Matches 1 - 50 out of 284 1 2 3 4 5 6 >


Match Document Document Title
US20130264030 STRUCTURAL CONFIGURATION OF A HEAT EXCHANGER DOOR FOR AN ELECTRONICS RACK  
A heat exchanger door is provided which includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening...
US20140027094 WATER DISPENSER  
A water dispenser including a heat-exchanger, a heater, a water-storage tank, and a faucet is provided mainly. The heat-exchanger has a first/second guiding-channel, a first inlet/outlet...
US20050150635 Modular cooling loop system  
A modular cooling loop system for cooling a manufacturing process machine connects to a chilled water system and the manufacturing process machine. The cooling loop system includes a movable...
US20150241144 THERMAL REGULATION SYSTEM FOR AT LEAST ONE ELECTRONIC MODULE EMBEDDED ONBOARD AN AIRCRAFT  
Heat regulation system (1) for at least one equipment item (2) embedded onboard an aircraft, includes a thermal regulation circuit (5) connected to the equipment item(s) (2). The thermal...
US20150013940 COMMONLY SUBMERSED, VERTICALLY REMOVABLE SERVERS IN RACK  
Apparatus, systems, and method for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a...
US20080073061 Variable depth microchannels  
A channel heat exchanger and cooling system with plan-wise variable rate of cooling that corresponds, in part, to a plan-wise variable heat flux and a method of manufacturing and using same.
US20110232863 INTEGRAL COLD PLATE AND STRUCTURAL MEMBER  
A cold plate assembly is provided having a cold plate with a generally planar member that provides a support surface. The support surface is configured to support a heat generating device. A...
US20090101308 MICRO-CHANNEL PULSATING HEAT PUMP  
A heat pump device and method in which micro-channel embedded pulsating heat pumps are incorporated into a substrate. A volume of fluid in a vacuum is introduced into a micro-channel which will...
US20100300652 Heat Dissipating System  
A heat dissipating system includes an electronic device, a refrigeration device, a thermal connector, a cold plate, and a pipe. The cold plate is located in the electronic device for absorbing the...
US20050067147 Loop thermosyphon for cooling semiconductors during burn-in testing  
A burn-in testing cooling system including an evaporator comprising an upright tubular body having an interior surface and a central passageway with a wick disposed on the interior surface of the...
US20140338863 Supply Module for Supplying an Effector System and Effector System with a Supply Module  
A supply module for supplying a weapon system includes an electric storage device and a thermal storage device that stores coolant. The supply module also includes at least one electrical...
US20060137860 Heat flux based microchannel heat exchanger architecture for two phase and single phase flows  
An apparatus, system, and method to cool a non-uniform heat source using a micro-channel heat exchanger.
US20060254752 Radiator and heatsink apparatus having the radiator  
A radiator includes: an inlet header having a hollow shape and being provided with an inlet for the coolant to enter; a plurality of flat tubes connecting to the inlet header on one end; and an...
US20060042785 Pumped fluid cooling system and method  
The present invention is a pumped fluid cooling system and method. The pumped fluid cooling system and method includes new relative magnitudes of advection, convection and spreading components of...
US20050241803 Liquid cooling loop using tubing and bellows for stress isolation and tolerance variation  
A liquid loop cooling apparatus includes rigid or semi-rigid tubing enclosing an interior bore or lumen within which a cooling fluid can circulate among at least one heat-generating component in a...
US20150244044 TRACTION BATTERY THERMAL PLATE MANIFOLD  
A traction battery system for a vehicle is provided. The system may include a plurality of battery cells, a thermal plate, and an inlet manifold. The thermal plate may support the battery cells...
US20140342201 ELECTRICAL STORAGE DEVICE THERMAL MANAGEMENT SYSTEMS  
A thermal management system for a high density power source is disclosed. The system includes a housing with an interior divided into first and second compartments. The first compartment is...
US20070227709 Multi device cooling  
A micro scale cooling system comprises a first heat exchanger thermally coupled to a first heat source. The cooling system also has a second heat exchanger thermally coupled to a second heat...
US20150200427 BATTERY THERMAL MANAGEMENT SYSTEM FOR ELECTRIFIED VEHICLE  
A battery thermal management system according to an exemplary aspect of the present disclosure includes, among other things, a heat spreader, a coolant channel attached to the heat spreader and a...
US20080264604 COOLING APPARTAUS, COOLED ELECTRONIC MODULE AND METHODS OF FABRICATION EMPLOYING A MANIFOLD STRUCTURE WITH INTERLEAVED COOLANT INLET AND OUTLET PASSAGEWAYS  
A cooling apparatus and method of fabrication are provided for facilitating removal of heat from an electronic device. The cooling apparatus includes a manifold structure having a plurality of...
US20150020997 CYCLING HEAT DISSIPATION MODULE  
A cycling heat dissipation module is used for removing the heat generated by a heat-generating element of a circuit board and includes at least one main body and at least one conducting pipe. The...
US20140247555 SELECTIVE CLAMPING OF ELECTRONICS CARD TO COOLANT-COOLED STRUCTURE  
Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an...
US20070089858 Waterblock for cooling electrical and electronic circuitry  
A waterblock and accompanying cooling tube for carrying away heat generated by electrical or electronic components mounted on a circuit board or other substrate are disclosed. The cooling tube is...
US20070095505 Starter controller coolant outlet flow kit  
The starter controller coolant outlet flow kit includes a hollow metallic reservoir pipe having a proximal end and a distal end. A side radial hole near the proximal end is provided for a soldered...
US20110232864 COMPACT TWO SIDED COLD PLATE WITH THREADED INSERTS  
A structural cold plate assembly includes a support structure including first and second opposite sides supporting corresponding cold plates and an insert. The insert defines a portion of a fluid...
