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US20090294796 |
Adhesive-Promoting Agent, Curable Organopolysiloxane Composition, and Semiconductor Device
An adhesion-promoting agent represented by the following average formula: R 1 a SiO (4-a/2 (where R 1 is a group selected from an optionally substituted alkyl group with 1 to 10 carbon atoms, an...
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US20090283794 |
CURABLE RESIN MATERIAL COMPOSITION, OPTICAL MATERIAL, LIGHT-EMITTING DEVICE, METHOD FOR PRODUCING LIGHT-EMITTING DEVICE, AND ELECTRONIC DEVICE
A curable resin material composition includes an addition-polymerization-curable silicone resin material that gives a silicone resin having a glass transition temperature of 50° C. or less when...
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US20090283793 |
NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE AND PRODUCTION METHOD THEREOF
Disclosed is a semiconductor device which is improved in output power efficiency since reflection by the substrate is reduced. This semiconductor device is also excellent in strength...
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US20090278151 |
Light emitting diode packages, light emitting diode systems and methods of manufacturing the same
In a method of forming an LED semiconductor device, and in an LED semiconductor device, an LED is provided on a substrate. A first encapsulant material layer is provided on the LED, and the first...
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US20090267107 |
Optoelectronic Semiconductor Component
An optoelectronic semiconductor component includes a basic body, at least one semiconductor chip arranged thereon, and an encapsulation embedding the at least one semiconductor chip and composed of...
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US20090256171 |
RESIN COMPOSITION FOR SEALING LIGHT-EMITTING DEVICE AND LAMP
A resin composition for sealing a light-emitting device of the present invention includes a silsesquioxane resin including two or more oxetanyl groups, a cationic polymerization initiator and a...
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US20090250718 |
LIGHT EMITTING DIODE AND METHOD FOR PRODUCING THE SAME
A method for producing an LED includes steps of: providing a base ( 22 ), a chip body ( 21 ) and a die ( 40 ), wherein the base has a concave depression ( 23 ) defined therein and the die has a...
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US20090242928 |
RESIN SHEET FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE
The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and...
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US20090242914 |
LED ASSEMBLY WITH HIGH HEAT DISSIPATING CAPABILITY
An LED assembly includes a substrate and a plurality of LEDs mounted on the substrate. Each LED comprises an LED die mounted on the substrate via an adhesive, a base spacedly surrounding the LED...
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US20090230425 |
WATER-BARRIER ENCAPSULATION METHOD
The present invention generally relates to organic light emitting diode (OLED) structures and methods for their manufacture. To increase the lifetime of an OLED structure, an encapsulating layer...
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US20090230409 |
UNDERFILL PROCESS FOR FLIP-CHIP LEDS
An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill...
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US20090218592 |
Method of producing encapsulation resins
A process is provided for producing curable polyorganosiloxanes where noble metal oxides are used as hydrosilylation catalysts. The noble metals can be used in solid granular form or as part of a...
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US20090218591 |
Method for Connecting Layers, Corresponding Component and Organic Light-Emitting Diode
A method for bonding several layers, which comprise at least one thermally bondable material, by means of a joint layer produced with the aid of thermocompression at least one of the layers...
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US20090200572 |
Lighting device and production method of the same
Bonding between a light-emitting element and electrodes of a substrate is ensured to enhance reliability of a lighting device. In the lighting device of the present invention, a material made of...
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US20090189180 |
SILICONE RESIN COMPOSITION
A silicone resin composition is provided, which includes polysiloxane including (PSA1), (PSA2), (PSB) and (PSC), and a hydrosilylating catalyst, wherein a weight ratio between (PSA2) and (PSA1)...
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US20090189179 |
METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE
A method for manufacturing flip-chip light emitting diode (LED) package. A recess array is formed at the top surface of a silicon wafer. Two through-wafer via holes are formed in the recess. A...
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US20090166665 |
Encapsulated optoelectronic device
The invention provides an optoelectronic device (e.g. a LED device) and method thereof. The device includes an optoelectronic component at least partially surrounded by an encapsulant comprising a...
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US20090146176 |
LIGHT EMITTING DIODE
The outer peripheral portion of a substrate is provided with a first peripheral edge and a second peripheral edge. The first peripheral edge is provided on the edge portion of a first upper surface...
