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US20140008105 CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD  
A circuit board is formed such that a printed circuit board is connected to an injection molded circuit board. An internal circuit conductor is exposed at conductor part at a printed circuit board...
US20140158407 PRINTED CIRCUIT BOARD WITH VISIBLE TRIANGULAR SHAPED TRACES  
A printed circuit board includes a transparent base layer, a conductive trace layer, and a transparent cover layer. The conductive trace layer is formed on a first surface of the base layer, and...
US20150156870 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
A printed circuit board includes a substrate, and a wiring provided on the substrate. The wiring includes a copper-based metal wire provided on the substrate and a surface-treated layer provided...
US20110019125 MOUNTED BOARD, MOUNTED BOARD SET, AND PANEL UNIT  
Disclosed is a mounted board (11) comprising a feed wire (13) for supplying a current to a circuit element (21). In this mounted board (11), when a region of a mounting surface (12A) of the...
US20150034365 METHOD FOR MANUFACTURING WIRING BOARD AND WIRING BOARD  
A method for manufacturing a wiring board includes preparing a wiring board having an insulation layer, a conductive pattern and a solder-resist layer laminated such that the solder-resist layer...
US20140158408 MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME  
A multi-layer wiring board comprises: a plurality of multi-layer wiring units each having a plurality of printed wiring boards stacked therein via an adhesive layer, the printed wiring board...
US20130214397 MULTILAYER WIRING BOARD AND ELECTRONIC DEVICE  
A ground layer of a multilayer wiring board includes: a first clearance through which a first differential via is inserted without coming into contact with the ground layer; and a second clearance...
US20140182888 TOUCH PANEL  
A touch panel has a substrate on which a first conductive layer, an insulating layer, a second conductive layer and a protective layer are formed in order. The second conductive layer and the...
US20130333924 MULTILAYER ELECTRONIC SUPPORT STRUCTURE WITH INTEGRAL METAL CORE  
A laminated multilayer electronic support structure comprising a dielectric with integral vias and feature layers and further comprising a planar metal core characterized by a thickness of less...
US20140182890 ELECTRICAL CABLE ASSEMBLY  
In accordance with an embodiment, an electrical cable can be configured to electrically connect to contact pads that are carried by a substrate. The electrical cable can include at least one, such...
US20140182891 GEOMETRICS FOR IMPROVING PERFORMANCE OF CONNECTOR FOOTPRINTS  
In accordance with the various embodiments disclosed herein, an improved electrical connector footprint, such as on printed circuit boards (PCB), is described. For example, antipads can have a...
US20120307461 Flexible Circuit Board and Electric Device  
A flexible circuit board is provided. The flexible circuit board includes a conductive path and a shell that at least regionally surrounds the conductive path. The shell is fastened to the...
US20080105670 Printed Circuit Board or Card Comprising a Heating Wire  
The invention relates to a printed circuit board or card comprising an electric circuit. In order to improve printed circuit boards of this type, the invention calls for at least one electrically...
US20150216049 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME  
A wiring board includes a first interlayer insulation layer, a second interlayer insulation layer formed on the first interlayer insulation layer and having an opening portion, first conductive...
US20130008698 MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE  
A multilayer wiring board having via-hole conductors which electrically connects a plurality of wirings arranged in a manner such that an insulating resin layer is placed between the wirings,...
US20140367147 INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD  
Disclosed herein are an insulating resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board. More specifically, disclosed herein are an insulating...
US20140238726 EXTERNAL MOISTURE BARRIER PACKAGE FOR CIRCUIT BOARD ELECTRICAL COMPONENT  
Moisture barrier packages for electrical components mountable to a circuit board include a cover and a base configured to provide a metal to metal joint that hermitically seals an electrical...
US20140138126 METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER WIRING BOARD OBTAINED THEREBY  
In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste...
US20120193128 PRINTED CIRCUIT BOARD  
Embodiments of the present invention provide a multi layered printed circuit board, PCB, with via holes connecting different signal layers of the PCB. The via holes are connected to pads in the...
US20140218325 CONDUCTIVE SHEET, TOUCH PANEL, AND DISPLAY DEVICE  
In the mesh pattern of the conductive sheet of the invention in which openings having different shapes are arrayed in plan view, a standard deviation of an area of each of the openings is equal to...
US20130025914 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME  
A wiring board has wiring board has a first rigid wiring board having an accommodation portion and a conductor, a second rigid wiring board accommodated in the accommodation portion and having a...
US20120181065 Multi-Layered Circuit Board Device  
A multi-layered circuit board device includes an isolative layer and a wiring layer sequentially provided on a circuit board in a PCB, ceramic, LTCC or aluminum nitride build-up process. Thus, the...
US20130176700 ELECTRONIC DEVICES WITH INTERNAL MOISTURE RESISTANT COATINGS  
A moisture-resistant electronic device includes at least one electronic component at least partially covered by a moisture-resistant coating. The moisture-resistant coating may be located within...
US20150173173 CIRCUIT BOARD WITH THERMAL CONTROL  
A printed circuit board comprises a base material containing at least one conductor path and at least one heat-conducting path forming a heating layer embedded in the base material for generating...
US20140182893 PRINTED CIRCUIT BOARD  
A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and...
US20140353006 MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME  
A multilayer circuit board includes a wiring board, a first adhesive sheet, an electronic device, and a second adhesive sheet. The wiring board includes a first wiring layer and a second wiring...
