Matches 1 - 46 out of 46


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US20110147072 METHOD FOR SURFACE TREATMENT OF COPPER AND COPPER  
An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper...
US20140209215 COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME  
A copper-based alloy wire made of a material selected from the group consisting of a copper-gold alloy, a copper-palladium alloy and a copper-gold-palladium alloy is provided. The alloy wire has a...
US20110005644 COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC PARTS  
A copper alloy material for an electric/electronic part, containing Co 0.5 to 2.5 mass % and Si 0.1 to 1.0 mass %, at a ratio of Co/Si of 3 to 5 in terms of mass ratio, with the balance of Cu and...
US20130075272 HIGHLY PURE COPPER ANODE FOR ELECTROLYTIC COPPER PLATING, METHOD FOR MANUFACTURING SAME, AND ELECTROLYTIC COPPER PLATING METHOD  
Provided are a highly pure copper anode for electrolytic copper plating, a method for manufacturing the same, and an electrolytic copper plating method using the highly pure copper anode. The...
US20130048162 COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICE, AND COPPER ALLOY ROLLED MATERIAL FOR ELECTRONIC DEVICE  
One aspect of this copper alloy for an electronic device is composed of a binary alloy of Cu and Mg which includes Mg at a content of 3.3 to 6.9 atomic %, with a remainder being Cu and inevitable...
US20140283961 COPPER ALLOY FOR ELECTRONIC EQUIPMENT, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC EQUIPMENT, ROLLED COPPER ALLOY MATERIAL FOR ELECTRONIC EQUIPMENT, AND PART FOR ELECTRONIC EQUIPMENT  
This copper alloy for electronic devices includes Mg at a content of 3.3 at % or more and 6.9 at % or less, with a remainder substantially being Cu and unavoidable impurities. When a concentration...
US20140302342 COPPER WIRE AND METHOD OF MANUFACTURING THE SAME  
A copper wire includes a copper wire rod including 5 to 55 mass ppm of Ti, 3 to 12 mass ppm of sulfur, and 2 to 30 mass ppm of oxygen with the balance copper and inevitable impurities, a first...
US20090133784 COPPER ALLOY THIN FILMS, COPPER ALLOY SPUTTERING TARGETS AND FLAT PANEL DISPLAYS  
A Cu alloy thin film contains Fe and P with the balance being substantially Cu, in which the contents of Fe and P satisfy all the following conditions (1) to (3), and in which Fe2P is precipitated...
US20100101687 High strength copper alloy for electronic parts and electronic parts  
A copper base alloy for electronic parts containing 2.0 to 4.0 mass % of Ti and 0.05 to 0.50 mass % of one or more of Fe, Co, Ni, Si, Cr, V, Nb, Zr, B and P, wherein the content of other impurity...
US20140096877 COPPER ALLOY FOR ELECTRONIC DEVICES, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICES, COPPER ALLOY PLASTIC WORKING MATERIAL FOR ELECTRONIC DEVICES, AND COMPONENT FOR ELECTRONIC DEVICES  
An aspect of this copper alloy contains: Mg at a content of 3.3 at % or more to less than 6.9 at %; and either one or both of Cr and Zr at respective contents of 0.001 at % to 0.15 at %, with the...
US20140290805 COPPER ALLOY AND COPPER ALLOY FORMING MATERIAL  
Copper alloys according to first to third aspects contain Mg at a content of 3.3% by atom to 6.9% by atom, with the balance substantially being Cu and unavoidable impurities, wherein an oxygen...
US20090286083 Copper wire for a magnet wire, magnet wire using same, and method for fabricating copper wire for a magnet wire  
A copper wire for a magnet wire, a magnet wire using same, and a method for fabricating the copper wire for the magnet wire. The copper wire for the magnet wire is made from a casting material....
US20140212324 FINE CRYSTALLITE HIGH-FUNCTION METAL ALLOY MEMBER AND METHOD FOR MANUFACTURING SAME  
Provided by the present invention are a fine crystallite high-function metal alloy member, a method for manufacturing the same, and a business development method thereof, in which a crystallite of...
US20050247384 Copper wire and method and equipment for the production of copper wire  
A copper wire has an average copper content of at least 99.95 wt.% and at least one accompanying element alloyed with the copper. The ratio of the percentage by weight of the accompanying element...
