Title:
PACKING VESSEL FOR THIN SHEET MATERIALS
United States Patent 3719273
Abstract:
A container having cooperating lower and upper members that are adapted to fit together so as to form a plurality of cavities, the lower member having a plurality of concave bottom surfaces and an annular channel surrounding each concave bottom surface, the upper member having a plurality of convex surfaces and an annular channel disposed around the periphery of each such convex surface, the channel sections of the upper and lower members being constructed so that they will interfit in a nesting relationship
US Patent References:
PACKAGING EPITAXIALLY COATED SEMICONDUCTOR DISKS
Bauer et al. - June 1972 - 3672495
Tray packages
Burket - January 1964 - 3119492
RETAINING TRAYS FOR SEMICONDUCTOR WAFERS AND THE LIKE
Gutsche - September 1969 - 3469686
Multiple pocket container
Keim - September 1964 - 3146929
Container
Jackson - June 1965 - 3191791
PACKAGING EPITAXIALLY COATED SEMICONDUCTOR DISKS
Bauer et al. - June 1972 - 3672495
Tray packages
Burket - January 1964 - 3119492
RETAINING TRAYS FOR SEMICONDUCTOR WAFERS AND THE LIKE
Gutsche - September 1969 - 3469686
Multiple pocket container
Keim - September 1964 - 3146929
Container
Jackson - June 1965 - 3191791
Application Number:
05/105276
Publication Date:
03/06/1973
Filing Date:
01/11/1971
View Patent Images:
Export Citation:
Primary Class:
Other Classes:
206/509
International Classes:
B65D21/02; B65D75/34; B65D75/28; B65D71/00; B65D21/00
Field of Search:
206/1R,46FR,46H,62R,65F,65K,46ED 220/4R,23.83,97C,97R,97D,97F 229/2.5
US Patent References:
Primary Examiner:
Leclair, Joseph R.
Assistant Examiner:
Lipman, Steven E.
Claims:
Having thus described my invention, what I claim as new and desire to secure a United States Letters Patent is
1. A packing unit for thin sheet materials such as semiconductor wafers which comprises cooperating lower and upper members that are adapted to fit together so as to form at least one cavity,
2. A packing unit according to claim 1 wherein said concave bottom surface is provided with a radial groove which is adapted to receive a pincette to facilitate the removal of the material resting on said surface.
3. A packing unit according to claim 1 wherein said packing unit is composed of a synthetic resin having a thickness between about 0.1 mm and about 1.0 mm.
4. A packing unit for items such as thin semiconductor wafers which comprises cooperating lower and upper members that are adapted to fit together so as to form a plurality of cavities:
5. A packing unit according to claim 4 wherein said concave bottom surface is provided with a radial groove which is adapted to receive a pincette to facilitate the removal of the material resting on said surface.
6. A packing unit according to claim 4 wherein said packing unit is composed of a synthetic resin having a thickness between about 0.1 mm and about 1.0 mm.
7. A container unit for thin sheet materials such as semiconductor wafers which comprises cooperating lower and upper members that are adapted to fit together so as to form a plurality of cavities wherein:
8. A container according to claim 7 wherein said concave bottom surface is provided with a radial groove which is adapted to receive a pincette to facilitate the removal of the material resting on said surface.
9. A container according to claim 7 wherein said packing unit is composed of a synthetic resin having a thickness between about 0.1 mm and about 1.0 mm.
10. A container according to claim 7 wherein there are ten spaced apart cavities formed by the said upper and lower members.
1. A packing unit for thin sheet materials such as semiconductor wafers which comprises cooperating lower and upper members that are adapted to fit together so as to form at least one cavity,
2. A packing unit according to claim 1 wherein said concave bottom surface is provided with a radial groove which is adapted to receive a pincette to facilitate the removal of the material resting on said surface.
3. A packing unit according to claim 1 wherein said packing unit is composed of a synthetic resin having a thickness between about 0.1 mm and about 1.0 mm.
4. A packing unit for items such as thin semiconductor wafers which comprises cooperating lower and upper members that are adapted to fit together so as to form a plurality of cavities:
5. A packing unit according to claim 4 wherein said concave bottom surface is provided with a radial groove which is adapted to receive a pincette to facilitate the removal of the material resting on said surface.
6. A packing unit according to claim 4 wherein said packing unit is composed of a synthetic resin having a thickness between about 0.1 mm and about 1.0 mm.
7. A container unit for thin sheet materials such as semiconductor wafers which comprises cooperating lower and upper members that are adapted to fit together so as to form a plurality of cavities wherein:
8. A container according to claim 7 wherein said concave bottom surface is provided with a radial groove which is adapted to receive a pincette to facilitate the removal of the material resting on said surface.
