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US20090294804 |
HIGH-EFFICIENCY THINNED IMAGER WITH REDUCED BORON UPDIFFUSION
A method for fabricating a back-illuminated semiconductor imaging device on an ultra-thin semiconductor-on-insulator wafer (UTSOI) is disclosed. The UTSOI wafer includes a mechanical substrate, an...
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US20090218646 |
ELECTROMAGNETIC WAVE DETECTING ELEMENT
The present invention is to provide an electromagnetic wave detecting element that can suppress a decrease in utilization efficiency of electromagnetic waves at sensor portions. An upper electrode...
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US20090206436 |
SEMICONDUCTOR APPARATUS
An improved semiconductor apparatus that comprises an elongated structure that extends into the substrate. The apparatus comprises a collection contact, a resistive path, a bias connection that...
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US20090189231 |
Electromagnectic wave detecting element
The present invention is to provide an electromagnetic wave detecting element that can prevent a decrease in light utilization efficiency at sensor portions. The sensor portions are provided so as...
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US20090140359 |
Semiconductor device, method of manufacturing the same, and signal transmitting/receiving method using the semiconductor device
A semiconductor device ( 100 ) including: a semiconductor substrate including a semiconductor chip formation region ( 102 ); a chip internal circuit ( 124 ); a signal transmitting/receiving...
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US20090085045 |
METHOD FOR PRODUCING A MATRIX OF INDIVIDUAL ELECTRONIC COMPONENTS AND MATRIX PRODUCED THEREBY
The invention relates to a method for producing a matrix of electronic components, comprising a step of producing an active layer on a substrate, and a step of individualizing the components by...
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US20090085133 |
On Chip Antenna And Method Of Manufacturing The Same
An antenna with air-filled trench is integrated with a radio frequency (RF) circuit. The trench locates directly under the metal lines that made up the antenna and is formed by etching from the...
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US20090014821 |
Method for producing conductor structures and applications thereof
This publication discloses a method for forming electrically conducting structures on a substrate. According to the method nanoparticles containing conducting or semiconducting material are applied...
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US20090001488 |
Cantilever with integral probe tip
In one embodiment, a metallic micro-cantilever, comprises a silicon substrate, at least one via plug extending from a surface of the silicon substrate, a metallic layer cantilevered from the at...
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US20080309332 |
Microchip Assembly With Short-Distance Interaction
The invention relates to a microchip assembly that is particularly applicable for biosensors. According to the invention, short-distance interactions between coupling circuits ( 11, 12 ) on a thin...
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US20080230859 |
SAW DEVICES, PROCESSES FOR MAKING THEM, AND METHODS OF USE
The design, fabrication, post-processing and characterization of a novel SAW (Surface Acoustic Wave) based bio/chemical sensor in CMOS technology is introduced. The sensors are designed in AMI 1.5...
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US20080179758 |
Stacked integrated circuit assembly
A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the...
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US20080142916 |
Obstacle sensor operating by collimation and focusing of the emitted wave
An obstacle sensor operating by collimation and focusing of the emitted wave comprises: a device (I) for insulating the electromagnetic waves emitted by a generator ( 1 ); a device for the...
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US20080135960 |
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise...
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US20080093695 |
IMAGE SENSOR AND FABRICATING METHOD THEREOF
An image sensor including a substrate having a plurality of semiconductor devices formed thereon, an interconnection layer disposed on the substrate, and a plurality of isolated photo-diodes...
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US20080006891 |
Direct energy conversion devices with a substantially continuous depletion region and methods thereof
An energy conversion device includes a plurality of pores formed within a substrate and a junction region disposed within each of the plurality of pores where each of the junction regions has a...
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