Title:
Method and apparatus for cathode sputtering including suppressing temperature rise adjacent the anode using a localized magnetic field
United States Patent 3330752

Inventors:
Hallen, Robert L.
Valletta, Robert M.
Publication Date:
07/11/1967
View Patent Images:
Assignee:
IBM
Primary Class:
Other Classes:
204/192.150, 118/723R, 204/298.090, 204/298.160, 204/298.230
International Classes:
C23C14/35; C23C14/54; G01N15/08; H01J37/34; H01J37/32