Title:

Forming solder balls on substrates

Document Type and Number:

United States Patent Application 20040110366

Kind Code:

Abstract:

A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

Representative Image:

Inventors:

Mackay, John (San Jose, CA, US)
Molinaro, Tom (Union City, CA, US)

Plaque It!

What is claimed is:

1. Method for forming solder bumps on a substrate having a plurality of pads on a surface thereof, comprising: providing a mask having a first surface and a second surface, and a plurality of cells extending from the first surface at least partially through the mask to the second surface thereof; filling the cells with solder paste; disposing the substrate in a biased chuck assembly; disposing the mask on the surface of the substrate with the first surface of the mask adjacent the surface of the substrate; urging the substrate into positive contact with the mask so as to maintain substantially intimate contact between the first surface of the mask and the surface of the substrate; reflowing the solder paste; and separating the substrate from the mask.

2. Method, according to claim 1, wherein: the solder bumps are solder balls.

3. Method, according to claim 1, wherein: the substrate is a semiconductor wafer.

4. Method, according to claim 1, wherein: the chuck assembly includes a diaphragm; and further comprising: introducing a gas at positive pressure to cause the diaphragm to deflect upwards to urge the substrate into positive contact with the mask.

5. Method, according to claim 1, wherein the cells extend completely through the mask from the first surface thereof to the second surface thereof.

6. Method, according to claim 5, further comprising: prior to reflowing, closing the cells of the mask.

7. Apparatus for forming solder balls on substrates comprising a chuck assembly, said chuck assembly comprising: a rigid, generally planar chuck base having a cavity extending into the chuck base from a top surface thereof, a generally planar, flexible diaphragm extending across the cavity and secured to the chuck base; said cavity being sized and shaped to receive the diaphragm.

8. Apparatus, according to claim 7, further comprising: an inlet tube extending from exterior the chuck base to within the cavity, underneath the diaphragm.

9. Apparatus, according to claim 7, further comprising: a permeable substrate disposed beneath the diaphragm, between the diaphragm and a bottom surface of the cavity.

10. Apparatus, according to claim 9, wherein: the permeable substrate comprises such as a powdered metal plate.

11. Apparatus, according to claim 7, wherein: the diaphragm comprises a sheet of silicon rubber material.

12. Apparatus, according to claim 7, further comprising: a generally planar, flexible manifold element; a recess, coaxial with and larger than the cavity, extending into the chuck base from the top surface thereof, said recess being sized and shaped to receive the manifold element.

13. Apparatus, according to claim 12, wherein the manifold element has a top surface and a bottom surface and comprises: a plurality of grooves extending across the top surface of the manifold element; an opening extending from the top surface of the manifold element through to the bottom surface of the manifold element, and the opening is aligned with an inlet orifice in the chuck base.

14. Apparatus, according to claim 13, wherein: the plurality of grooves comprise two parallel sets of intersecting grooves.

15. Apparatus, according to claim 12, wherein: the manifold element extends across the recess, and is secured to a top surface of the diaphragm.

16. Apparatus, according to claim 12, wherein: the manifold element comprises a sheet of a film material.

17. A chuck assembly for holding a semiconductor wafer in intimate contact with a mask, comprising a rigid, generally planar chuck base, characterized by: a central recess extending into the stage from a top surface thereof, said recess sized and shaped to receive a generally planar, flexible diaphragm, said diaphragm extending across the recess.

Description:

CROSS-REFERENCES TO RELATED APPLICATIONS

[0001] This application is a continuation-in-part of:

[0002] Ser. No. 09/962,007 filed Sep. 24, 2001 (issuing as U.S. Pat. No. 6,609,652, Aug. 26, 2003) which is a continuation-in-part of:

[0003] U.S. Ser. No. 09/273,517 filed Mar. 22, 1999 (U.S. Pat. No. 6,293,456, Sep. 25, 2001), which is a continuation-in-part of each of:

[0004] U.S. Ser. No. 08/863,800 filed 27 May 1997 (U.S. Pat. No. 5,988,487, Nov. 23, 1999);

[0005] U.S. Ser. No. 60/079,006 filed 23 Mar. 1998;

[0006] U.S. Ser. No. 60/079,221 filed 24 Mar. 1998; and

[0007] U.S. Ser. No. 60/092,055 filed 08 Jul. 1998,

[0008] all of which are incorporated in their entirety by reference herein.

[0009] This application is also a continuation-in-part of:

[0010] U.S. Ser. No. 10/630,310 filed Jul. 30, 2003 as a continuation-in-part of the aforementioned Ser. No. 09/962,007.

TECHNICAL FIELD OF THE INVENTION

[0011] The invention relates to methods of forming solder balls on substrates which are electronic components such as semiconductor devices (integrated circuit chips) and interconnection substrates, and to apparatuses for forming the solder balls on the electronic components.

BACKGROUND OF THE INVENTION

[0012] In recent years, flip-chip bonding techniques have increasingly been used to connect (bond) integrated circuit (IC) chips to interconnection substrates and to package substrates. In flip-chip bonding an IC chip component to an interconnection component such as ceramic interconnection substrate, a plurality (e.g., an array) of solder balls (also called “solder bumps”) is formed on a face of a component, typically the IC chip component, and the bumped component is brought into a face-to-face relationship with the other component. The two components are then heated (such as in a furnace) to reflow (heat, then allow to cool) the solder bumps, thereby making electrical connections between respective terminals of the two components.

[0013] A need for ever finer pitch arrays of solder balls has accompanied an increase in the circuit density of IC chips and multi-chip modules. For example, an IC chip to be flip-chip connected to an interconnection substrate may require an array of 4 mil (100 m) diameter solder balls disposed at an 8 mil (200 m) pitch.