9. A container according to claim 7 wherein said packing unit is composed of a synthetic resin having a thickness between about 0.1 mm and about 1.0 mm.
10. A container according to claim 7 wherein there are ten spaced apart cavities formed by the said upper and lower members.
Description:
BACKGROUND AND OBJECTS
The present invention relates to a packing container for thin sheet materials whose surfaces should not be soiled nor injured, for example, semiconductor wafers having mirror-like polished surfaces, glass filters for optical instruments, or the like.
Heretofore various containers have been used for shipping semiconductor wafers, such as bag-like containers made of paper, synthetic resin film, containers shaped from synthetic resins, provided with partitions and containing a material such as sponge laid on their bottom, etc. However, in any of these containers, since the articles to be packed are brought directly into contact with the packing materials of the container, the chance of soiling or injury during the time of their being transported and handled has been very great.
An object of the present invention is to provide a shipping container for thin sheet materials whereby the abovementioned drawbacks are overcome and the soiling or injury of surfaces due to the contact of the surface of the materials to be shipped with the packing materials is minimized or eliminated.
Another object of the present invention is to provide a shipping vessel for thin sheet materials which is light, compact and easy to handle. Further objects and advantages will become apparent after reading the detailed description which hereinafter follows.
THE INVENTION BROADLY
In order to attain the above-mentioned objects, I have found that the item to be packed, in whatever state it may be, should come into contact with the packing material over as small an area as possible, and preferably only at the marginal portions of the item to be shipped.
Considered from one aspect, my invention involves a container for thin sheet materials, such as semiconductor wafers, which comprises cooperating lower and upper members that are adapted to fit together so as to form a plurality of cavities, wherein:
A. said lower member is characterized by
A. a plurality of spaced apart downwardly concave bottom surfaces,
B. a first annular channel section of a generally U-shaped configuration disposed around the periphery of each concave bottom surface,
B. said upper member is characterized by
A. a plurality of spaced apart upwardly convex cover surfaces,
B. a second annular channel section disposed around the periphery of each convex cover surface which can be considered as consisting of a stepped U-shaped configuration that consists of a receptor portion and a projector portion that is smaller than said receptor portion,
C. said concave bottom surfaces and said convex cover surfaces being vertically aligned with each other when said lower and upper members are functioning as a container,
D. the exterior surface of said first annular channel section having a size and configuration that is adapted to fit within the interior surface of the receptor portion of said second annular channel section in a nesting relationship, and
E. the interior surface of said first annular channel section having a size and configuration that is adapted to accommodate the exterior surface of the projector portion of said second annular channel section in a nesting relationship.
THE DRAWINGS
FIG. 1 shows cross-sectional views of upper and lower members according to a preferred embodiment of this invention;
FIG. 2 is a cross-sectional view showing how the lower members and upper members in accordance with this invention can be stacked together in a nesting relationship; and
FIG. 3 is a perspective view showing upper and lower members in accordance with this invention in a spaced apart relationship.
DETAILED DESCRIPTION
Referring now to the drawings, the lower member 1' is shown as being positioned below an upper member 1. The lower member 1' has a concave bottom surface 4' which is surrounded by an annular channel section 2' of generally U-shaped configuration. More particularly, the annular channel section 2' consists of an annular inner side wall 5' extending upwardly from the periphery of said concave bottom surface 4', a bottom shelf portion 3' extending substantially horizontally outwardly from said sidewall 5' and an outer sidewall portion 8' extending substantially vertically downwardly from the outer periphery of said bottom shelf portion 3'.
The upper member 1 comprises an upwardly convex cover surface 4 that is surrounded by an annular channel section 2-12 and which can be considered as having a stepped U-shaped configuration that consists of a lower receptor portion 2 and an upper projector portion 12 that is smaller than said receptor portion. More particularly this annular channel section 2-12 comprises a first cover side wall portion 5 extending vertically upwardly from the periphery of said convex surface 4, a first cover shelf portion 11 extending substantially horizontally outwardly from said first cover sidewall portion 5, a second cover sidewall portion 9 extending vertically upwardly from the periphery of said first cover shelf portion 11, a second cover shelf portion 3 extending substantially horizontally outwardly from said second cover sidewall portion 9, a third cover sidewall portion 10 extending downwardly from the periphery of said second cover shelf portion 3, a third shelf portion 14, extending outwardly from the bottom of sidewall portion 10 and in the same plane as shelf portion 11, and a fourth sidewall portion 8 extending vertically downwardly from the periphery of said third shelf portion 14.
