Matches 1 - 50 out of 144 1 2 3 >
Match Document Document Title
US20090308652 PACKAGE SUBSTRATE HAVING DOUBLE-SIDED CIRCUITS AND FABRICATION METHOD THEREOF  
A package substrate having double-sided circuits and a method of manufacturing the same are proposed. The package substrate includes a core board having a plated through hole, a plurality of first...
US20090301768 PRINTED CIRCUIT BOARD  
A printed circuit board of the present disclosure includes a main body, a tin layer, and a solder mask. The main body defines a through hole configured for being connected to a grounding component....
US20090294167 MULTILAYER WIRING BOARD  
A multilayer wiring board is capable of preventing the occurrence of cracking in the vicinity of a connection portion of a conductor pattern disposed inside a basic material layer and a via-hole...
US20090294164 Printed circuit board including landless via and method of manufacturing the same  
Disclosed herein is a printed circuit board including a landless via and a method of manufacturing the printed circuit board. The printed circuit board includes a landless via having no upper land....
US20090288872 Printed circuit board including outmost fine circuit pattern and method of manufacturing the same  
Disclosed herein is a printed circuit board including an outmost fine circuit pattern. In the board, an end of a via, which has the minimum diameter, is connected to the outmost circuit layer of a...
US20090290318 Printed wiring board and method for manufacturing the same  
A printed wiring board includes a first substrate having a recess portion and multiple conductors, a second substrate having multiple conductors and inserted in the recess portion of the first...
US20090288873 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME  
A wiring board is provided. The wiring board includes: a resin substrate having a through-hole therethrough; metal foil patterns formed on the resin substrate; and a first wiring layer formed on...
US20090288871 THIN FILM CIRCUIT BOARD DEVICE  
A thin film circuit board device includes: a first thin film circuit board having a first protrusion provided with a first conductive contact; a second thin film circuit board having a second...
US20090283316 CIRCUIT BOARD VIAHOLES AND METHOD OF MANUFACTURING THE SAME  
Provided are a circuit board with a viahole and a method of manufacturing the same. The circuit board includes: a substrate formed of an insulating material; a conductive layer disposed on the...
US20090283315 HIGH DENSITY PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME  
The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is...
US20090283312 Printed wiring board and method for manufacturing the same  
A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors...
US20090282674 ELECTRICAL INTERCONNECT STRUCTURE AND PROCESS THEREOF AND CIRCUIT BOARD STRUCTURE  
An electrical interconnecting structure suitable for a circuit board is provided. The electrical interconnecting structure includes a core, an ultra fine pattern, and a patterned conductive layer....
US20090272569 Component Assembly  
A component assembly includes an electric component with a body and a carrier substrate on which the component is fixed by means of a conductive adhesive layer. External electrical contacts that...
US20090266586 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE  
An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like,...
US20090266588 MULTILAYER PRINTED WIRING BOARD  
A multilayer printed wiring board has a core substrate, an interlayer insulation layer formed over the core substrate, conductive layers formed over the core substrate, and a via hole for providing...
US20090260868 Printed circuit board and method of manufacturing the same  
The printed circuit board includes the via formed with the electroplating layer unlike a conventional via formed with an electroless plating layer and an electroplating layer and having a...
US20090255720 Ground-plane slotted type signal transmission circuit board  
A ground-plane slotted type signal transmission circuit board is proposed, which is designed for use with a high-speed digital signal processing system for providing a low-loss signal transmission...
US20090257209 Semiconductor package and associated methods  
A semiconductor package and associated methods, the semiconductor package including a substrate including a socket, and connection terminals including a solder ball and a supporting portion...
US20090251449 ARRAY SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND DISPLAY APPARATUS HAVING THE SAME  
A first wiring is formed on an array substrate, such that the first wiring has a first protrusion. A second wiring is formed on a different layer from that of the first wiring, such that a portion...
US20090250251 Circuit Device and Method for Manufacturing the Circuit Device  
In a circuit device where a wiring layer, an insulating resin and a circuit element are stacked together in such a manner as to embed a bump structure into the insulating resin, the connection...
US20090242261 PRINTED WIRING BOARD AND ASSOCIATED MANUFACTURING METHODOLOGY  
A printed wiring board disperses stress throughout an inner conductor layer, ensuring the flatness of a substrate. Embedding wires into the outermost insulating layer and forming the wires in a...
US20090236138 MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME  
A coreless wiring board has no core board but a laminated structure in which a conductor layer and resin insulating layers are alternately laminated into a multilayer. Each of the resin insulating...
US20090236137 Method for Forming Resist Pattern, Method for Producing Circuit Board, and Circuit Board  
There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for...
US20090229874 MULTILAYER WIRING BOARD  
A coreless wiring board has no core board but a laminated structure in which a conductor layer and resin insulating layers are alternately laminated into a multilayer. Each of the resin insulating...
US20090229875 Printed circuit board having fine pattern and manufacturing method thereof  
A printed circuit board having a fine pattern and related manufacturing method that includes providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first...
US20090223708 COAXIAL CONNECTOR MOUNTED CIRCUIT BOARD  
A circuit board has a multilayer substrate having a surface earth pattern and signal line on a surface of the multilayer substrate and an inner earth pattern in the multilayer substrate; a...
US20090218123 MULTILAYER INTERCONNECTION BOARD  
A multilayer interconnection board includes a plurality of laminated ceramic layers. Wiring electrodes are disposed on principal surfaces of the ceramic layers, and dot patterns are arranged around...