[0014] Definitions

[0015] As used herein, the term “solder ball” refers to a substantially spherical or hemispherical mass (bump) of solder (e.g., lead-tin solder) resident on an substrate (e.g., electronic component), suitable for being re-flowed to join the electronic component to another electronic component. A “large solder ball” is a solder ball having a diameter of greater than 20 mils (>0.020 inches). A “small solder ball” is a solder ball having a diameter of up to 20 mils (≦=0.20 inches).

[0016] The following units of length and their equivalents are used herein:

[0017] 1 mil=0.001 inches

[0018] 1 micron (m)=0.000001 meters

[0019] 25.4 m=1 mil

[0020] 1 millimeter (mm)=0.001 meters

[0021] As used herein, the term “pitch” refers to a distance between centers of adjacent solder balls on pads of a substrate. “Coarse pitch” refers to a pitch which is at least 50 mils, and connotes a “low density” of solder balls. “Fine pitch” refers to a pitch which is up to 20 mils, and connotes a “high density” of solder balls.

[0022] For example, a typical “BGA” substrate has 30 mil diameter solder balls disposed at a 50 mil (coarse) pitch. A typical “BGA” (microBGA) substrate has 15-20 mil diameter solder balls disposed at a 30 mil (“medium”) pitch. A typical “flip chip” substrate has 4-5 mil diameter solder balls disposed at an 8-10 mil pitch.

[0023] As used herein, the term “electronic component” includes any circuitized substrate, typically having “pads”, including but not limited to integrated circuit (IC) chips (including prior to or after singulation from a semiconductor wafer), printed circuit boards, polyimide interconnection elements, ceramic substrates, and the like.

[0024] As used herein, a “substrate” is an electronic component having a nominally flat surface upon which it is desirable to form solder balls to effect electrical connections to another electronic component. “Wafer substrates” are substrates (or electronic components) which are semiconductor (crystalline, typically silicon) wafers. Any substrate which is not a wafer substrate is an “other substrate”. Ball grid array (BGA) substrates are other substrates.

[0025] As used herein, the terms “substrate bumping” and “ball bumping” refer to a process for forming solder balls on substrates. As used herein, “bumping machines” comprise equipment adapted to perform substrate bumping.

[0026] Ball Bumping Techniques

[0027] A number of techniques are known for ball bumping electronic components, some of which are not well suited to fine pitch ball bumping.

[0028] In an evaporation technique, solder is evaporated through a metal mask in an evacuated chamber. This requires a high investment in capital equipment and has high cost associated with cleaning the processing equipment and with replacing the metal mask on a frequent basis. Thermal mismatch between the evaporation mask and the substrate being ball bumped tends to limit the usefulness of the technique to moderate densities and moderate solder bump sizes.

[0029] Electroplating techniques have been used to achieve higher densities and smaller bump sizes. In this technique, the substrate surface is covered with an electroplating seed layer, then masked with photoresist which is patterned and developed to form an electroplating mold over each substrate pad. The seed layer is then electroplated, filling the molds, and the photoresist and vestigial seed layer are thereafter stripped (etched away), leaving behind the plated bumps. This technique is time consuming, requires high capital expenditure, and involves hazardous chemicals.

[0030] In the stenciling technique, a stencil having apertures therein is placed over the substrate with the apertures overlying corresponding pads of the substrate. As the stencil is held in place, an amount of solder paste is dispensed onto the stencil, and a screening blade (sometimes called a “doctor blade”) is moved across the stencil surface in a manner to force solder paste into the stencil apertures. The stencil is then removed, which leaves behind bodies of solder paste on the pads, and the bodies are thereafter reflowed to form solder bumps on the substrate. This technique is relatively inexpensive, and comprises only a few quick steps, but is generally not well suited to small bump sizes and high bump densities.

[0031] Conventional solder paste typically contains tiny particles of solder material (lead/tin), in a matrix of flux, and comprises about 30% (by volume) solid material.

[0032] U.S. Pat. No. 5,539,153 (“Hewlett Packard”), incorporated in its entirety by reference herein, discloses a method of bumping substrates by contained paste deposition. A non-wettable metal mask (stencil) is disposed on a substrate such that a plurality of apertures in the mask align with a plurality of pads on the substrate. The apertures are filled with solder paste in a manner comparable to that which was described hereinabove with respect to the stenciling technique. The solder paste is then reflowed with the mask in place. After reflow, the mask is removed.

[0033] U.S. Pat. No. 5.492.266 (“IBM-1”), incorporated in its entirety by reference herein, discloses a process for forming solder on select contacts of a printed circuit board (PCB), and is generally similar to the aforementioned Hewlett Packard Patent. A non-wettable stencil having openings is positioned on the board, the openings are filled with solder paste and, with the stencil fixedly positioned on the board, the solder paste retained by the stencil pattern is reflowed to selectively form on the underlying contacts of the printed circuit board.

[0034] U.S. Pat. No. 5.658.827 (“IBM-2”), incorporated in its entirety by reference herein, discloses a method for forming solder balls on a substrate. The solder balls are formed by squeegeeing solder paste through apertures in a fixture into contact with pads on a substrate, and heating the fixture, paste and substrate to reflow the solder paste into solder balls that attach to the pads and are detached from the fixture. After cooling, the fixture is separated from the substrate. In an embodiment of the method, the fixture and substrate are inverted, and another surface mount electrical component is placed on the opposite surface of the substrate prior to heating the substrate.

[0035] The aforementioned Hewlett Packard, IBM-1 and IBM-2 patents all describe printing solder paste through a mask or stencil onto a substrate, and reflowing the solder paste with the stencil in place on the substrate. In each case, the cells formed by the stencil apertures/openings are open on one side (the side of the stencil opposite the side in contact with the substrate). No admission is made herein that the inverted technique described in the IBM-2 patent would actually work as described.

