| DE19718971 | ||||
| EP0623565 | Electroless metallization of optical fiber for hermetic packaging. |
1. Technical Field
The present invention relates to a method for metallization of a glass element, including an optical waveguide such as an optical fiber, a large diameter waveguide cane structure or planar waveguide.
2. Description of Related Art
There are known methods for metallization of optical fibers and large glass structures. These methods include vapor deposition methods, wet chemical processes, and additional methods that utilize a combination of the two approaches. The inherent problems with vapor deposition methods are heat-induced damage to the fiber substrate, poor adhesion of the metal coating, and non-uniformity of the coating. Wet chemical processes are currently the most attractive metallization methods for the highest coating adhesion and quality.
Standard wet chemical processes for the metallization of large glass substrates have been tried to metallize optical fiber. These known wet chemical processes utilize tin chloride (SnCl
Another approach for the metallization of an optical fiber disclosed by Filas et al. (U.S. Pat. No. 5,380,559) uses tin fluoride (SnF
Further, it is known to complete the metallization of an optical fiber using an electroless metallic solution consisting of the Fidelity solution 4865A (constituent part which is nickel sulfate), the Fidelity solution 4865B (constituent parts which are sodium hypophosphite, sodium hydroxide and acetic acid) and de-ionized water in a ratio of 1:3:16. However, this known electroless metallic solution is not active enough with such small surface areas and did not plate when using tin chloride (SnCl
In view of this, it was found that, when plating optical fibers in the known electroless nickel solution, the plating rates and platability of the optical fibers were inconsistent and unacceptable.
The reasons for this include the fact that:
1) The optical fiber has a small surface area, i.e. a small load, in relation to known stabilizers. The electroless nickel solution is autocatalytic. The larger the area to be plated, the easier it is for the reaction to start and maintain itself. An optical waveguide, such as an optical fiber, is not a “load” that lends itself to an easy start.
2) The commercially available electroless nickel solutions, such as the aforementioned Fidelity solutions, contain too many stabilizers. These chemicals were originally intended to prevent the bath from “plating out” (which is feeding off of itself at an uncontrolled rate until all the nickel is gone), and to prevent plating on the sides of its container. These stabilizers interfere with the plating on the optical fiber.
In view of the aforementioned, there is a need in the industry for a better way to metallize an optical waveguide using a wet chemical process.
In its broadest sense, the present invention provides a method of applying a metal coating to a glass element having a small surface area comprising a unique set of steps. The glass element may include an optical waveguide such as an optical fiber typically having a diameter of 125 microns, a large diameter waveguide cane structure having a diameter of at least 0.3 millimeters or greater, or a planar waveguide.
First, the stabilizers of an electroless metallic solution are partially depleted therein. One way of partially depleting the stabilizers is to provide an electroless metallic solution having a concentration of sodium hypophoshite of about 25 grams/liter.
The electroless metallic solution may comprise a first solution having nickel sulfate (such as the Fidelity solution 4865A), a second solution having sodium hypophosphite, sodium hydroxide and acetic acid (such as the Fidelity solution 4865B) and de-ionized water in a ratio of about 1:1:18; and sodium hypophosphite crystals, which are added to create a sodium hypophoshite concentration of about 25 grams per liter in the electroless metallic solution. In effect, the volume of the Fidelity solution 4865B is reduced and the de-ionized water is increased of the known electroless metallic solution (i.e., 1:3:16 solution), as described hereinbefore, to achieve the desired partial depletion of the stabilizers in the electroless metallic solution.
Alternatively, another way of partially depleting the stabilizers is to place a dummy load into an electroless metallic solution. The dummy load may be a rectangular block of metal, which may be formed of a low carbon steel and may include a threaded cylindrical passage therein.
The electroless metallic solution used with the dummy load may comprise a first solution having nickel sulfate (such as the Fidelity solution 4865A), a second solution having sodium hypophoshite, sodium hydroxide and acetic acid (such as the Fidelity solution 4865B) and de-ionized water in a ratio of about 1:3:16.
After partially depleting the stabilizer of the electroless metallic solution, the glass element is immersed in the electroless metallic solution to deposit a metal coating, for example, to the glass element, for a predetermined length of time depending on a desired deposition thickness. The nickel coating may also be further coated with gold to form a gold on nickel coating. The gold coating prevents the nickel coating from oxidizing.
The method also includes other steps such as initialization, sensitization and activation of the optical waveguide.
One advantage of the method of the present invention is that it can be executed in a tabletop environment with no need for an inert atmosphere.
