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US20140346620 |
MEMS MICROPHONE WITH REDUCED PARASITIC CAPACITANCE
A MEMS microphone has reduced parasitic capacitance. The microphone includes a trench electrically separating an acoustically active section of the backplate from an acoustically inactive section... |
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US20140291784 |
MEMS APPARATUS WITH INCREASED BACK VOLUME
A microelectromechanical system (MEMS) microphone assembly includes a base and a cover. The cover is coupled to the base and together with the base defines a cavity. The base forms a recess and... |
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US20100308425 |
MEMS DEVICE AND PROCESS
A MEMS device comprises a back-plate (7) having an inner portion (7a) and an outer portion (7b), the inner portion (7a) connected to the outer portion (7b) by a sidewall (7c). A raised section or... |
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US20120205755 |
MEMS MICROPHONE
A MEMS microphone has a cover, a base and a MEMS chip. The cover has a contact voice receiving unit which is disposed on the base, and a space is formed between the cover and the base. The MEMS... |
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US20150129992 |
MEMS MICROPHONE HAVING DUAL BACK PLATE AND METHOD FOR MANUFACTURING SAME
Disclosed herein are a microelectromechanical systems (MEMS) microphone with a dual-back plate, and a method of manufacturing the same. The MEMS microphone according to an exemplary embodiment of... |
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US20140001581 |
MEMS MICROPHONE AND FORMING METHOD THEREFOR
A micro-electro-mechanical system (MEMS) microphone may include a sensitive diaphragm and a fixed electrode corresponding to the sensitive diaphragm; at least one sensitive diaphragm support... |
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US20110138902 |
MEMS MICROPHONE ARRAY ON A CHIP
The present invention relates to microelectromechanical systems (MEMS). In particular, the present invention relates to MEMS arrays for use in acoustics and other applications. |
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US20150102435 |
MEMS MICROPHONE WITH MEMBRANE ANTENNAS
A MEMS microphone. The microphone includes a backplate, a membrane, and a plurality of antennas. The backplate has a plurality of acoustic apertures. The membrane is parallel to the backplate and... |
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US20130193533 |
EMBEDDED CIRCUIT IN A MEMS DEVICE
A Microelectromechanical System (MEMS) microphone includes a printed circuit board, a MEMS die, and an integrated circuit. The MEMS die is disposed on a top surface of the printed circuit board.... |
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US20140291783 |
COVER FOR A MEMS MICROPHONE
A microphone assembly includes a base, a cover, and a microelectromechanical system (MEMS) die. The cover extends at least partially over and is coupled to the base. The cover and the base form a... |
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US20150021722 |
MEMS Device
A MEMS device includes a membrane comprising a first plurality of fingers. A counter electrode arrangement includes a second plurality of fingers disposed in a interdigitated relationship with the... |
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US20140191344 |
MEMS PROCESS AND DEVICE
A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of... |
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US20130256816 |
MEMS PROCESS AND DEVICE
A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of... |
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US20110089504 |
MEMS PROCESS AND DEVICE
A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane (5) on a substrate (3), and forming a back-volume in the substrate. The... |
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US20140270271 |
MEMS Acoustic Transducer, MEMS Microphone, MEMS Microspeaker, Array of Speakers and Method for Manufacturing an Acoustic Transducer
A MEMS acoustic transducer includes a substrate having a cavity therethrough, and a conductive back plate unit including a plurality of conductive perforated back plate portions which extend over... |
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US20150054098 |
MEMS MICROPHONE ASSEMBLY AND METHOD OF MANUFACTURING THE MEMS MICROPHONE ASSEMBLY
The present invention concerns a MEMS microphone assembly (1) comprising a MEMS transducer element (2) comprising a MEMS die (3), a back plate (4) and a diaphragm (5) displaceable in relation to... |
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US20140346621 |
MEMS BACKPLATE, MEMS MICROPHONE COMPRISING A MEMS BACKPLATE AND METHOD FOR MANUFACTURING A MEMS MICROPHONE
A MEMS backplate enables MEMS microphones with reduced parasitic capacitance. A MEMS backplate includes a central area and a perforation in the central area. A suspension area surrounds the... |
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US20140197502 |
Comb MEMS Device and Method of Making a Comb MEMS Device
A MEMS device and a method to manufacture a MEMS device are disclosed. An embodiment includes forming trenches in a first main surface of a substrate, forming conductive fingers by forming a... |
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US20140264656 |
MEMS ACOUSTIC SENSOR WITH INTEGRATED BACK CAVITY
A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a... |
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US20140084394 |
MICRO ELECTRO MECHANICAL SYSTEM (MEMS) MICROPHONE AND FABRICATION METHOD THEREOF
Provided is a structure for improving performance of a micro electro mechanical system (MEMS) microphone by preventing deformation from occurring due to a residual stress and a package stress of a... |
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US20140291787 |
STRUCTURE OF MEMS ELECTROACOUSTIC TRANSDUCER
A structure of micro-electro-mechanical systems (MEMS) electroacoustic transducer is disclosed. The MEMS electroacoustic transducer includes a substrate having a MEMS device region, a diaphragm... |
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US20130285173 |
ACOUSTIC TRANSDUCERS WITH PERFORATED MEMBRANES
A MEMS device, such as a microphone, uses a perforated plate. The plate comprises an array of holes across the plate area. The plate has an area formed as a grid of polygonal cells, wherein each... |
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US20150256924 |
MEMS DEVICE AND PROCESS
This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic... |
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US20140091406 |
MEMS Microphone System for Harsh Environments
A MEMS microphone system suited for harsh environments. The system uses an integrated circuit package. A first, solid metal lid covers one face of a ceramic package base that includes a cavity,... |
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US20110127623 |
MEMS Microphone Packaging and MEMS Microphone Module
A method for producing a microphone module includes arranging a MEMS microphone structure on a first surface of a first substrate, the first substrate further including a second surface, which is... |