[0036] The aforementioned “parent” U.S. patent application No. 08/863,800 (U.S. Pat. No. 5,988,487), discloses CAPTURED-CELL SOLDER PRINTING AND REFLOW METHODS AND APPARATUSES. Generally, a screening stencil is laid over the surface of the substrate and solder paste material is deposited into the stencil's apertures with a screening blade. The stencil is placed in such a manner that each of its apertures is positioned over a substrate pad upon which a solder bump is to be formed. Next, a flat pressure plate is laid over the exposed top surface of the stencil, which creates a fully enclosed (or “captured”) cell of solder material within each stencil aperture. Then, with the stencil and plate remaining in place on top of the substrate, the substrate is heated to a temperature sufficient to reflow the solder material. After reflow, the substrate is cooled, and the pressure plate and stencil are thereafter removed, leaving solder bumps on the substrate pads. The use of the pressure plate ensures proper formation of the solder bumps at high densities of solder bumps (i.e., high densities corresponding to small solder bump sizes and small pitch distances between solder bumps).

[0037] An example of a substrate having solder balls on a surface thereof is the Ball Grid Array (BGA) package. The advent and popularity of the BGA package has brought with it several new package manufacturing and assembly problems. One of the more significant problems is finding an efficient, cost-effective technique for applying the solder balls to the package surface. The package surface is usually formed from an electrically insulating material (e.g., printed circuit board material) with a pattern of metallized pads disposed thereupon within the package. Several methods are currently used to form solder balls on these package pads.

[0038] One method of forming solder balls on package pads involves the application of solder flux to the package pads, then placing preformed solder balls onto the package pads, either individually or en masse, with the aid of a fixture or a “pick-and-place” apparatus similar to those used for circuit board assembly. The package is then heated to the melting point of the solder ball alloy which will then wet the metallic surface of the pads and join thereto. This pick-and-place method required the precision handling of massive qualities of solder balls. As the connection counts of package increase, hundreds or even thousands of balls must be manipulated in this fashion for each package.

[0039] An alternative method of disposing solder balls on package pads involves using a printing or dispensing fixture to apply measured quantities of solder paste (a mixture of fine solder particles in a flux-containing medium) to the package contact pads. Upon exposure to heat, the solder melts and surface tension causes the solder to assume a generally spherical shape. Once cooled, the spherical shapes form ball bumps (solder balls) on the package. Evidently, solder ball contacts formed in this manner, being generally spherical, will exhibit a 1:1 aspect ratio of height-to-width. Even if hemispherical, the solder ball contacts will have a height:width ratio on the order of 0.5:1. In certain applications, it would be desirable that the external package contacts have a height:width ratio in excess of 1:1 (e.g., 2:1).

[0040] Another technique for disposing solder balls on package pads involves using printed solder paste, then placing a preformed ball, which is essentially a combination of the two techniques described hereinabove. In this technique, solder is printed onto the contact pads to form an “adhesive” on the contact pad, then a pre-formed solder ball is placed onto the contact pad and the package is heated to reflow the solder paste, thereby joining the pre-formed solder balls to the pads.

[0041] Difficulties with any technique involving measuring or dispensing precise quantities of solder paste on pads to form ball bumps include dealing with the Theological characteristics (elasticity, viscosity, plasticity) of the solder paste, accurately controlling the volume of solder paste after dispensing and reflow, and the shape of the final ball bump. The shape of the ball bump can be affected by such factors as surface tension of the molten solder and the amount of wettable expose metal area of the contact pad.

[0042] The generally spherical shape assumed by solder balls formed as described hereinabove inherently prevents the formation of “tall” (high aspect ratio) ball bumps by ordinary means. This is a limiting characteristic because, in certain applications, tall solder bumps can be used to great advantage in reflow assembly (e.g., of a packaged semiconductor device to a printed circuit board). As mentioned above, in general it is difficult to form contacts with height-to-width ratios (aspect ratios) of greater than 1:1. Some techniques involving “building up” of solder contact height in a series of process steps have managed to produce tall (high aspect ratio) contacts, but such techniques are typically expensive and cumbersome in high-volume production.

[0043] Consistency in the height of solder ball contacts is another critical factor for successful assembly of BGA type packages to circuit boards. If one or more of the solder balls are significantly shorter than others (usually due to an insufficient amount of solder paste deposited on one or more conductive pads prior to contact formation) it becomes highly likely that these smaller (shorter) contacts will completely miss their mating contact pads (on the circuit board) and will fail to form an electrical connection between the packaged semiconductor device and the underlying substrate (e.g., printed circuit board). Hence, quality control for BGA packages is critical, since proper electrical connections between the BGA package and the substrate to which it is assembled are formed only if each and every one of the solder ball contacts reflows correctly and wets its associated conductive pad on the substrate. Defective assemblies of packages to interconnection substrates can be difficult or impossible to repair after assembly if connections are not properly formed. Even prior to assembly, the correction of improperly formed solder balls on the exterior of a package can be very difficult and involves, initially, careful quality control inspection of the ball bumps prior to assembly of the packaged device to a substrate.

[0044] As the volume of packages produced by the aforementioned methods increases, the complexity of the manufacturing processes becomes an obstacle to high manufacturing rates. In order to avoid high scrap rates, high machine accuracy must be maintained, raw material properties (e.g., solder paste and pad metal) must be carefully controlled, and numerous process parameters (e.g., amount of solder paste dispensed, size of conductive pads, temperature, shape and size of ball contact) must be monitored.

[0045] Further complicating matters, in order to accommodate different package configurations (e.g., different size packages, different array spacing of the ball bump contacts, etc.), it may be necessary to change numerous parts of the manufacturing equipment (tooling). Generally speaking, complicated setup and tooling changes tend to increase downtime, thereby increasing production cost.