The foregoing and other objects, features and advantages of the present invention will become more apparent in light of the following detailed description of exemplary embodiments thereof, as illustrated in the accompanying drawing.
The drawing includes
FIG.
FIG.
FIG.
FIG.
The overall method of applying the coating to the optical waveguide also includes other steps such as initialization, sensitization and activation of the optical fiber which are discussed in more detail below in relation to FIG.
The scope of the invention is not intended to be limited to the type of glass element, as described above, or the manner in which the glass element is used after the metal coating is applied thereto.
The step
In
First, an optical fiber having a polymer jacket is initially prepared by cleaning the polymer jacket with acetone, followed by isopropanol using lint-free wipes. The polymer jacket is then removed from the optical fiber by immersing the area to be plated in a stirred 90% sulfuric acid at a temperature of about 160-180° C. The area to be plated is then rinsed in 18M ohms de-ionized water (DI).
Second, the optical fiber is immersed in a gently stirred sensitization solution for about 2-3 minutes at room temperature. The sensitization solution is prepared by mixing a sensitizer having the constituent part of tin chloride (SnCl
Third, the optical fiber is then immersed in a gently stirred activation solution for about 1 minute. The activation solution is prepared by mixing an activator solution having the constituent parts of palladium chloride (PdCl
Fourth, the partial depletion step
In the stabilizer concentration lowering technique as described in step
In the dummy loading technique as described in step
In operation, once the electroless metallic solution (e.g. nickel solution) obtains a temperature (about 85° C.), a cleaned piece of low carbon steel (i.e., dummy load) is placed in the electroless nickel solution for about 15 minutes before the optical fiber is immersed. The dummy load remains in the electroless nickel solution for the length of time necessary to deplete the stabilizers, and then is removed. As described hereinbefore, the desired deposition thickness is about 2-3 microns, and the desired plating rate is about 0.22 microns/minute. This dummy load of low carbon steel is sized to approximate a surface area of about 0.25 ft
FIGS.
| Table of Solutions | |||
| Solution | |||
| Supplier | Ph | Temp | Constituent parts |
| SnCl2 (tin chloride) | NA | Room Temp | SnCl2 |
| Shipley (Shipley 471) | |||
| PdCl2 (palladium chloride) | NA | Room Temp | PdCl2, HCl |
| Shipley (Shipley 571) | |||
| Electroless Nickel (4865 A) | with B, | +/− .1 C. | Nickel sulfate |
| Fidelity (Fidelity 4865A) | 4.85 | ||
| Electroless Nickel (4865 B) | with A, | +/− .1 C. | Sodium Hypophos- |
| Fidelity (Fidelity 4865B) | 4.85 | phite, sodium hy- | |
| droxide, acetic acid | |||
| Electroless Gold | 5.72 | 70 C. +/− | Gold in cyanide |
| Technic, Inc. (Oromerse N) | 1 C. | solution | |
| Deionized Water | NA | Room Temp | 18 MOhm DI water |
| NA | |||
While the method described hereinbefore concerns the metallization of a glass element such as an optical fiber, having a diameter of about 125 microns, one skilled in the art will recognize and appreciate that the method may be used to coat other optical waveguides such as a large diameter optical waveguide
In
The cladding
The large diameter waveguide
Alternatively, the large diameter waveguide may be formed by heating, collapsing and fusing a glass capillary tube to a fiber (not shown) by a laser, filament, flame, etc., as is described in co-pending U.S. patent application Ser. No. 09/455,865, entitled “Tube-Encased Fiber Grating”, and U.S. patent application Ser. No. 09/455,867, entitled “Bragg Grating Pressure Sensor”, which are incorporated herein by reference. Other techniques may be used for collapsing and fusing the tubes to the fiber, such as is discussed in U.S. Pat. No. 5,745,626, entitled “Method For And Encapsulation Of An Optical Fiber”, to Duck et al., and/or U.S. Pat. No. 4,915,467, entitled “Method of Making Fiber Coupler Having Integral Precision Connection Wells”, to Berkey, which are incorporated herein by reference to the extent necessary to understand the present invention, or other techniques. Alternatively, other techniques may be used to fuse the fiber to the tube, such as using a high temperature glass solder, e.g., a silica solder (powder or solid), such that the fiber, the tube and the solder all become fused to each other, or using laser welding/fusing or other fusing techniques.
Although the invention has been described and illustrated with respect to exemplary embodiments thereof, the foregoing and various other additions and omissions may be made therein and thereto without departing from the spirit and scope of the present invention.