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US20090294017 |
OPTICAL CONTACTING ENABLED BY THIN FILM DIELECTRIC INTERFACE
A method of assembling precision optical or optomechanical components of otherwise incompatible chemistry that provides first and second components having respective first and second polished...
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US20090277590 |
Device and method for corona treatment of flat material
The invention relates to a device and a method for the corona treatment of flat material ( 30 ) using a cylindrical transport electrode ( 1 ) that can be rotated in such a way as to transport the...
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US20090252939 |
Wafer structures and wafer bonding methods
Wafer structures and wafer bonding methods are provided. In some embodiments, a wafer bonding method includes providing a conductive wafer and a plurality of insulating wafers, the conductive wafer...
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US20090250163 |
Process for Production of Resin Composite Molded Article
The present invention relates to a process for producing a resin composite molded article comprising bonding a molded article (A) of a resin A which contains a polymer containing an alicyclic...
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US20090246537 |
BONDING METHOD, BONDED STRUCTURE, LIQUID DROPLET DISCHARGING HEAD, AND LIQUID DROPLET DISCHARGING APPARATUS
A bonding method includes a first process that includes plasmatizing a first gas including a raw gas containing a siloxane (Si—O) bond at a reduced-pressure atmosphere, substituting the first gas...
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US20090205774 |
Method of Adhesively Bonding a Strip of Flexible Fabric to a Substrate
The invention relates to a method of bonding a strip of flexible sheet onto at least one flexible or rigid support, said sheet and said support including at least one continuous fine metal foil...
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US20090164381 |
METHOD OF MAKING SECURE PAYMENT CARDS
A method of making secure payment cards for financial transactions over networks includes building payment card blanks by integrating plastic, circuit, battery, semiconductor chips, magnetic...
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US20090145546 |
ELECTRODE BONDING METHOD AND PART MOUNTING APPARATUS
An electrode bonding method according to the present invention includes: a plasma cleaning step of irradiating an electrode surface to be cleaned of at least either one of a part, such as a...
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US20090136767 |
BONDING METHOD AND BONDED BODY
A bonding method of bonding two base members together through a bonding film having a fine pattern at low cost, and a bonded body with the bonding film which is formed using the bonding method are...
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US20090068453 |
IMPACT-RESISTANT LIGHTWEIGHT POLYMERIC LAMINATES
Bonded polymeric film laminates wherein core polymer film layers are individually coated on at least one side with a heat fusible polymer layer and fusion bonded together by the application of heat...
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US20090053461 |
Method and Apparatus for Making Carpet
Methods and apparatuses for making improved carpet are disclosed comprising the use of plasma discharge units to treat carpet backing surfaces to improve the adhesion of carpet backing layers, the...
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US20090053965 |
METHOD FOR MANUFACTURING DISPLAY DEVICE AND COMPOSITION OF SEALANT THEREFOR
A method for manufacturing a display device is disclosed, which includes forming a main sealant which surrounds a display region on a first substrate and an auxiliary sealant which is disposed...
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US20090044905 |
METHOD OF PROVIDING GRAPHICS TO A SPORTS BOARD
A method of providing a sports board with graphics is described. The method includes providing a graphics layer to the outer surface of the sports board. In one embodiment, the graphics layer is...
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US20090014119 |
Process for the Manufacture of Bonded Laid Structures
A process for manufacturing bonded laid structures from yarns, characterized in that a thermally fusible material is applied to the yarns at least at the contact or intersection points via a...
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US20080316628 |
Density filter, method of forming the density filter and apparatus thereof
A film coating method enables, when forming film layers in response to optical characteristics on a substrate, to coat gradation range layers of decreasing thickness without distributions, and to...
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US20080280113 |
Resin Film and Method for Producing Same, Printed Matter, Label and Resin Molded Article
A resin film comprising a multilayer structure of a print layer (A), a gloss-imparting layer (B) and a substrate layer (c) as laminated in that order, wherein the print layer (A) comprises from 90...
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US20080274323 |
Process for Producing an Optical Recording Medium with Several Stages and Medium Obtained Thereby
The recording medium comprises at least a first (L 1 ) and a second (L 2 ) micro-structured stage assembled by an adhesive layer ( 4 ) and arranged between micro-structured bottom ( 2 ) and top...
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US20080200008 |
BONDING INTERFACE QUALITY BY COLD CLEANING AND HOT BONDING
The invention relates to improvements in a method for molecularly bonding first and second substrates together by placing them in surface to surface contact. The improvement includes, prior to...
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US20080193775 |
Composite Element, Especially a Window Pane
Item comprising a first transparent thermoplastic (i) coated with a coating (ii) comprising at least one organosilicon compound, wherein, on at least one portion of the surface, on the side facing...
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US20080187765 |
Composite Element, Especially a Window Pane
Item comprising glass, wherein at least one portion of the surface of the glass has been adhesive-bonded to a thermoplastic polyurethane without any chemical adhesion promoter.
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US20080112854 |
MICROFLUIDIC APPARATUS INCLUDING MICROFLUIDIC DEVICE AND METHOD OF MANUFACTURING THE MICROFLUIDIC APPARATUS
A microfluidic apparatus includes at least one microfluidic device in which flow paths are formed, a device receiving layer including a receiving part into which the at least one microfluidic...
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US20080099134 |
Method for fixing plastic substrate, circuit substrate and method for producing same
A method for fixing a plastic substrate, comprising (1) applying or sticking an adhesive material onto a supporting substrate to form an adhesive material layer on the supporting substrate, (2)...
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US20080041517 |
Assembling Two Substrates by Molecular Adhesion, One of the Two Supporting an Electrically Conductive Film
A process assembling first and second substrates on contact faces by molecular bonding. The first substrate contact face has an electrically conducting layer on at least part of its surface. The...
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US20080029211 |
SELF-PASSIVATING PLASMA RESISTANT MATERIAL FOR JOINING CHAMBER COMPONENTS
Embodiments of the invention provide a robust bonding material suitable for joining semiconductor processing chamber components. Other embodiments provide semiconductor processing chamber...
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US20080000581 |
Preparation of laminated composite substrates using coated oriented polymeric film
Disclosed is the preparation of a laminated composite structure. Such laminate composites comprise a base layer comprising a base substrate; at least one polymeric layer laminated onto a surface of...
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