[0046] Information Disclosure

[0047] The following U.S. patents are cited as being of particular interest, and are incorporated in their entirety by reference herein. 1



DOC. NO.	DATE	NAME	CLASS	SUBCL


6,153,505	November 2000	Bolde, et al.	438	613
6,126,059	October 2000	Mackay, et al.	228	9
		(div of ′487)
6,109,175	August 2000	Kinoshita	101	170
6,051,273	April 2000	Dalal, et al.	427	124
6,008,071	December 1999	Karasawa, et al.	438	115
5,988,487	November 1999	Mackay, et al.	228	254
		(parent case)
5,950,908	September 1999	Fujino, et al.	228	248.1
5,934,545	August 1999	Gordon	228	191
5,877,079	March 1999	Karasawa, et al.	438	613
5,842,626	December 1998	Bhansali, et al.	228	180.22
5,829,668	November 1998	George, et al.	228	254
5,806,753	September 1998	Bielick, et al.	228	248.1
5,782,399	July 1998	Lapastora	228	41
5,773,897	June 1998	Wen, et al.	257	778
5,759,269	June 1998	Cutting et al.	118	213
5,667,128	September 1997	Rohde, et al.	228	49.5
5,658,827	August 1997	Aulicino, et al.	228	180.22
		(“IBM-2”)
5,632,434	May 27, 1997	Evans, et al.	229	44.7
5,539,153	July 1996	Schwiebert, et al.	174	260
		(“HP”)
5,492,266	February 1996	Hoebner, et al.	228	248.1
		(“IBM-1”)
5,439,164	August 1995	Hasegawa, et al.	228	194
5,366,760	November 1994	Fujii, et al.	427	96
5,310,574	May 1994	Holtmann	427	58
5,197,655	March 1993	Leerssen, et al.	228	254
5,172,469	December 1992	Onda, et al.	29	762
5,079,835	January 1992	Lam	29	840
5,014,162	January 1991	Clark, et al.	361	412

BRIEF DISCLOSURE (SUMMARY) OF THE INVENTION

[0048] It is an object of the invention to provide an improved process for forming solder balls on electronic components.

[0049] Generally, according to the invention, an electronic component substrate is processed (“ball bumped”) to form a plurality of solder balls on a corresponding plurality of pads on the substrate. A mask (stencil) having a plurality of openings (cells) is disposed on the surface of a heater stage and is printed (filled with solder paste). Then, the assembly of mask and heater stage is shuttled over to a substrate having pads (e.g., a wafer) which is in a chuck. The filled openings of the mask are aligned over the corresponding plurality of pads on the substrate.

[0050] The mask is held in intimate contact with the heater stage and with the wafer. The cells are therefore “closed” or captured. Then the heater stage is heated to reflow the solder paste and form solder balls. Reflow may also be performed in an inverted or in a partially-inverted orientation. The mask may be removed from the wafer (or vice versa) while still molten.

[0051] More specifically, according to the invention claimed herein, method and apparatus are provided for forming solder bumps on a substrate having a plurality of pads on a surface thereof, comprising a biased chuck assembly which urges the substrate into positive contact with the mask so as to maintain substantially intimate contact between a surface of the mask and the surface of the substrate.

[0052] The process of the present invention is capable of achieving high densities of small solder balls, and is readily scaleable to lower densities of large solder balls. The process proceeds relatively quickly, with low capital expenditure equipment, and without hazardous chemicals.

[0053] The present invention provides a fast, low-cost, robust, non-capital-intensive method and apparatus for forming arrays of solder bumps at moderate to high densities on electronic components, including 150 marea arrays, 200 marea arrays, and 250 marea arrays, forming solder balls at 0.5 mm pitch and at 0.8 mm pitch.

[0054] Other objects, features and advantages of the invention will become apparent in light of the following description thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Reference will be made in detail to preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. The drawings are intended to be illustrative, not limiting. Although the invention will be described in the context of these preferred embodiments, it should be understood that it is not intended to limit the spirit and scope of the invention to these particular embodiments.

[0056] Certain elements in selected ones of the drawings may be illustrated not-to-scale, for illustrative clarity.

[0057] Often, similar elements throughout the drawings may be referred to by similar references numerals. For example, the element 199 in a figure (or embodiment) may be similar in many respects to the element 299 in an other figure (or embodiment). Such a relationship, if any, between similar elements in different figures or embodiments will become apparent throughout the specification, including, if applicable, in the claims and abstract.

[0058] In some cases, similar elements may be referred to with similar numbers in a single drawing. For example, a plurality of elements 199 may be referred to as 199 a , 199 b , 199 c , etc.

[0059] The cross-sectional views, if any, presented herein may be in the form of “slices”, or “near-sighted” cross-sectional views, omitting certain background lines which would otherwise be visible in a true cross-sectional view, for illustrative clarity.

[0060] The structure, operation, and advantages of the present preferred embodiment of the invention will become further apparent upon consideration of the following description taken in conjunction with the accompanying drawings.

[0061] FIG. 1 is an exploded cross-sectional view of a method and apparatus for forming solder balls on substrates, according to patent application Ser. No. 08/863,800 (U.S. Pat. No. 5,988,487).

[0062] FIG. 1A is an enlarged (magnified) view of the substrate ( 102 ) shown in FIG. 1 , after completion of ball bumping.

[0063] FIG. 1B is an exploded cross-sectional view of an alternate embodiment of a method and apparatus for forming solder balls on substrates.

[0064] FIG. 1C is a top plan view of a substrate with bond pads.

[0065] FIG. 1D is a side cross-sectional view of the substrate of FIG. 1 C, with solder balls on the bond pads.

[0066] FIG 1 E is a side cross-sectional view of the substrate of FIG. 1 C, orthogonal to the view of FIG. 1 D, showing the solder balls on the bond pads.

[0067] FIG. 2A is a side cross-sectional view of another technique for forming solder balls on a surface of a substrate.

[0068] FIG. 2B is a side cross-sectional view of another technique for forming solder balls on a surface of a substrate.

[0069] FIG. 3A is a side cross-sectional view of an alternate embodiment of a technique for ball-bumping a substrate, according to the invention.

[0070] FIG. 3B is a top plan view of a mask (stencil) used in the technique of FIG. 3 A, according to the invention.

[0071] FIG. 3C is a top plan view of an alternate embodiment of a mask (stencil) used in the technique of FIG. 3 A, according to the invention.

