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ABRASIVE BREAKING METHOD
United States Patent 3491929
US Patent References:
/0409186.html
- - 0409186
/0552748.html
- - 0552748
/0672833.html
- - 0672833
Method and apparatus for breaking a semiconductor wafer into elementary pieces
- - 3396452
Inventors:
Ueltz, Herbert F. G.
Rzucidlo, Alfred G.
Publication Date:
01/27/1970
View Patent Images:
Download PDF 3491929
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Assignee:
US INDUSTRIES INC
Primary Class:
225/4
Other Classes:
225/98
International Classes:
B02C4/02
;
B02C4/00
; B65H35/10; B26F3/00; B65H35/00
Foreign References:
DE27943C
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