Process for etching copper printed circuits
United States Patent 3373113
US Patent References:
Method of improving the bonding properties of steel surfaces
- - 2923608
Process and composition for the dissolution of copper
- - 2978301
Etchant and method
- - 2982625
Method of improving the bonding properties of steel surfaces
- - 2923608
Process and composition for the dissolution of copper
- - 2978301
Etchant and method
- - 2982625
Inventors:
Karl, Achenbach
Publication Date:
03/12/1968
View Patent Images:
Export Citation:
Assignee:
FMC CORP
Primary Class:
Other Classes:
252/79.100, 252/79.400, 216/106
International Classes:
C23F1/18; C23F1/10
Foreign References:
| GB955000A |