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US20090146175 |
THERMAL STABLE TRANSPARENT SILICONE RESIN COMPOSITIONS AND METHODS FOR THEIR PREPARATION AND USE
A curable silicone composition includes (A) a polydiorganosiloxane having an average, per molecule, of at least two aliphatically unsaturated organic groups and at least one aromatic group; (B) a...
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US20090140285 |
LIGHT EMITTING DEVICE HAVING FUNCTION OF HEAT-DISSIPATION AND MANUFACTURING PROCESS FOR SUCH DEVICE
A light-emitting device of a light-emitting diode (LED) and a manufacture method thereof are provided. The light-emitting device includes a post-like metal material, a printed circuit board,...
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US20090140284 |
Transparent Inorganic Oxide Dispersion and Iorganic Oxide Particle-Containing Resin Composition, Composition for Sealing Light Emitting Element and Light Emitting element, Hard Coat Film and Optical Functional Film and Optical Component, and Method for Producing Inorganic Oxide Pariticle-Containing Resin
The present invention provides a transparent inorganic oxide dispersion which makes it possible to improve the refractive index and mechanical characteristics and to maintain transparency by...
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US20090134411 |
Light Emitting Device and Backlight Unit Using the Same
An object of the present invention is to provide a light emitting device that shows high adhesion between a sealing member and a package member. A light emitting device 100 of the present...
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US20090121254 |
Method for Modification of Built In Potential of Diodes
In broad terms the present invention is a semiconductor junction comprising a first material ( 102 ) and a second material ( 104 ), in which a surface of one or both of the junction materials has a...
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US20090121250 |
HIGH LIGHT EXTRACTION EFFICIENCY LIGHT EMITTING DIODE (LED) USING GLASS PACKAGING
An (Al, Ga, In)N and ZnO direct wafer bonded light emitting diode (LED) combined with a shaped optical element in which the directional light from the ZnO cone or any high refractive index material...
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US20090121248 |
SEMICONDUCTOR LIGHT EMITTING DEVICE AND PLANAR LIGHT SOURCE
A semiconductor light emitting device includes: a base portion having a concave portion formed in one of major surfaces thereof; and a light emitting element mounted on a bottom surface of the...
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US20090090928 |
LIGHT EMITTING MODULE AND METHOD FOR MANUFACTURING THE SAME
Provided are: a light emitting module capable of ensuring a high heat-dissipating property and mountable in any of sets in various shapes; and a method for manufacturing the light emitting module....
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US20090078960 |
LIGHT EMITTING DIODE WITH AUXILIARY ELECTRIC COMPONENT
An exemplary LED includes a substrate, an LED chip, a light pervious encapsulation, and an auxiliary electric component. The substrate includes a first surface, an opposite second surface, and an...
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US20090072265 |
PROCESS FOR PRODUCING LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE
The present invention provides a process for producing a light-emitting device capable of achieving high directivity without a cavity, which minimizes occurrence of short circuit at a time of...
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US20090065800 |
OPTOELECTRONIC COMPONENT, DEVICE COMPRISING A PLURALITY OF OPTOELECTRONIC COMPONENTS, AND METHOD FOR THE PRODUCTION OF AN OPTOELECTRONIC COMPONENT
Disclosed is an optoelectronic component ( 1 ) comprising a semiconductor function region ( 2 ) with an active zone ( 400 ) and a lateral main direction of extension, said semiconductor function...
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US20090057708 |
LED Light Source Having Improved Resistance to Thermal Cycling
A light source and method for making the same are disclosed. The light source includes a substrate, a die, and a cup. The substrate has a plurality of electrical traces thereon and the die includes...
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US20090050925 |
RESIN MOLDING, SURFACE MOUNTED LIGHT EMITTING APPARATUS AND METHODS FOR MANUFACTURING THE SAME
The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light...
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US20090020779 |
Method of preparing a sealed light-emitting diode chip
A method for producing a light emitting diode chip encapsulation product, the method comprising covering a light emitting diode chip connected onto a substrate with a thermosetting film, and...
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US20090008673 |
Semiconductor Light Emitting Device Member, Method for Manufacturing Such Semiconductor Light Emitting Device Member and Semiconductor Light Emitting Device Using Such Semiconductor Light Emitting Device Member
A semiconductor light-emitting device member excellent in transparency, light resistance, and heat resistance and capable of sealing a semiconductor light-emitting device without causing cracks and...