US20070289719 Cooling apparatus and system thereof  
A cooling apparatus for dissipating a heat from a heat source by a fluid includes a cooling fin set, a water-cooling pipe, and a heat tube. The water-cooling pipe and the heat tube are penetrating...
US20050224212 Diffusion bonded wire mesh heat sink  
A heat sink (20) comprises a heat sink monolith (23) and a cover (22). The heat sink monolith (23) comprises a thermal transfer plate (25) and a wire mesh structure (26). The thermal transfer...
US20080169087 Evaporative compact high intensity cooler  
An evaporative compact high intensity cooler (ECHIC) for transferring heat from a heat source along a heat conduction surface of the heat source with a two-phase coolant, comprises a flow passage...
US20060254762 3-Dimensional high performance heat sinks  
A heat sink having a very high heat transfer capability may be made from a plurality of unit elements. Each unit element includes a series of inlet tubes having a range of diameters and a series...
US20090008061 Easily assembled cooler  
A cooler capable of reducing the fabrication cost is provided. In the cooler, in which electronic parts 6 are held between neighboring tubes 1, each of the tubes 1 is formed by joining the edges...
US20150034271 LIQUID COOLING APPARATUS  
Embodiments of the present invention disclose a liquid cooling apparatus, which includes a cold plate (202), a fast connector (204), and a first interface (2011), where the fast connector (204)...
US20070119573 Synthetic jet ejector for the thermal management of PCI cards  
A method for constructing a thermal management system is provided herein. In accordance with the method, a fan (405) is provided which is adapted to provide a global flow of fluid through the...
US20070246205 Heat dispensing device with radially flowing coolant  
A heat dispensing device includes a base having a protrusion at an recessed space thereof and the protrusion is located at a center from which the fins extend radially. The base includes an inlet...
US20070034355 HEAT-DISSIPATION STRUCTURE AND METHOD THEREOF  
A heat-dissipation structure mainly including a heat-absorbing head, a heat pipe, and a tube jacket is provided. The heat pipe includes a heated end and a cooling end, wherein the heated end of...
US20060162900 Structure of radiator  
The present invention is a structure of radiator. More specifically, it is a radiator in which an inner cylinder and an outer cylinder are correspondingly sheathed, and appropriate space is kept...
US20080264608 COOLING MECHANISM COMPRISING A HEAT PIPE AND WATER BLOCK  
A cooling mechanism comprises a heat pipe coupled to a water block.
US20070131403 MICROCHANNEL HEAT EXCHANGER  
A heat exchanger is provided for transferring heat to a working fluid. The heat exchanger comprises a housing having a plurality of grooves formed in a surface of the housing. The grooves have a...
US20090283244 Stacked and Redundant Chip Coolers  
A cooler includes a base layer, a cooling layer including at least one inlet slot and at least one outlet slot for flowing a coolant across a cooling structure including a plurality of staggered...
US20090139693 TWO PHASE MICRO-CHANNEL HEAT SINK  
A method and system for providing a heat sink are described. The heat sink includes at least one inlet, at least one outlet, a plurality of flow micro-channels, and at least one cross-connect...
US20070017660 Heatsink with adapted backplate  
A fluid-cooled heatsink and backplate, for example, for an electronic power module in an automotive application are provided, the backplate formed with a set of grooves, and the heatsink formed...
US20070256815 Scalable liquid cooling system with modular radiators  
A scalable and modular cooling system is disclosed. The cooling system includes an air plenum with a plurality of expansion slots. Each expansion slot is configured to receive a modularly...
US20070295480 MULTI-FLUID COOLING SYSTEM, COOLED ELECTRONICS MODULE, AND METHODS OF FABRICATION THEREOF  
A multi-fluid cooling system and methods of fabrication thereof are provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure...
US20070039717 Heat exchanger unit and method of manufacturing the same  
A heat exchanger unit has tubes each having a body section and at least one of an inner pipe section and an outer pipe section extending from the body section and defining an opening at an end....
US20150255835 CONNECTION APPARATUS AND METHOD FOR CONTROLLING THE TEMPERATURE OF BATTERY CELLS, AND TEMPERATURE-CONTROL APPARATUS, BATTERY MODULE, BATTERY PACK, BATTERY AND BATTERY SYSTEM  
Connection apparatus (500; 5001, 5002) for controlling the temperature of a battery cell (1001, 1002), characterized by: a fastening device for fastening the connection apparatus (500; 5001, 5002)...
US20090000769 Temperature Controlled Loadlock Chamber  
A temperature controlled loadlock chamber for use in semiconductor processing is provided. The temperature controlled loadlock chamber may include one or more of an adjustable fluid pump, mass...
US20060028800 Condensation accumulation removal apparatus and method  
A condensate removal apparatus with a wick structure, method for condensate removal and system for condensate removal using such a wick structure are described herein.
US20090188264 Modular in-frame pumped refrigerant distribution and heat removal system  
An apparatus, method and system are provided for a modular in-frame pumped refrigerant distribution system. Specifically, a micro-channel heat exchanger is positioned in an equipment cabinet close...
US20070119570 WATER-COOLING HEAT DISSIPATION SYSTEM  
A heat dissipation system including at least a water block, a pump, a water cooler and a plurality of hard tubes is provided. The water block is used to contact a heat source, and the pump is used...
US20070109746 Liquid cooling of electronic system and method  
Various embodiments of a cooling system and method for disassembling a cooling system are provided. In one embodiment, a system is provided that comprises a closed circulation path containing...
US20070107873 Water-Cooling Head and Method for making the same  
A water-cooling head and a method for making the same. A first cover and a second cover form a water-cooling head. An intake pipe and a drainpipe extend from both ends of the first cover. A...

Matches 1 - 50 out of 284 1 2 3 4 5 6 >