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US20150158722 |
SYSTEMS AND APPARATUS HAVING MEMS ACOUSTIC SENSORS AND OTHER MEMS SENSORS AND METHODS OF FABRICATION OF THE SAME
A micro electro-mechanical system (MEMS) device is provided. The MEMS device includes: a substrate having a first surface and a second surface and wherein the first surface is exposed to an... |
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US20140210020 |
MEMS Device and Method of Manufacturing a MEMS Device
MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the... |
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US20150076627 |
MEMS-MICROPHONE WITH REDUCED PARASITIC CAPACITANCE
A MEMS microphone with reduced parasitic capacitance is provided. A microphone includes a protection film covering a rim-sided area of the backplate. |
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US20150001646 |
Pre-mold for a microphone assembly and method of producing the same
A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the... |
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US20140361388 |
CAPACITIVE SENSING STRUCTURE WITH EMBEDDED ACOUSTIC CHANNELS
A MEMS device includes a dual membrane, an electrode, and an interconnecting structure. The dual membrane has a top membrane and a bottom membrane. The bottom membrane is positioned between the... |
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US20120087521 |
Microphone Package with Embedded ASIC
A packaged microphone has a base, a lid coupled to the base forming an interior, a MEMS microphone secured to the base within the interior, and an integrated circuit embedded in the base.... |
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US20140084395 |
MEMS MICROPHONE
Mechanical resonating structures, as well as related devices and methods of manufacture. The mechanical resonating structures can be microphones, each including a diaphragm and a piezoelectric... |
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US20150237448 |
Integrated CMOS/MEMS Microphone Die
The claim invention is directed at a MEMS microphone die fabricated using CMOS-based technologies. In particular, the claims are directed at various aspects of a MEMS microphone die having... |
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US20150251898 |
Embedded Circuit In A MEMS Device
A Microelectromechanical System (MEMS) microphone includes a base printed circuit board (PCB), the base PCB having customer pads; at least one wall coupled to the base; a lid PCB coupled to the at... |
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US20150014796 |
Device with MEMS Structure and Ventilation Path in Support Structure
A device includes a support structure, a sound port disposed in the support structure, and a MEMS structure including a membrane acoustically coupled to the sound port. The membrane separates a... |
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US20140197501 |
MEMS Device with Polymer Layer, System of a MEMS Device with a Polymer Layer, Method of Making a MEMS Device with a Polymer Layer
A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS substrate disposed on the first... |
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US20120025334 |
MEMS CAPACITIVE MICROPHONE
The present invention discloses an MEMS capacitive microphone including a rigid diaphragm arranged on an elastic element. When a sound wave acts on the rigid diaphragm, the rigid diaphragm is... |
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US20150054097 |
Method for Manufacturing a MEMS Device and MEMS Device
A method for manufacturing a MEMS device includes providing a cavity within a layer adjacent to a sacrificial layer. The cavity extends to the sacrificial layer and includes a capillary slot... |
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US20150256915 |
MEMS DEVICE AND PROCESS
This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic... |
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US20140264655 |
SURFACE ROUGHENING TO REDUCE ADHESION IN AN INTEGRATED MEMS DEVICE
In an integrated MEMS device, moving silicon parts with smooth surfaces can stick together if they come into contact. By roughening at least one smooth surface, the effective area of contact, and... |
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US20110272769 |
MEMS MICROPHONE PACKAGE AND PACKAGING METHOD
A MEMS microphone package having improved acoustic properties, and to a packaging method, which involve adding a vent path in the packaging process to improve equilibrium between internal and... |
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US20110227177 |
MEMS sensor
The MEMS sensor according to the present invention includes a diaphragm. In the diaphragm, an angle formed by two straight lines connecting supporting portions and the center of a main portion... |
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US20110068421 |
Integrated MEMS and ESD protection devices
An electronic apparatus is provided that has a core, an electronic circuit in the core and a lid. An ESD protection device is in the lid. The ESD protection device is coupled to the electronic... |
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US20120091546 |
Microphone
A microphone comprises a substrate (20), a microphone membrane (10) defining an acoustic input surface and a backplate (11) supported with respect to the membrane with a fixed spacing between the... |
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US20150035094 |
MICROPHONE ASSEMBLY HAVING AT LEAST TWO MEMS MICROPHONE COMPONENTS
A microphone assembly includes two MEMS components each having a micromechanical microphone structure, each microphone structure having: a diaphragm configured to be deflected by sound pressure... |
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US20140264653 |
MEMS Pressure Sensor and Microphone Devices Having Through-Vias and Methods of Forming Same
A method embodiment includes providing a MEMS wafer. A portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor... |
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US20130320465 |
THIN MEMS MICROPHONE MODULE
A MEMS microphone module includes a first circuit board and a second circuit board attached to the first circuit board. A MEMS chip and an ASIC chip are respectively received in one of two... |
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US20130140656 |
MEMS Microphone And Method For Producing The MEMS Microphone
The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier... |
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US20110140213 |
CAPACITIVE VIBRATION SENSOR
A hollow part is formed in a silicon substrate through the front and the back. A vibration electrode plate is arranged on an upper surface of the silicon substrate to cover the opening on the... |
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US20120187507 |
MEMS RESONATOR
A bulk-acoustic-mode MEMS resonator has a first portion with a first physical layout, and a layout modification feature. The resonant frequency is a function of the physical layout, which is... |