90) with integrated passive devices (IPDs) (38) having reduced cross-talk and high packing density are provided by stacking separately prefabricated substrates (20, 30, 34)...
US20060231919 Passive microwave device and method for producing the same  
The present invention provides an electrical circuit component, specifically a passive microwave device, and a method for producing the same. In one embodiment, the present invention provides an...

Matches 1 - 50 out of 166 1 2 3 4 >