US20090219703 PRINTED CIRCUIT BOARD, METHOD FOR FORMING FRAME GROUND FOR PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE  
According to one embodiment, there is provided a printed circuit board, including a frame ground portion in which conductor patterns are formed around a board-fixation hole, and a plurality of...
US20090211793 SUBSTRATE MODULE, METHOD FOR MANUFACTURING SUBSTRATE MODULE, AND ELECTRONIC DEVICE  
In a substrate module of the present invention, a connection electrode is provided on a first surface of a substrate, and a first penetrating hole portion is running through the substrate in a...
US20090211794 Wiring board and manufacturing method therefor  
In order to provide a wiring board having a structure different from a conventional structure and a manufacturing method therefor, a wiring board ( 1 ) includes: a first principal surface ( 6 a );...
US20090211798 PGA TYPE WIRING BOARD AND METHOD OF MANUFACTURING THE SAME  
A PGA type wiring board includes a wiring board to which a head portion of a pin is joined to a pad portion with solder interposed therebetween, and a pin fixing plate having a through hole formed...
US20090211799 Printed wiring board and manufacturing method therefor  
The present invention provides a printed wiring board which can prevent a plating failure in a connection hole such as a via to be formed in the printed wiring board, thereby can enhance the...
US20090205860 WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR PACKAGE  
In a wiring substrate in which plural wiring layers and insulating layers are alternately stacked and the adjacent wiring layers are electrically connected through a via hole formed in the...
US20090205862 Printed circuit board and manufacturing method thereof  
A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include a first insulation layer, a second insulation layer stacked over...
US20090200069 MULTILAYER PRINTED WIRING BOARD  
A multilayer printed wiring board 10 includes: a mounting portion 60 on the top surface of which is mounted a semiconductor element that is electrically connected to a wiring pattern 32 ,...
US20090196003 WIRING BOARD FOR SEMICONDUCTOR DEVICES, SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND MOTHERBOARD  
In a wiring board according to the present invention, a substrate, a solder resist provided on the substrate, a land, a wiring line, and a connection portion connecting the wiring line and the...
US20090194322 DEVICE MOUNTING BOARD AND MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR MODULE  
A device mounting board has a double-layer wiring structure where a first wiring layer and a second wiring layer are stacked together with an insulating layer held between the first and second...
US20090188710 SYSTEM AND METHOD FOR FORMING FILLED VIAS AND PLATED THROUGH HOLES  
Methods and apparatus for creating a filled, backdrilled plated through hole in a printed circuit board are disclosed. According to one aspect of the present invention, a method includes defining a...
US20090188711 GROUND STRADDLING IN PTH PINFIELD FOR IMPROVED IMPEDANCE  
High-speed communication links are improved by having differential pairs of traces in a connector pinfield on layers of a multilayer printed circuit board (PCB) to straddle respective rows of...
US20090183908 Method for Manufacturing Conductive Contact Holder, and Conductive Contact Holder  
A method for manufacturing a conductive contact holder includes forming, from an insulating material, a holder member for holding a plurality of conductive contacts; forming, from a conductive...
US20090183909 Coreless substrate  
A coreless substrate having a plurality of function pads, etched from a metal sheet and having a protruded shape; an insulating layer, the insulating layer being formed on one side of the function...
US20090184910 CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME  
One or more embodiments of the present disclosure relate to a circuit board having a substrate and a plurality of differential signal lines formed on the substrate and transmitting differential...
US20090173532 WIRING BOARD HAVING A NON-THROUGH HOLE WITH A VENT HOLE  
A wiring board has a substrate having a first surface and a second surface opposite to the first surface, at least one wiring layer being formed between the first surface and the second surface. A...
US20090174072 SEMICONDUCTOR SYSTEM HAVING BGA PACKAGE WITH RADIALLY BALL-DEPOPULATED SUBSTRATE ZONES AND BOARD WITH RADIAL VIA ZONES  
A printed circuit board has contact lands ( 710 ) forms an array with depopulated elongated zones ( 820 ), which are radially oriented from the board center towards the board periphery. Conductive...
US20090166077 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME  
A wiring board is provided. The wiring board includes: a core substrate; wiring layers formed on the core substrate; and a reinforcement conductor which penetrates through the core substrate and...
US20090166073 CERAMIC SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND ELECTRICAL DEVICE USING THE SAME  
Provided are a ceramic substrate, a method of manufacturing the same, and an electrical device using the same. A ceramic substrate includes a first laminated body, a second laminated body and an...
US20090166076 Insulating material and printed circuit board having the same  
An insulating material, a printed circuit board that utilizes the insulating material, and a method of manufacturing the printed circuit board. The method includes perforating at least one...
US20090166079 MICROSTRUCTURE AND METHOD OF MANUFACTURING THE SAME  
A microstructure that comprises an insulating base material having through micropores filled with metal at a high filling ratio and that can be used as an anisotropically conductive member is...
US20090166078 MULTI-LAYERED WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME  
In a multi-layered wiring substrate according to an exemplary aspect of the present invention, a conductor formed in an edge face area functions as a pad for mounting a connector.
US20090159325 ANISOTROPICALLY CONDUCTIVE CONNECTOR AND ANISOTROPICALLY CONDUCTIVE CONNECTOR DEVICE  
An anisotropically conductive connector and an anisotropically conductive connector device. The anisotropically conductive connector includes a supporting member, a plurality of through-holes each...
Matches 1 - 50 out of 144 1 2 3 >