Title:
Copper layer bonded to a non-conductive layer by means of a copper alloy
United States Patent 3360349
US Patent References:
Composite structure for forming a seal with glass
- - 2482178
Gas plating of alloys
- - 2966427
Method of inert-gas metal arc-welding
- - 2988630
Process for producing magnetic product
- - 3206325
Metal plating process
- - 3294654
Composite structure for forming a seal with glass
- - 2482178
Gas plating of alloys
- - 2966427
Method of inert-gas metal arc-welding
- - 2988630
Process for producing magnetic product
- - 3206325
Metal plating process
- - 3294654
Inventors:
Adomines, Alfred A.
Publication Date:
12/26/1967
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Export Citation:
Assignee:
SPERRY RAND CORP
Primary Class:
Other Classes:
428/656, 428/675, 428/450, 428/935, 428/928, 428/926, 428/336, 428/433, 428/938, 428/630, 428/633
International Classes:
C23C14/14; C25D5/54; H01B1/00; H01F10/30; H05K3/38; H01F10/00