[0072] FIG. 3D is a top plan view of another alternate embodiment of a mask (stencil) used in the technique of FIG. 3 A, according to the invention.

[0073] FIG. 3E is a side cross-sectional view of a further step in the technique for ball-bumping a substrate, according to the invention.

[0074] FIG. 3F is a side cross-sectional view of a further step in the technique for ball-bumping a substrate, according to the invention.

[0075] FIG. 3G is a side cross-sectional view of a further step in the technique for ball-bumping a substrate, according to the invention.

[0076] FIG. 3H is a side cross-sectional view of a ball-bumped substrate which has been formed according to the invention.

[0077] FIG. 31 is a schematic illustration of a top plan view of a ball in a cell of a mask, such as the mask of FIG. 3B .

[0078] FIG. 3J is a schematic illustration of a top plan view of a ball in a cell of a mask, such as the mask of FIG. 3C .

[0079] FIG. 4 is a schematic diagram of a machine for ball bumping substrates, according to the invention.

[0080] FIGS. 4 A- 4 B are schematic diagrams of a process flow for ball bumping substrates, using the machine of FIG. 4 , according to the invention.

[0081] FIG. 4C is a schematic diagram of an alternate embodiment of a process flow for ball bumping substrates, using the machine of FIG. 4 , according to the invention.

[0082] FIG. 4D is a schematic diagram of an alternate embodiment of a process flow for ball bumping substrates, using the machine of FIG. 4 , according to the invention.

[0083] FIG. 4E is a partial cross-sectional view of a substrate being bumped according to the inventive technique of FIG. 4D .

[0084] FIG. 5A is a side cross-sectional view illustrating a “composite” mask, according to the invention.

[0085] FIG. 5B is a side cross-sectional view illustrating a “bridge the gap” feature of the present invention.

[0086] FIG. 5C is an exploded side cross-sectional view illustrating a “stacking masks” feature of the present invention.

[0087] FIG. 6A is a side cross-sectional view of a first step of a process of forming tall, high aspect reflowable interconnect structures, according to the invention.

[0088] FIG. 6B is a side cross-sectional view of a next step of the process of forming tall, high aspect reflowable interconnect structures, according to the invention.

[0089] FIG. 6C is a side cross-sectional view of a next step of the process of forming tall, high aspect reflowable interconnect structures, according to the invention.

[0090] FIG. 6D is a side cross-sectional view of a next step of the process of forming tall, high aspect reflowable interconnect structures, according to the invention.

[0091] FIG. 7A is a top plan view of a substrate with bond pads.

[0092] FIG. 7B is a side cross-sectional view of the substrate of FIG. 7 A, with solder bumps on the bond pads.

[0093] FIG. 7C is a side cross-sectional view of the substrate of FIG. 7 A, orthogonal to the view of FIG. 7 B, showing the solder bumps on the bond pads.

[0094] FIG. 7D is a top plan view of a substrate with bond pads.

[0095] FIG. 7E is a side cross-sectional view of the substrate of FIG. 7 D, with solder bumps on the bond pads.

[0096] FIG. 7F is a side cross-sectional view of the substrate of FIG. 7 D, orthogonal to the view of FIG. 7 B, showing the solder bumps on the bond pads.

[0097] FIG. 7G is a top plan view of a substrate with bond pads.

[0098] FIG. 7H is a side cross-sectional view of the substrate of FIG. 7 G, with solder balls on the bond pads.

[0099] FIG. 7I is a side cross-sectional view of the substrate of FIG. 7 G, orthogonal to the view of FIG. 7 B, showing the solder balls on the bond pads.

[0100] FIG. 8A is an exploded side cross-sectional view of an alternate embodiment of a mask mounting technique, according to the invention.

[0101] FIG. 8B is a partially exploded side cross-sectional view of a technique for capturing the cells of the mask illustrated in FIG. 8A .

[0102] FIG. 9 is an exploded side cross-sectional view of a chuck assembly for holding a substrate which is a semiconductor wafer, according to the invention.

[0103] FIG. 9A is a magnified cross-sectional view of a component of the chuck assembly of FIG. 9 .

[0104] FIG. 10 is a schematic side view of a ball bumping machine of the present invention.

[0105] FIG. 10A is a schematic side view of a heater stage of the present invention.

[0106] FIG. 10B is a schematic cross-sectional view of a chuck assembly of the present invention.

[0107] FIG. 10C is a schematic cross-sectional view of a wafer being ball bumped, partially inverted, according to the invention.

[0108] FIG. 10D is a plan view of a mask, and its mounting arrangement, according to the invention.

[0109] FIGS. 11 A- 11 C are schematic diagrams of a process flow for ball bumping substrates, using the machine of FIG. 4 , according to the invention.

[0110] FIG. 12 is a side, cross-sectional view of a technique for applying solder paste to cells in a mask, according to the invention. See FIG. 2 of U.S. Ser. No. 10/630,310 filed Jul. 30, 2003.

[0111] FIG. 13 is a side, cross-sectional view of a set of blades, such as those shown in FIG. 12 , according to the invention. See FIG. 3 of U.S. Ser. No. 10/630,310 filed Jul. 30, 2003.

[0112] FIG. 14 is a schematic side view of two sets of blades, such as those shown in FIG. 12 , according to the invention. See FIG. 4 of U.S. Ser. No. 10/630,310 filed Jul. 30, 2003.

DETAILED DESCRIPTION OF THE INVENTION

[0113] FIG. 1 illustrates a technique 100 for forming solder balls on a surface of a substrate 102 , such as is set forth in “parent” U.S. patent application Ser. No. 08/863,800 (U.S. Pat. No. 5,988,487, Nov. 23, 1999), incorporated in its entirety by reference herein.

[0114] The substrate 102 has number of pads 104 on its top (as viewed) surface. The pads 104 are typically arranged in an array, having a pitch (center-to-center spacing from one another). The substrate 102 is disposed atop a heater stage 106 .