US20140283962 COPPER ALLOY FOR ELECTRONIC DEVICES, METHOD OF MANUFACTURING COPPER ALLOY FOR ELECTRONIC DEVICES, COPPER ALLOY PLASTIC WORKING MATERIAL FOR ELECTRONIC DEVICES, AND COMPONENT FOR ELECTRONIC DEVICES  
A copper alloy for electronic devices has a low Young's modulus, high proof stress, high electrical conductivity and excellent bending formability and is appropriate for a component for electronic...
US20140209221 Cu-Mg-P-BASED COPPER ALLOY SHEET HAVING EXCELLENT FATIGUE RESISTANCE CHARACTERISTIC AND METHOD OF PRODUCING THE SAME  
The fatigue resistance characteristics, particularly, fatigue resistance characteristics after retention at 150° C. for 1000 hours are improved while maintaining the characteristics in the related...
US20050087268 Copper film containing tungsten carbide for improving electrical conductivity, thermal stability and hardness properties and a manufacturing method for the copper film  
A copper film containing tungsten carbide is adapted to be formed on a substrate and contains a copper layer having tungsten carbide in atomic ratios of 0.4 to 12.2% in tungsten and of 0.7 to 7.4%...
US20100276037 High strength titanium copper alloy, manufacturing method therefor, and terminal connector using the same  
A high strength titanium copper alloy consists of Ti at 2.0% by mass or more to 3.5% by mass or less; the balance of copper and inevitable impurities; an average grain size of 20 μm or less; and a...
US20110017354 MATERIALS FOR THE PRODUCTION OF ECOLOGICAL AMMUNITION AND OTHER APPLICATIONS  
The present invention provides an ODS type material (Oxide dispersion strengthened or particle dispersion) which comprises an alloy metal matrix and a dispersion of strengthening particles...
US20130087255 Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIALS, AND METHOD OF MANUFACTURING SAME  
Disclosed is a Cu—Co—Si-based copper alloy for electronic materials, which is capable of achieving high levels of strength, electrical conductivity, and also anti-setting property; and contains...
US20070062619 Copper alloy and process for producing the same  
A copper alloy that has a specific chemical composition, the balance being Cu and impurities, in which the relationship between the total number N and the diameter X satisfies the following...
US20050092400 Copper-niobium alloy and method for the production thereof  
The invention relates to the field of materials engineering and relates to copper-niobium alloys which can be used for producing powder metallurgical products by known shaping methods, e.g., after...
US20060137773 Copper alloy having bendability and stress relaxation property  
A copper alloy contains 0.01% to 1.0% of Fe, 0.01% to 0.4% of P, and 0.1% to 1.0% of Mg with the remainder being copper and inevitable impurities and has a volume fraction of dispersoids having a...
US20050211346 Copper alloy and copper alloy manufacturing method  
An object of the present invention is to provide copper alloy which has a dimensionless performance index value M satisfying an inequality: M>400 in either a binary system alloy composition...
US20110146855 Cu-Mg-P based copper alloy material and method of producing the same  
A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average...
US20050161126 High-strength high-conductivity copper alloy  
Disclosed is a copper alloy containing Fe of 0.01 to 0.5% and P of 0.01 to 0.3% in mass with the balance consisting of copper and unavoidable impurities, wherein the mass content ratio of Fe to P,...
US20090084473 COPPER ALLOY WITH HIGH STRENGTH AND EXCELLENT PROCESSABILITY IN BENDING AND PROCESS FOR PRODUCING COPPER ALLOY SHEET  
The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to...
US20050092404 Softening-resistant copper alloy and method of forming sheet of the same  
A softening-resistant copper alloy contains Fe in an Fe content in the range of 0.01 to 4.0% by mass. The copper alloy has a cube orientation density of 50% or below and a mean grain size of 30 μm...
US20070287020 Surface treated electrodeposited copper foil, the production method and circuit board  
To provide a surface treated electrodeposited copper foil having a smooth M surface with less asperity on the surface instead of an S surface affected by stripes transferred from a surface drum; a...
US20120312430 COPPER ALLOY HAVING HIGH STRENGTH AND HIGH CONDUCTIVITY, AND METHOD FOR PREPARING THE SAME  
The present invention relates to a copper alloy having particular benefits for electronic parts and a method for making the same. The alloy having the composition of 0.05 wt % of Fe, 0.025˜0.15 wt...