As can perhaps best be seen in FIG. 2, the exterior surface 7' of said first annular channel section 2' has a size and configuration that adapts it to fit within the interior surface of the receptor portion 2 of the annular channel section 2-12 in a nesting relationship. Also, the interior surface of said first annular channel section 2' has a size and configuration that is adapted to accommodate the exterior surface 7 of the projector portion 12 of said second annular channel section 2-12 in a nesting relationship. This construction permits a plurality of container units to be stacked one upon the other in the manner shown in FIG. 2.
When an item made of thin sheet material to be packed is placed on one of my packing units or containers, it is loosely held between the downwardly concave and the upwardly convex surfaces 4' and 4, and only the marginal portions of the item come into contact with the container, regardless of the position of the packing unit or container. Thus, most of the surfaces of the item can be completely protected from staining or injury.
As for the configuration of the surfaces 4 and 4', any form will do so long as the flat surfaces of the item to be placed therein will have minimum contact with the surfaces 4 and 4'. However, the concave surfaces 4' and the convex surfaces 4 are preferably generally spherical in configuration, and are vertically aligned so that they are complementary with each other to thereby form cavities for the items to be shipped.
The spherically curved bottoms 4' may be provided with radial grooves 13 to facilitate removal of the item contained therein by a pincette (not shown).
Also, whereas the channel sections are shown as being generally U-shaped in configuration no invention would be involved in making them V-shaped, semi-circular, etc.
The packing unit or container of this invention is preferably shaped by vacuum forming from a sheet of synthetic resin material having a thickness within the range of about 0.1 mm to 1.0 mm and most preferably within the range of about 0.1 mm to 0.5mm. Suitable synthetic resins which may be used and which are suitable for forming by vacuum methods would include polyethylene, polypropylene, polystyrene, polyvinylchloride, or the like.
The packing unit or container of my invention requires no expensive mold (such as an injection mold) and can be simply shaped by vacuum forming to lower both the production cost and the cost of materials. Furthermore, the container of the present invention is convenient due to its light weight, and moreover, since a plurality of the containers can be stacked upon each other, a great advantage is gained in the transportation and space taken up by the product.
In conclusion, while there has been illustrated and described a preferred embodiment of my invention, it is to be understood that since the various details of construction may obviously be varied considerably without really departing from the basic principles and teachings of this invention, I do not limit myself to the precise constructions herein disclosed and the right is specifically reserved to encompass all changes and modifications coming within the scope of the invention as defined in the appended claims.
The present invention relates to a packing container for thin sheet materials whose surfaces should not be soiled nor injured, for example, semiconductor wafers having mirror-like polished surfaces, glass filters for optical instruments, or the like.
Heretofore various containers have been used for shipping semiconductor wafers, such as bag-like containers made of paper, synthetic resin film, containers shaped from synthetic resins, provided with partitions and containing a material such as sponge laid on their bottom, etc. However, in any of these containers, since the articles to be packed are brought directly into contact with the packing materials of the container, the chance of soiling or injury during the time of their being transported and handled has been very great.
An object of the present invention is to provide a shipping container for thin sheet materials whereby the abovementioned drawbacks are overcome and the soiling or injury of surfaces due to the contact of the surface of the materials to be shipped with the packing materials is minimized or eliminated.
Another object of the present invention is to provide a shipping vessel for thin sheet materials which is light, compact and easy to handle. Further objects and advantages will become apparent after reading the detailed description which hereinafter follows.
THE INVENTION BROADLY
In order to attain the above-mentioned objects, I have found that the item to be packed, in whatever state it may be, should come into contact with the packing material over as small an area as possible, and preferably only at the marginal portions of the item to be shipped.
Considered from one aspect, my invention involves a container for thin sheet materials, such as semiconductor wafers, which comprises cooperating lower and upper members that are adapted to fit together so as to form a plurality of cavities, wherein:
A. said lower member is characterized by
A. a plurality of spaced apart downwardly concave bottom surfaces,
B. a first annular channel section of a generally U-shaped configuration disposed around the periphery of each concave bottom surface,
B. said upper member is characterized by
A. a plurality of spaced apart upwardly convex cover surfaces,
B. a second annular channel section disposed around the periphery of each convex cover surface which can be considered as consisting of a stepped U-shaped configuration that consists of a receptor portion and a projector portion that is smaller than said receptor portion,
C. said concave bottom surfaces and said convex cover surfaces being vertically aligned with each other when said lower and upper members are functioning as a container,
D. the exterior surface of said first annular channel section having a size and configuration that is adapted to fit within the interior surface of the receptor portion of said second annular channel section in a nesting relationship, and
E. the interior surface of said first annular channel section having a size and configuration that is adapted to accommodate the exterior surface of the projector portion of said second annular channel section in a nesting relationship.