[0115] A mask (stencil) 110 is provided. The mask 110 is a thin planar sheet of relatively stiff material, such as molybdenum, having a plurality of openings (cells) 112 , each corresponding to a pad 104 whereupon it is desired to form a solder ball on the substrate 102 .

[0116] The mask 110 is placed on the top (as viewed) surface of the substrate 102 with the cells 112 aligned over the pads 104 . The cells 112 in the mask 110 are filled with solder material 114 . This is done in any suitable manner such as by smearing solder material on the top (as viewed) surface of the mask 110 and squeegee-ing the solder material 114 into the cells 112 of the mask 110 .

[0117] A typical solder paste contains particles of lead/tin solder, in a matrix of flux, with the following proportions: 80% (by weight) solid material (e.g., particles of lead/tin solder), and 20% (by weight) flux (including volatiles). In terms of relative volume percentages, the same typical solder paste may contain approximately 55% (by volume) of solid material (metal) and 45% (by volume) of flux. As discussed in greater detail hereinbelow, it is preferred that a “solder material” be used in lieu of regular solder paste.

[0118] It is within the scope of the invention that the cells 112 in the mask 110 are filled with solder material prior to placing the mask 110 on the top surface of the substrate, in which case the solder-material-filled cells 112 would be aligned over the pads 104 .

[0119] A pressure plate 120 is disposed onto the top (as viewed) surface of the mask 110 . This holds the mask 110 down onto the substrate 102 , and the substrate 102 down onto the heater stage 106 . This also closes off the cells 112 —hence, the terminology “captured cell”.

[0120] The heater stage 106 is heated up, typically gradually, to a temperature sufficient to cause the solder material in the cells 112 to melt (reflow). When the solder material melts, the individual solder particles will merge (flow) together and, due to surface tension, will try to form (and, typically, will form) a sphere.

[0121] When the solder material re-solidifies, it assumes a general spherical or hemispherical shape. The mask 110 is then removed from the substrate 102 .

[0122] FIG. 1A is an enlarged (magnified) view of the substrate 102 shown in FIG. 1 , after completion of ball bumping. Herein it can be observed that the solder balls 130 are generally spherical, have a diameter “D” and have a height “H”. See also FIGS. 1C, 1D , 1 E, below.

[0123] The aforementioned “parent” U.S. patent application Ser. No. 08/863,800 (U.S. Pat. No. 5,988,487) describes exemplary substrate heating programs (profiles, recipes) in terms of temperature as a function of time.

[0124] A drawback of the technique 100 is that no provision is made for “out gassing” of volatiles when the solder material is reflowed.

[0125] Another drawback of the technique 100 is that heat is directed through the substrate 102 .

[0126] FIG. 1B illustrates an alternate technique 150 (compare 100 ) for forming solder balls on a surface of a substrate 152 (compare 102 ).

[0127] The substrate 152 has number of pads 154 (compare 104 ) disposed on its top (as viewed) surface. The substrate 152 is disposed atop a chuck (base) 158 , rather than atop a heater stage ( 106 ).

[0128] A mask (stencil) 160 (compare 110 ) having cells 162 (compare 112 ) filled with solder material 164 (compare 114 ) is disposed on the surface of the substrate 152 with the cells 162 aligned with the pads 154 . The cells 162 may be pre-filled or filled with the mask 160 atop the substrate 152 .

[0129] A pressure plate 170 (compare 120 ) is disposed onto the top (as viewed) surface of the mask 160 . This holds the mask 160 down onto the substrate 152 , and the substrate 152 down onto the chuck base 158 . This also closes off the tops of the cells 162 .

[0130] A heater stage 156 (compare 106 ) is disposed onto the top (as viewed) surface of the pressure plate 170 . The heater stage 106 is heated up, typically gradually, to a temperature sufficient to cause the solder material in the cells 162 to reflow. When the mask 160 is removed, solder balls such as those ( 130 ) shown in FIG. 1A will be present on the pads 154 .

[0131] A drawback of the technique 150 is that no provision is made for “out gassing” of volatiles when the solder material is reflowed. However, in contrast to the technique 100 , the technique 150 directs heat through the pressure plate 170 rather than through the substrate 152 .

[0132] FIG. 2A illustrates a technique 200 for forming solder balls on a surface of a substrate 202 . The substrate 202 has a top surface 202 a and a bottom surface 202 b.

[0133] In this example, forming solder balls on an external surface of substrate (or board) which is a BGA substrate (board) is discussed as exemplary of forming solder balls on (ball-bumping) a substrate.

[0134] It should, however, be understood that the techniques described herein have applicability to ball bumping other substrates, such as semiconductor wafers.

[0135] A typical BGA substrate 202 has a plurality of contact pads 204 on its surface, each of which measures 35 mils across. In the typical case of round contact pads, each pad would be 35 mils in diameter. These contact pads 204 are typically spaced 50 mils (center-to-center) apart from one another. Often, the pad-surface 202 a of the substrate is covered by thin (e.g., 2 mil) layer of insulating material 206 , such as a polymer, which has openings 208 aligned with (centered over) the pads 204 . The insulating material 206 has a top surface 206 a.

[0136] The openings 208 in the insulating material 206 are typically somewhat smaller in size (area) than the pads 204 —for example, each opening measuring only 30 mils across. Evidently then, the top surface 202 a of the BGA substrate 202 will be quite irregular, exhibiting peaks where the insulating material 206 overlaps the pads 204 and valleys between the pads 204 .

[0137] A mask (stencil) 210 is provided. The mask 210 is a thin (e.g., 30 mils thick) planar sheet of relatively stiff material, such as molybdenum, having a plurality of openings (cells) 212 , each corresponding to a pad 204 whereupon it is desired to form a solder ball on the substrate 202 . A typical cross-dimension for a cell 212 is 40 mils across.

