Electrodeposition of copper from an acid bath
United States Patent 2707166
US Patent References:
Electrodeposition of metals
- - 2291590

Nickel plating
- - 2326999

Method of plating copper
- - 2602774


Inventors:
Henry, Brown
Fellows, Richard A.
Publication Date:
04/26/1955
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Assignee:
UDYLITE CORP
Primary Class:
205/298
Other Classes:
205/297
International Classes:
C25D3/38