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US20080315242 |
System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack
Exemplary embodiments of the selective laser repair apparatus and method may allow the repair of metal bumps in a semiconductor device stack by applying a laser beam to a damaged and/or defective...
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US20080296608 |
Light-emitting device
A light-emitting element 10 is fixed on a lead frame 20 with a die-bonding member 13 . The light-emitting element 10 is sealed with a silicone resin 22 and further sealed with an epoxy...
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US20080296607 |
ENVIRONMENTALLY ROBUST LIGHTING DEVICES AND METHODS OF MANUFACTURING SAME
An illustrative lighting device comprises: a light emitting chip; a silicone encapsulant disposed over the light emitting chip; and a light transmissive vinyl or acrylic layer sealing an assembly...
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US20080296606 |
Electronic Module and Chip Card With Indicator Light
The invention generally relates to devices comprising semiconductor chips. More specifically, the invention relates to an electronic module ( 1 ) comprising at least one integrated circuit chip (...
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US20080265274 |
Light emitting diode element having a voltage regulating capability
An LED element having a voltage regulating capability has a body, two pins, a resistor and a conductive sleeve. The resistor is connected to a shorter pin through the conductive sleeve, so an...
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US20080258171 |
SEMICONDUCTOR LIGHT EMITTING DEVICE EXCELLENT IN HEAT RADIATION
A semiconductor light emitting device is provided which comprises: a semiconductor light emitting chip 2 mounted on a top surface 12 of a support plate 1 , wiring conductors 3 disposed...
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US20080203423 |
LIGHT-EMITTING DIODE
A light-emitting diode is provided which includes: a sheet-like substrate; a pair of electrode patterns formed to wrap round and cover substantially entire upper and lower surfaces of the...
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US20080191237 |
SUBMOUNTS FOR SEMICONDUCTOR LIGHT EMITTING DEVICES AND METHODS OF FORMING PACKAGED LIGHT EMITTING DEVICES INCLUDING DISPENSED ENCAPSULANTS
A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate...
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US20080185610 |
RESIN-SEALED SEMICONDUCTOR LIGHT RECEIVING ELEMENT, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE USING THE SAME
A resin-sealed semiconductor light receiving element in which a light receiving element mounted on a circuit board is sealed with a transparent resin. A mounting face of the circuit board on which...
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US20080164487 |
CERAMIC PACKAGE FOR LED
A ceramic light emitted diode (LED) package has a pair of discrete reflection walls to reflect light emission from the LED. With two opposite reflection walls and two opposite openings around the...
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US20080128741 |
Leadframe and Semiconductor Package
A leadframe for a semiconductor package and a semiconductor package manufactured from such a leadframe including a plurality of connection leads supported in a frame. A die mounting plate is...
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US20080121923 |
Method for producing an optoelectronic component, and an optoelectronic component
A method for producing an optoelectronic component comprising the steps of providing a semiconductor layer sequence having at least one active region, wherein the active region is suitable for...
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US20080111146 |
STANDING TRANSPARENT MIRRORLESS LIGHT EMITTING DIODE
An (Al, Ga, In)N light emitting diode (LED) in which multi-directional light can be extracted from one or more surfaces of the LED before entering a shaped optical element and subsequently being...
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US20080105894 |
SEMICONDUCTOR DEVICE
A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2 , having a bottom surface 2 b ...
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US20080083930 |
Transparent Ohmic Contacts on Light Emitting Diodes with Growth Substrates
A light emitting diode is disclosed that includes a growth substrate, a substantially transparent ohmic contact on a first surface of the growth substrate, a Group III nitride, light-emitting...
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US20080079018 |
PORCELAIN ENAMEL SUBSTRATE FOR MOUNTING LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME, LIGHT EMITTING DEVICE MODULE, ILLUMINATION DEVICE, DISPLAY UNIT AND TRAFFIC SIGNAL
A porcelain enamel substrate mounts a light emitting device in which a porcelain enamel layer is coated onto a surface of a core metal, and a reflective cup portion that has a flat bottom surface...
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US20080073662 |
Method of manufacturing high power light-emitting device package and structure thereof
A method of manufacturing high power light-emitting device packages and structure thereof, wherein the method thereof includes the steps of: (a) forming a plurality of lead frames, each of the lead...
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