[0138] In a first step of forming solder balls on (ball bumping) the substrate 202 , the mask 210 is placed on the top surface 202 a of the BGA substrate 202 with the cells 212 aligned over the pads 204 , more particularly, over the openings 208 in the layer of insulating material 206 . As illustrated, due to the size (diameter) of the cells 212 , and the irregular surface 206 a of the insulating material 206 , there will be gaps 214 between the mask 210 and the insulating material 206 . A typical dimension for the gap is 1-2 mils. As will be evident, these gaps 214 have benefits and disadvantages.

[0139] In a next step of forming solder balls on the substrate 202 , the cells 212 in the mask 210 are filled with solder material 220 which is shown as a number of various-size spheres. (The middle cell 212 in the figure is shown without solder material 220 , for illustrative clarity.) This is done in any suitable manner such as by smearing solder past on the top surface 210 a of the mask 210 and squeegee-ing the solder material 220 into the cells 212 of the mask 210 .

[0140] It is within the scope of the invention that the cells in the mask are filled with solder material prior to placing the mask 210 on the top surface 202 a of the BGA substrate 202 with the (filled) cells 212 aligned over the pads 204 .

[0141] In a next step of ball bumping the substrate 202 , a heater stage (platen) 230 is disposed onto the top surface 210 a of the mask 210 , and the substrate 202 , mask 210 and heater stage 230 are held together with clamps (not shown), in the orientation shown in the figure—namely, with the heater stage 230 on top of the mask 210 , and with the mask 210 on top of the substrate 202 .

[0142] It is within the scope of the invention that a pressure (contact) plate (not shown, compare 170 ) is disposed on the top surface 210 a of the mask 210 , between the heater stage 230 and the mask 210 .

[0143] In a next step of forming solder balls on the substrate 202 , the heater stage 230 is heated up, typically gradually, to a temperature sufficient to cause the solder material 220 to melt within the cells 212 . When the solder material 220 melts, the individual solder particles will merge (flow) together and, due to surface tension, will try to form (and, typically, will form) a sphere.

[0144] During reflow heating, small-sized solder particles within the solder material can “leak” out of the gap 214 . This is not desirable. On the other hand, the gap 214 allows volatile material to “out gas”.

[0145] After reflowing the solder material 206 , the heater stage 230 is either removed immediately, so that the solder can cool down, or is kept in place and allowed to cool down until the solder has re-solidified as solder balls. As described in greater detail hereinbelow, often, as the solder material cools off, it will try to form a ball which has a larger diameter than the cell. This results in (i) there being an interference fit between the resulting solder ball and the sidewalls of the cell and (ii) a deformed solder ball. Regarding the latter, it is known to reflow the resulting deformed solder balls after removing the mask in order to cause them to assume a more spherical shape.

[0146] The forming of solder balls ( 240 ) on a substrate ( 202 ) is suitably carried out in the orientation illustrated in FIG. 2 A—namely, the mask ( 214 ) is disposed on top of the substrate ( 202 ) and the heater stage ( 230 ) is disposed on top of the mask ( 214 ).

[0147] Alternate embodiments of the invention, where reflow heating is carried out with the mask/substrate assembly inverted, or partially inverted, are described hereinbelow.

[0148] An inherent “side-effect” of the described technique 200 is that the flux material in the solder material ( 106 ) will liquefy and may run down onto the top surface 202 a of the substrate 202 or, in the case of there being an insulating layer 206 , onto the top surface 206 a of the insulating layer 206 . In that the ball-bumped BGA substrate (or ball-bumped semiconductor package assembly) may be “warehoused” for months, prior to being mounted to an interconnection substrate, it is known that it should be cleaned of flux (de-fluxed) soon after the solder balls have been formed on the pads ( 204 ). Furthermore, whatever flux was present in the solder material ( 220 ) will largely have been dissipated (run-off and cleaned off) in the process the flux ran off (and cleaned) off the solder balls, resulting in that they will need to be re-fluxed prior to assembling to the interconnection substrate. Typically, the flux component of solder material will lose its viscosity and start running at a much lower temperature than the melting point of the solid particulate (solder) component of the solder material.

[0149] FIG. 2B illustrates another prior art technique 250 (compare 200 ) for forming solder balls on a surface of a substrate 252 (compare 202 )—more specifically on contact pads 254 (compare 204 ) of a substrate 252 . The substrate 252 has a top surface 252 a (compare 202 a ) and a bottom surface 252 b (compare 202 b ), contact pads 254 (compare 204 ) disposed on its top surface 252 a , and a thin layer of insulating material 256 (compare 206 ) which has openings 258 (compare 208 ) aligned with (centered over) the pads 254 . The insulating material 256 has a top surface 256 a (compare 206 a ).

[0150] A mask 260 (compare 210 ) has a plurality of cells 262 (compare 212 ). In this example, the cross-dimension of a cell 262 is smaller than in the previous example (for example only 25 mils across). Due to this smaller cross-dimension, a gap (compare 214 ) is not formed between the mask 260 and the insulating material 256 , and the mask 260 is essentially “sealed” to the substrate 252 . This has the advantage that small solder balls and flux material will not “leak out” (through the gap) onto the surface of the substrate 252 (except in the case that the mask is held off of the surface of the substrate by a defect or by contamination). However, the lack of a gap also means that volatiles have no place to escape (vent, “out gas”). Thus, the rate at which the temperature of the solder material 270 is elevated becomes critical. More particularly, if the solder material is heated too fast, the volatiles will try to escape the cell ( 262 ) in a “violent” manner, often tending to lift the mask 260 off of the substrate 252 . This is not desirable.

[0151] As in the previous example, in a first step of forming solder balls on the substrate 252 , the mask 260 is placed on the top surface 252 a of the BGA substrate 252 with the cells 262 aligned over the pads 254 , more particularly, over the openings 258 in the layer of insulating material 256 .

[0152] As in the previous example, in a next step of forming solder balls on the substrate 252 , the cells 262 in the mask 260 are filled with solder material 270 (compare 220 ) which is shown as a number of various-size spheres. (The middle cell 262 in the figure is shown without solder material 220 , for illustrative clarity.)

