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US20090315126 |
Bonded Microfluidic System Comprising Thermal Bend Actuated Valve
A microfluidic system comprising a MEMS integrated circuit bonded to a microfluidics platform. The microfluidics platform comprises a polymeric body having at least one microfluidic channel defined...
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US20090315127 |
METHOD AND APPARATUS FOR IMPROVING MEASUREMENT ACCURACY OF MEMS DEVICES
A system for improving the performance of a microelectromechanical systems (MEMS) device that is housed in a package and implemented on a printed circuit board (PCB) comprises a footprint, an...
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US20090309173 |
MEMS SENSOR
The MEMS sensor according to the present invention includes a diaphragm. In the diaphragm, an angle formed by two straight lines connecting supporting portions and the center of a main portion with...
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US20090309171 |
Mems Sensor Comprising a Deformation-free Back Electrode
An MEMS sensor constructed on a base chip and having a capacitive mode of operation is disclosed. The MEMS sensor has a patterned layer construction applied on the base chip. A cutout is produced...
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US20090309172 |
SENSOR AND A METHOD OF MAKING A SENSOR
A sensor is provided, which includes a plurality of conducting elements spaced apart from each other and at least one deformable electrolyte bridge contacting each of the conducting elements at one...
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US20090294879 |
Method for Capping a MEMS Wafer
A method for capping a MEMS wafer to form a hermetically sealed device. The method includes applying a glass bonding agent to the cap wafer and burning off organic material in the glass bonding...
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US20090293604 |
MULTI-CHIP PACKAGE
Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in tire pressure monitoring systems.
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US20090289313 |
MICRO ELECTRIC MECHANICAL SYSTEM DEVICE AND METHOD OF PRODUCING THE SAME
A MEMS device comprises a substrate, an island-shaped first insulating layer formed on the substrate, a second insulating film formed on the top and side surfaces of the first insulating layer and...
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US20090278215 |
ELECTRONIC DEVICE, SYSTEM, AND METHOD COMPRISING DIFFERENTIAL SENSOR MEMS DEVICES AND DRILLED SUBSTRATES
Electronic device which comprises a substrate provided with at least one passing opening, a MEMS device with function of differential sensor provided with a first and a second surface and of the...
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US20090278214 |
Microelectromechanical Systems Encapsulation Process
An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device...
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US20090267166 |
METHOD OF MANUFACTURING A DEVICE WITH A CAVITY
The invention relates to a micro-device with a cavity ( 50 ), the micro-device comprising a substrate ( 10, 110 ), the method comprising steps of: A) providing the substrate ( 10, 110 ), having a...
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US20090267165 |
WAFER LEVEL PACKAGE STRUCTURE, AND SENSOR DEVICE OBTAINED FROM THE SAME PACKAGE STRUCTURE
A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with...
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US20090256260 |
SEMICONDUCTOR DEVICE
A semiconductor device including a semiconductor element and a functional member fixed thereto with an adhesive film is provided, where the performance or reliability degradation due to moisture...
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US20090256217 |
CARBON NANOTUBE MEMORY CELLS HAVING FLAT BOTTOM ELECTRODE CONTACT SURFACE
The present invention is directed to structures and methods of fabricating nanotube electromechanical memory cells having a bottom electrode with a substantially planar contact surface. The bottom...
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US20090242882 |
THREE-DIMENSIONAL MICROSTRUCTURES AND METHODS FOR MAKING SAME
Microstructures can be formed as patterned layers on a substrate and then erecting the microstructures out of the plane of the substrate. The microstructures may be formed over circuits in the...
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US20090243004 |
Integrated structure for MEMS device and semiconductor device and method of fabricating the same
The present invention relates to an integrated structure for a MEMS device and a semiconductor device and a method of fabricating the same, in which an etch stopping device is included on a...
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US20090243005 |
Semiconductor physical quantity sensor and method for manufacturing the same
A method for manufacturing a semiconductor physical quantity sensor having a fixed portion, a movable portion and an output terminal includes: forming a metal layer on a semiconductor layer;...
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US20090243006 |
ELECTRONIC PART WITH AFFIXED MEMS
According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump...
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US20090236678 |
SENSOR DEVICE AND PRODUCTION METHOD THEREFOR
A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame...
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US20090236677 |
Micro Electro-Mechanical Sensor (MEMS) Fabricated with Ribbon Wire Bonds
A micro electro-mechanical sensor is provided. The micro electro-mechanical sensor includes a substrate, and a conducting plane disposed on the substrate. A conducting via is disposed on the...
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US20090230485 |
ELEMENT WAFER AND METHOD FOR MANUFACTURING THE SAME
A recessed portion is provided in first and second insulating films, the first insulating film being stacked on a semiconductor wafer, the second insulating film being stacked on the first...
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US20090230486 |
PIEZOELECTRIC DEVICE AND ELECTRONIC APPARATUS
A piezoelectric device includes an integrated circuit (IC) chip and a piezoelectric resonator element, a part of the piezoelectric resonator element being disposed so as to overlap with a part of...
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US20090218641 |
PIEZOELECTRIC SUBSTRATE, FABRICATION AND RELATED METHODS
Improved methods, and related systems and devices, for fabricating selectively patterned piezoelectric substrates suitable for use in a wide variety of systems and devices. A method can include...
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US20090218560 |
METHOD FOR REVERSIBLY MOUNTING A DEVICE WAFER TO A CARRIER SUBSTRATE
New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in...
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US20090212377 |
SEMICONDUCTOR INPUT CONTROL DEVICE
A force input control device suitable for high-volume applications such as cell phones, portable gaming devices and other handheld electronic devices along with other applications like medical...
