Title:
Cold press bonded semi-conductor housing joint
United States Patent 3024299


Inventors:
Cornelis, Nijhuis Herman
Antonius, Roovers Wilhelmus
Application Number:
US72577458A
Publication Date:
03/06/1962
Filing Date:
03/26/1958
Assignee:
PHILIPS CORP
Primary Class:
Other Classes:
29/522.1, 220/2.3R, 228/115, 257/710, 257/E23.193, 285/329
International Classes:
H01J5/28; H01L23/10
View Patent Images:
Foreign References:
CH243668A1946-07-31