US20060263584 Composite material, electrical circuit or electric module  
The invention relates to a novel composite material, especially for applications in the field of electrical engineering. Said novel material has a thermal coefficient of expansion that is smaller...
US20090035173 Electrically Conductive Material  
An electrically conductive material includes: a supersaturated solid solution of a polycrystalline copper alloy having a composition represented by the formula: Cu100-x-yMxNy; wherein x and y are...
US20120175026 COPPER ALLOY WITH HIGH STRENGTH AND EXCELLENT PROCESSABILITY IN BENDING AND PROCESS FOR PRODUCING COPPER ALLOY SHEET  
The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to...
US20100000860 Copper Sputtering Target With Fine Grain Size And High Electromigration Resistance And Methods Of Making the Same  
The present invention generally provides a sputtering target comprising copper and a total of 0.001 wt %˜10 wt % alloying element or elements chosen from the group consisting of Al, Ag, Co, Cr,...
US20060166032 Copper electrolytic solution and electrolytic copper foil produced therewith  
It is an object of the present invention to provide a copper electrolytic solution used to obtain a low-profile electrolytic copper foil with low surface roughness on the rough side (the opposite...
US20090229716 COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC PARTS AND METHOD OF PRODUCING THE SAME  
A copper alloy material for electric/electronic parts, which is produced by the steps containing: finish rolling a copper alloy at a reduction ratio of 40% or less, subjecting the copper alloy...
US20150225817 Cu-Be ALLOY AND METHOD FOR PRODUCING SAME  
A Cu—Be alloy according to the present invention is a Co-containing Cu—Be alloy, in which the Co content is 0.005% to 0.12% by mass, and the number of Cu—Co-based compound particles having a...
US20090173414 Rolled Copper Foil and Manufacturing Method of Rolled Copper Foil  
A rolled copper foil, according to the present invention, obtained after a final cold rolling step but before recrystallization annealing includes a group of crystal grains which exhibits...
US20130230765 CURRENT COLLECTOR COPPER FOIL OF NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, METHOD OF MANUFACTUING THE CURRENT COLLECTOR COPPER FOIL OF NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, METHOD OF MANUFACTURING NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, AND LITHIUM ION SECONDARY BATTERY  
There is provided a current collector copper foil of negative electrode for lithium ion secondary battery, including: at least 0.15 wt % or more and 0.40 wt % or less of Cr; and Cu as a remaining...
US20060000527 Pb-free bearing used for fuel-injection pump  
In a Cu—Bi based sintered alloy, to which hard particles, such as Fe3P, are added, the main constituent components of the microstructure are a Cu matrix, Bi phase and the hard particles. In the...
US20050121320 Copper alloy sputtering target and method for manufacturing the target  
A copper alloy sputtering target most suitable for formation of an interconnection material of a semiconductor device, particularly for formation of a seed layer, characterized in that the target...
US20100139822 Cu-Ti-based copper alloy sheet material and method of manufacturing same  
Provided is a Cu—Ti-based copper alloy sheet material that satisfies all the requirements of high strength, excellent bending workability and stress relaxation resistance and has excellent...
US20100136434 Electrolytic Copper Foil for Lithium Rechargeable Battery and Process for Producing the Copper Foil  
An electrolytic copper foil for a lithium rechargeable (secondary) battery, wherein the 0.2% proof stress is 18 to 25 kgf/mm2 and the elongation rate is 10% or more; and a process for producing an...
US20110290380 METHOD FOR MANUFACTURING METAL LAMINATED SUBSTRATE FOR SEMICONDUCTOR ELEMENT FORMATION AND METAL LAMINATED SUBSTRATE FOR SEMICONDUCTOR ELEMENT FORMATION  
Disclosed is a metal laminated substrate for forming an epitaxial growth film for forming a semiconductor element having high biaxial crystal orientation on a surface of a metal substrate and a...
US20060169370 Electrical contact material and method for making same  
The present invention relates to an electrical contact material comprising a matrix made of conductive metal and an unstable fraction incorporated into this matrix. The unstable fraction has the...
US20130213536 METHOD AND APPARATUS FOR MANUFACTURING METAL MATERIAL AND METAL MATERIAL  
The present invention provides a method for manufacturing a metal material. The method comprises a temperature increasing step of increasing the temperature of a silver material having undergone...

Matches 1 - 46 out of 46