Matches 1 - 24 out of 24


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US20110079631 Joining Of Parts Via Magnetic Heating Of Metal-Aluminum Powders  
A method of joining at least two parts includes steps of dispersing a joining material comprising a multi-phase nanocrystalline magnetic metal-aluminum powder at an interface between the at least...
US20110127314 BONDING MATERIAL WITH EXOTHERMICALLY REACTIVE HETEROSTRUCTURES  
A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the heterostructures comprising at least a first...
US20090236404 PASTY SILVER PARTICLE COMPOSITION, PROCESS FOR PRODUCING SOLID SILVER, SOLID SILVER, JOINING METHOD, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD  
[PROBLEMS] To provide a pasty silver particle composition, which, upon heating, allows silver particles to be easily sintered to form solid silver possessing excellent strength, electric...
US20120045869 FLIP CHIP BONDER HEAD FOR FORMING A UNIFORM FILLET  
A low thermal conductivity material layer covers a peripheral portion of the bottom surface of the conductive plate of a chip bonder head. The center portion of the conductive plate is exposed or...
US20100025849 COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND ENHANCED WIRE BONDING PROCESS  
A semiconductor package and a method for constructing the package are disclosed. The package includes a substrate and a die attached thereto. A first contact region is disposed on the substrate...
US20090022928 Method and mask assembly for forming solder bodies on a substrate  
A method for forming solder bodies on a substrate includes: positioning a first mask plate, which is formed with at least one first through-hole, on the substrate; filling the first through-hole...
US20130247979 NEW ELECTRICAL CONDUCTOR FOR ATTACHING SILICON WAFERS IN PHOTOVOLTAIC MODULES  
The invention relates to an electrical conductor (2) having a longitudinal axis (A) parallel to the rolling direction of a conductor wire, comprising copper material and an attachment surface (7)...
US20090032570 Compression bonding device and a mounting method  
A compression bonding device has a dam member so that when a pressing head is pressed against an object to be pressed, the bonding part is surrounded by the dam member. Thus, even if the surface...
US20070181653 Magnetic alignment of integrated circuits to each other  
Utilizing magnetic features located on different structures having semiconductor devices to align the structures when contacting the structures together. The magnetic features on each structure...
US20090310318 ATTACHING A LEAD-FREE COMPONENT TO A PRINTED CIRCUIT BOARD UNDER LEAD-BASED ASSEMBLY CONDITIONS  
A technique for attaching components to PCBs involves providing a lead-free component and a PCB. The lead-free component has a package and lead-free component contacts, and the PCB has PCB...
US20090071530 Texture process and structure for manufacture of composit photovoltaic device substrates  
A composite structure, e.g., rigid or flexible. The structure has a layer transferred photovoltaic material (e.g., single crystal silicon) having a first region and a second region, and a...
US20080164488 Light Emitting Device and Method of Fabricating Light Emitting Device  
A second electrode (16) formed on a second main surface of a compound semiconductor layer (100) of a light emitting element (1) is arranged in contact with the second main surface of the compound...
US20160254243 JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR JOINING ELECTRONIC PART  
A joining silver sheet with high joining strength contains silver particles having a particle diameter of from 1 to 250 nm integrated by sintering, and has a capability of further undergoing...
US20160243636 BRAZING JOINING METHOD OF CNT ASSEMBLIES ON SUBSTRATES USING AN AT LEAST TERNARY BRAZING ALLOY; CORRESPONDING BRAZING MATERIAL AND DEVICE COMPRISING SUCH ASSEMBLY  
The present application describes a joining method of a Carbon Nanotube-assembly (1) on a substrate (2), showing a reproducible controlled joining with partly carbidization of the carbon...
US20160225735 Method for Producing a Connecting Medium on an Assembly Partner, Method for Producing a Material-Fit Connection Between an Assembly Partner and a Metal Layer, and a System for Carrying out the Methods  
A method for producing a layer including a connecting medium on an assembly partner is provided. The method incudes providing a carrier on which the connecting medium is applied. The connecting...
US20160204047 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME  
A semiconductor device includes: a semiconductor element having a solder region and a non-solder region on a first face; a first metal member disposed on the first face of the semiconductor...
US20160183384 ELECTRICAL DEVICES AND METHODS FOR MANUFACTURING SAME  
An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead...
US20160135296 WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF, AND WIRED CIRCUIT BOARD ASSEMBLY AND PRODUCING METHOD THEREOF  
A method for producing a wired circuit board, including an insulating layer having a first through portion passing through in a thickness direction thereof and a first terminal portion having a...
US20160113123 Method for Soldering a Circuit Carrier to a Carrier Plate  
A method for soldering a circuit carrier to a carrier plate includes providing a carrier plate having an upper side and a first adjusting device, providing a circuit carrier having an underside...
US20160064350 CONNECTION ARRANGEMENT OF AN ELECTRIC AND/OR ELECTRONIC COMPONENT  
A connection arrangement includes at least one electric and/or electronic component. The at least one electric and/or electronic component has at least one connection face, which is connected in a...
US20160057855 Accurate Positioning and Alignment of a Component During Processes Such as Reflow Soldering  
One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the...
US20160020161 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD  
A semiconductor device includes a semiconductor element; an insulating substrate formed from stacking a rectangular shaped circuit plate, insulating plate, and metal plate, wherein the...
US20160016245 METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE  
A method for manufacturing a power module substrate includes a first lamination step of laminating a ceramic substrate and a copper sheet through an active metal material and a filler metal having...
US20150362158 LIGHT EMITTING DEVICE AND METHOD OF PRODUCING THE LIGHT EMITTING DEVICE  
A light emitting device includes a package having a recess, a light emitting element disposed in the recess, a light-transmissive member covering an opening of the recess, and a frame member...

Matches 1 - 24 out of 24