THE DRAWINGS
FIG. 1 shows cross-sectional views of upper and lower members according to a preferred embodiment of this invention;
FIG. 2 is a cross-sectional view showing how the lower members and upper members in accordance with this invention can be stacked together in a nesting relationship; and
FIG. 3 is a perspective view showing upper and lower members in accordance with this invention in a spaced apart relationship.
DETAILED DESCRIPTION
Referring now to the drawings, the lower member 1' is shown as being positioned below an upper member 1. The lower member 1' has a concave bottom surface 4' which is surrounded by an annular channel section 2' of generally U-shaped configuration. More particularly, the annular channel section 2' consists of an annular inner side wall 5' extending upwardly from the periphery of said concave bottom surface 4', a bottom shelf portion 3' extending substantially horizontally outwardly from said sidewall 5' and an outer sidewall portion 8' extending substantially vertically downwardly from the outer periphery of said bottom shelf portion 3'.
The upper member 1 comprises an upwardly convex cover surface 4 that is surrounded by an annular channel section 2-12 and which can be considered as having a stepped U-shaped configuration that consists of a lower receptor portion 2 and an upper projector portion 12 that is smaller than said receptor portion. More particularly this annular channel section 2-12 comprises a first cover side wall portion 5 extending vertically upwardly from the periphery of said convex surface 4, a first cover shelf portion 11 extending substantially horizontally outwardly from said first cover sidewall portion 5, a second cover sidewall portion 9 extending vertically upwardly from the periphery of said first cover shelf portion 11, a second cover shelf portion 3 extending substantially horizontally outwardly from said second cover sidewall portion 9, a third cover sidewall portion 10 extending downwardly from the periphery of said second cover shelf portion 3, a third shelf portion 14, extending outwardly from the bottom of sidewall portion 10 and in the same plane as shelf portion 11, and a fourth sidewall portion 8 extending vertically downwardly from the periphery of said third shelf portion 14.
As can perhaps best be seen in FIG. 2, the exterior surface 7' of said first annular channel section 2' has a size and configuration that adapts it to fit within the interior surface of the receptor portion 2 of the annular channel section 2-12 in a nesting relationship. Also, the interior surface of said first annular channel section 2' has a size and configuration that is adapted to accommodate the exterior surface 7 of the projector portion 12 of said second annular channel section 2-12 in a nesting relationship. This construction permits a plurality of container units to be stacked one upon the other in the manner shown in FIG. 2.
When an item made of thin sheet material to be packed is placed on one of my packing units or containers, it is loosely held between the downwardly concave and the upwardly convex surfaces 4' and 4, and only the marginal portions of the item come into contact with the container, regardless of the position of the packing unit or container. Thus, most of the surfaces of the item can be completely protected from staining or injury.
As for the configuration of the surfaces 4 and 4', any form will do so long as the flat surfaces of the item to be placed therein will have minimum contact with the surfaces 4 and 4'. However, the concave surfaces 4' and the convex surfaces 4 are preferably generally spherical in configuration, and are vertically aligned so that they are complementary with each other to thereby form cavities for the items to be shipped.
The spherically curved bottoms 4' may be provided with radial grooves 13 to facilitate removal of the item contained therein by a pincette (not shown).
Also, whereas the channel sections are shown as being generally U-shaped in configuration no invention would be involved in making them V-shaped, semi-circular, etc.
The packing unit or container of this invention is preferably shaped by vacuum forming from a sheet of synthetic resin material having a thickness within the range of about 0.1 mm to 1.0 mm and most preferably within the range of about 0.1 mm to 0.5mm. Suitable synthetic resins which may be used and which are suitable for forming by vacuum methods would include polyethylene, polypropylene, polystyrene, polyvinylchloride, or the like.
The packing unit or container of my invention requires no expensive mold (such as an injection mold) and can be simply shaped by vacuum forming to lower both the production cost and the cost of materials. Furthermore, the container of the present invention is convenient due to its light weight, and moreover, since a plurality of the containers can be stacked upon each other, a great advantage is gained in the transportation and space taken up by the product.
In conclusion, while there has been illustrated and described a preferred embodiment of my invention, it is to be understood that since the various details of construction may obviously be varied considerably without really departing from the basic principles and teachings of this invention, I do not limit myself to the precise constructions herein disclosed and the right is specifically reserved to encompass all changes and modifications coming within the scope of the invention as defined in the appended claims.