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US20090288593 |
ELECTROLESS DEPOSITION SYSTEM
An electroless deposition system includes a deposition solution, and saturating the deposition solution with an oxygen concentration in a range from about two thousand parts per million to about...
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US20090288594 |
ELECTROLESS DEPOSITION CHEMICAL SYSTEM LIMITING STRONGLY ADSORBED SPECIES
An electroless deposition chemical system includes an electroless solution including a metal component, and a strongly adsorbed species component having a concentration less than a concentration of...
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US20090253262 |
ELECTROLESS PLATING SYSTEM
An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers...
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US20090130315 |
Method for Continuously Operating Acid or Alkaline Zinc or Zinc Alloy Baths
The invention provides a process for depositing metallic layers from acidic or alkaline zinc or zinc alloy baths containing organic additives selected from brighteners, surfactants and complexing...
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US20090101170 |
SYSTEM FOR SOAKING ROLLS OF ABSORBING MATERIAL TO BE USED IN PRINTING MACHINE CLEANING
System for soaking absorbing material rolls or sheets ( 1 b, 2 b ) with a solvent ( 1 a, 2 a ), such a solvent being contained into a bag made of plastic divided into two separated partitions,...
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US20080224314 |
Method and Apparatus for Forming a Noble Metal Layer, Notably on Inlaid Metal Features
A cap layer for a metal feature such as a copper interconnect on a semiconductor wafer is formed by immersion plating a more noble metal (e.g. Pd) onto the copper interconnect and breaking up,...
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US20080160204 |
Spontaneous copper seed deposition process for metal interconnects
A method for depositing a copper seed layer onto a semiconductor substrate comprises applying a SCuD plating bath onto a surface of a substrate, rinsing the surface with an organic solvent,...
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US20080141933 |
Semiconductor plating system for plating semiconductor object
Provided is a semiconductor plating system for plating a semiconductor object with a desired layer. The semiconductor plating system include a plating tank configured to accommodate a plating...
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US20080085370 |
ELECTROLESS PLATING METHOD AND APPARATUS
An electroless plating system is provided. The system includes a first vacuum chuck supporting a first wafer and a second vacuum chuck supporting a second wafer such that a top surface of the...
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US20080073402 |
WEB GUIDING ROLLER AND WEB CONVEYING APPARATUS
A web conveying apparatus is provided with a plurality of web guiding rollers. The web guiding rollers convey a web on which a functional material has just been coated in a coating section. Concave...
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US20080057211 |
METHODS FOR PLATING AND FABRICATION APPARATUS THEREOF
A method for plating includes positioning a substrate facing a plating solution. The method also includes immersing the substrate into the plating solution while plating a layer of material over a...
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US20080003372 |
Method for Curing Radically Curable Compounds in a Protective Atmosphere and Device for Carrying Out Said Method
A method of curing free-radically curable compositions under an inert gas atmosphere, where the curing, which proceeds in accordance with a free-radical mechanism, is initiated, or initiated and...
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