US20150027754 RESIN COMPOSITION, LAYERED PRODUCT, MULTILAYER PRINTED WIRING BOARD, MULTILAYER FLEXIBLE WIRING BOARD AND MANUFACTURING METHOD OF THE SAME  
A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate...
US20140326485 PRINTED CIRCUIT BOARD WITH SHALLOW SOLDER PAD AND METHOD FOR MANUFACTURING THE SAME  
An exemplary printed circuit board includes a base, solder pads, and signal traces. The base includes outer surfaces. The signal traces having a first height relative to the base are formed on the...
US20120103664 MULTILAYERED PRINTED CIRCUIT BOARD, MORE PARTICULARLY FLAME-RESISTANT AND/OR SMOKE-SUPPRESSING MULTILAYERED PRINTED CIRCUIT BOARD  
In the case of a multilayered printed circuit board (20), more particularly a flame-resistant and/or smoke-suppressing multilayered printed circuit board, consisting of a plurality of...
US20140102765 Multilayer Electronic Structures with Improved Control of Dielectric Thickness  
A method of fabricating a multilayer electronic support structure comprising electroplating copper substructures, laying a dielectric pre-preg comprising a polymer resin over the copper...
US20110253422 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME  
A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection...
US20120018193 Multi layer circuit board and method of manufacturing the same  
There are provided a multi layer circuit board and a method of manufacturing the same. The multi layer circuit board includes each of ceramic boards having wiring patterns formed and stacked...
US20140116755 LAMINATE CIRCUIT BOARD STRUCTURE  
A laminate circuit board structure which includes a first circuit metal layer, a first insulation layer, at least one second circuit metal layer, at least one second insulation layer and a support...
US20150075843 MULTILAYER WIRING BOARD  
A multilayer wiring board includes a first metal foil wiring layer that has at least two or more layers of metal foil wiring lines and is arranged on a mounting surface side for mounting a surface...
US20110284268 FLEXIBLE CIRCUIT COVERFILM ADHESION ENHANCEMENT  
Provided is a means of improving the adhesion between a flexible circuit coverfilm and an encapsulant material in an inkjet printer application.
US20150041183 CHIP BOARD PACKAGE STRUCTURE  
A chip board package structure includes a circuit board part, a chip board part and a solder used to solder the circuit board part and the chip board part. A chip on the chip board part is...
US20120247811 COMPOSITE CIRCUIT BOARD WITH FRACTURABLE STRUCTURE  
A composite circuit board with fracturable structure includes a first flat cable and first signal transmission lines formed on the first flat cable. A second flat cable is stacked on and bonded to...
US20140071639 FLEXIBLE WIRING BOARD, METHOD FOR MANUFACTURING SAME, MOUNTED PRODUCT USING SAME, AND FLEXIBLE MULTILAYER WIRING BOARD  
A flexible wiring board includes an electric insulating base material including an incompressible member having bendability and a thermosetting member having bendability; a first wiring and a...
US20130192880 PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD  
A printed wiring board includes an insulative substrate, a wiring portion which is formed on a surface of the insulative substrate and has a predetermined wiring pattern, an insulative layer which...
US20150136446 PRINTED CIRCUIT BOARD  
Embodiments of the invention provide a printed circuit board having a structure in which a plurality of insulating layers having a metal wiring formed on one surface thereof are stacked, wherein a...
US20140083747 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD  
A printed wiring board includes an outermost interlayer resin insulation layer, n outermost conductive layer formed on the outermost interlayer resin insulation layer and including multiple...
US20110316148 WIRING SUBSTRATE  
A wiring substrate includes plural wiring layers and plural insulation layers being alternately stacked one on top of the other. The plural insulation layers are formed with insulation resin...
US20130037310 EPOXY RESIN COMPOSITION FOR CIRCUIT BOARD, PREPREG, LAMINATE, RESIN SHEET, LAMINATED BASE MATERIAL FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE  
Provided is an epoxy resin composition for a circuit board including an epoxy resin (A); an inorganic filler (B); and a cyclic or cage-shape siloxane compound (C) having at least two Si—H bonds or...
US20140000940 WIRING BOARD  
A wiring board includes an insulating substrate having a side surface including a protrusion portion or a recess portion and a lower surface having a metal member bonded thereto; a wiring...
US20150053457 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
Disclosed herein are a printed circuit board and a method of manufacturing the same. According to the preferred embodiment of the present invention, the printed circuit board includes: a glass...
US20150136447 MULTILAYER WIRING BOARD  
A multilayer wiring board has a strip structure comprising a core material in which a ground pattern is disposed on one side of an insulating layer and a strip line is disposed on the other side,...
US20110290536 WIRING SUBSTRATE  
A wiring substrate includes a wiring layer, and an insulating layer configured to cover the wiring layer, wherein the insulating layer is recognized to have any color in a range from purple to blue.
US20130314954 POWER SUPPLY INPUT ROUTING  
One embodiment of a power supply input routing apparatus can include a multilayer printed circuit board configured to accept only an alternating current (AC) line voltage, return and ground...
US20120234580 CIRCUIT BOARD  
A multilayer circuit board, comprising: a plurality of printed circuit board layers arranged stacked together; and a conductively plated via; a surface of a through which the via passes comprises...
US20150053461 PANEL  
A panel including a substrate, a plurality of wirings and a protection stacked layer is provided. The substrate has a device area, a bonding area and a wiring area connected between the device...