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US20090200619 |
SYSTEMS AND METHODS FOR MEMS DEVICE FABRICATION
Systems and methods for MEMS device fabrication. A layer of photoresist is formed on a substrate. A first region of the substrate is exposed to a radiation source through a photomask. The first...
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US20090194828 |
METHOD FOR MEMS THRESHOLD SENSOR PACKAGING
Apparatus, methods, and systems for bonding a cover wafer to a MEMS threshold sensors located on a silicon disc. The cover wafer is trenched to form a region when bonded to the silicon wafer that...
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US20090194830 |
SEMICONDUCTOR DEVICE TRANSDUCER AND METHOD
A semiconductor device such as a resonant device has a capacitive, non-piezoelectric, actuator, the actuator comprising a depletion region. A capacitive actuator for a semiconductor device, a...
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US20090194827 |
Semiconductor Device Having Element Portion and Method of Producing the Same
A semiconductor device includes a semiconductor substrate, an element portion provided in the semiconductor substrate, and a connecting portion connected to the semiconductor substrate...
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US20090194829 |
MEMS Packaging Including Integrated Circuit Dies
MEMS packaging schemes having a system-on-package (SOP) configuration and a system-on-board (SOB) configuration are provided. The MEMS package comprises one or more MEMS dies, a cap section having...
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US20090189230 |
METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER
Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant...
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US20090180647 |
Microphone with Backside Cavity that Impedes Bubble Formation
A MEMS microphone has a backplate, a diaphragm movable relative to the backplate, and a backside cavity adjacent to the backplate or the diaphragm. The backside cavity has sidewalls with at least...
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US20090179286 |
MEMS Devices and Methods of Manufacture Thereof
Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench...
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US20090179287 |
FUNCTIONAL DEVICE AND MANUFACTURING METHOD THEREOF
A functional device includes: a substrate; a functional structure formed on the substrate; a cavity in which the functional structure is disposed; and a cover which covers the cavity, wherein the...
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US20090179317 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
It is made possible to restrict warpage at the time of resin cure and achieve a smaller thickness. A semiconductor device includes: a first chip including a MEMS device and a first pad formed on an...
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US20090174014 |
Micromechanical Actuators Comprising Semiconductors on a Group III Nitride Basis
A semiconductor actuator includes a substrate base, a bending structure which is connected to the substrate base and can be deflected at least partially relative to the substrate base. The bending...
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US20090166771 |
DEVICE COMPRISING A SENSOR MODULE
A device ( 1 ) comprising a sensor module ( 2 ) with a package ( 3 ) is produced at reduced costs by providing the package ( 3 ) with two or more substrates ( 4,5 ) each with a functional layer (...
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US20090166772 |
MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) DEVICE AND PROCESS FOR FABRICATING THE SAME
A micro-electro-mechanical systems (MEMS) device includes a back-plate substrate, having an intended region formed with a plurality of perforating holes. A first structural dielectric layer,...
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US20090159997 |
WAFER LEVEL PACKAGE STRUCTURE AND PRODUCTION METHOD THEREFOR
A wafer level package structure, in which a plurality of compact sensor devices with small variations in sensor characteristics are formed, and a method of producing the same are provided. This...
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US20090159996 |
Method Of Producing Microsprings Having Nanowire Tip Structures
A stress-engineered microspring is formed generally in the plane of a substrate. A nanowire (or equivalently, a nanotube) is formed at the tip thereof, also in the plane of the substrate. Once...
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US20090152654 |
MICROMECHANICAL SYSTEM
A micromechanical system includes a substrate, a first planar electrode, a second planar electrode, and a third planar electrode. The second planar electrode is movably positioned at a distance...
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US20090152653 |
Surface mount multi-axis electronics package for micro-electrical mechanical systems(MEMS) devices
A surface mount multi-axis cavity package for micro-electrical mechanical systems (MEMS) devices includes a substantially cubical housing having a plurality of sides and at least one internal...
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US20090146228 |
Microminiature moving device
A microminiature moving device has disposed on a single-crystal silicon substrate movable elements such as a movable rod and a movable comb electrode that are displaceable in parallel to the...
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US20090146226 |
MECHANICAL MEMORY TARNSISTOR
A mechanical memory transistor includes a substrate having formed thereon a source region and a drain region. An oxide is formed upon a portion of the source region and upon a portion of the drain...
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US20090146227 |
CAPACITIVE SENSOR AND MANUFACTURING METHOD THEREFOR
A capacitive sensor according to the present invention includes a semiconductor substrate, a fixed electrode serving as a first electrode formed on a surface of or in the semiconductor substrate, a...
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US20090141913 |
MICROELECTROMECHANICAL SYSTEM
A microelectromechanical system comprises a carrier substrate. A semiconductor chip is fitted in the carrier substrate or on the carrier substrate. In addition, a microelectromechanical component...
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US20090140355 |
SEMICONDUCTOR PRESSURE SENSOR AND ITS FABRICATION METHOD
A semiconductor pressure sensor comprises a silicon support substrate ( 1 ), an insulating layer ( 2 ) formed on the silicon support substrate ( 1 ), and a silicon thin plate ( 3 ) formed on the...
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US20090134481 |
Molded Sensor Package and Assembly Method
A method of forming a molded sensor includes providing a sensor assembly having a sensor, and a cap coupled to a portion of the sensor, the cap having an opening and forming an interior area. The...
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US20090134482 |
Power semiconductor module having a substrate and a pressure device
A power semiconductor module having a substrate, a housing and a pressure device. The substrate further includes a body formed of an insulating material and structured conductor tracks which are...
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US20090127638 |
ELECTRICAL DEVICE AND METHOD
An electrical device and method is disclosed. One embodiment provides a substrate, a sensor chip disposed completely above a plane section of a surface of the substrate. A structurally homogeneous...
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