[0153] As in the previous example, it is within the scope of the invention that the cells 262 in the mask 260 are filled with solder material prior to placing the mask 260 on the top surface 252 a of the BGA substrate 252 with the (filled) cells 262 aligned over the pads 254 .

[0154] As in the previous example, in a next step of forming solder balls on the substrate 252 , a heater stage (platen) 280 (compare 230 ) is disposed onto the top surface 260 a of the mask 260 , and the substrate 252 , mask 260 and heater stage 280 are held together with clamps (not shown), in the orientation shown in the figure—namely, with the heater stage 280 on top of the mask 260 , and with the mask 260 on top of the substrate 252 .

[0155] It is within the scope of the invention that a pressure (contact) plate (not shown, compare 170 ) is disposed on the top surface 260 a of the mask 260 , between the heater stage 280 and the mask 260 .

[0156] As in the previous example, in a next step of forming solder balls on the substrate 252 , the heater stage 280 is heated up (gradually, as noted hereinabove), to a temperature sufficient to cause the solder material 270 to melt within the cells 262 . When the solder material 270 melts, the individual solder particles will merge (flow) together and, due to surface tension, will try to form (and, typically, will form) a sphere.

[0157] As in the previous example, after reflowing the solder material 270 , the heater stage 280 is either removed immediately, so that the solder can cool down, or is kept in place and allowed to cool down until the solder has re-solidified as solder balls.

[0158] As described in greater detail hereinbelow, often, as the solder material cools off, it will try to form a ball which has a larger diameter than the cell. This results in (i) there being an interference fit between the resulting solder ball and the side walls of the cell and (ii) a deformed solder ball. Regarding the latter, it is known to reflow the resulting deformed solder balls after removing the mask in order to cause them to assume a more spherical shape.

[0159] As in the previous example, the forming of solder balls on a substrate ( 252 ) is typically carried out in the orientation illustrated in FIG. 2 B—namely, the mask ( 260 ) is disposed on top of the substrate ( 252 ) and the heater stage ( 280 ) is disposed on top of the mask ( 260 ).

[0160] Alternate embodiments of the invention, where reflow heating is carried out with the mask/substrate assembly inverted, or partially inverted, are described hereinbelow.

[0161] A benefit of the techniques 200 and 250 shown in FIGS. 2A and 2B is that the mask and the solder material contained within the cells of the mask are heated essentially directly, rather than through the substrate as was the case with the technique 100 shown in FIG. 1 . Also, as shown in FIG. 2A, a gap 214 allows for out gassing, which permits faster reflow times.

[0162] FIG. 3A illustrates a technique 300 (compare 100 , 200 , 250 ) for ball bumping a substrate 302 (compare 102 , 202 , 252 )—more specifically on contact pads 304 (compare 104 , 204 , 254 ) of a substrate 302 . It is within the scope of this invention that the substrate 302 is any electronic substrate, including a semiconductor wafer or a BGA board. The substrate 302 has a top surface 302 a (compare 102 a , 202 a , 252 a ) and a bottom surface 302 b (compare 102 b , 202 b , 252 b ). A plurality of contact pads 304 (compare 104 , 204 , 254 ) are disposed on the top surface 302 a of the substrate 302 , and are covered by a thin layer 306 (compare 206 , 256 ) of insulating material, such as a polymer, (or, in the case of the substrate 302 being a semiconductor wafer, a passivation layer) which has openings 308 (compare 108 , 208 , 258 ) aligned with (centered over) the pads 304 . The insulating material 106 has a top surface 306 a (compare 106 a , 206 a , 256 a ). The top surface 302 a of the substrate 302 has an irregular topology, exhibiting peaks where the insulating material 306 overlaps the pads 304 and valleys between the pads 304 .

[0163] A mask (stencil) 310 (compare 110 , 210 , 260 ), which is suitably a thin planar sheet of relatively stiff material, such as molybdenum, has a plurality of cells 312 (compare 112 , 162 , 212 , 262 ), each corresponding to and aligned with a pad 304 whereupon it is desired to form a solder ball on the substrate 302 . The cells 312 in the mask 310 may be round (circular), as illustrated by the array of cells 312 b in FIG. 3B . Preferably, however, the cells are not round (circular). For example, as illustrated by the array of cells 312 c in FIG. 3 C, the cells 312 c may be square. In this manner, for a given spacing, e.g., 10 mils between the peripheries of adjacent cells 312 c (in other words the size of the “web” in the mask between adjacent cells 312 c ), each individual cell 312 c can have a larger area, hence a larger volume for a given thickness mask, than a round cell ( 312 b ). Alternatively, as illustrated by the array of cells 312 d in FIG. 3 D, the cells 312 d may have a trapezoidal shape, and be arranged in alternating orientations. As in the example of square cells (See FIG. 3C ), in this manner, for a given spacing, e.g., 10 mils between the peripheries of adjacent cells 312 d (in other words the size of the “web” in the mask between adjacent cells 312 d ), each individual cell 312 d can have a larger area, hence a larger volume for a given thickness mask, than a round cell ( 312 c ). All other things being equal, the volume of a trapezoidal cell ( 312 d ) can be greater than that of a square cell ( 312 c ) which, in turn in greater than that of a round cell ( 312 a ). Non-round cells (e.g., 312 c and 312 d ) in a mask (e.g., 310 ) for forming solder balls on a surface of a substrate is considered to be within the scope of the invention. It should be noted that FIGS. 3B, 3C and 3 D are not drawn to the same scale as FIG. 3A .

[0164] Returning to FIG. 3 A, in a first step of forming solder balls on the substrate 302 , the mask 310 is placed on the top surface 302 a of the substrate 302 with the cells 312 (preferably the cells 302 c or 302 d ) aligned over the pads 304 . Evidently, the irregular surface 306 a of the insulating material 306 will result in there being gaps 314 (compare 114 ) between the mask 310 and the insulating material 306 . These gaps 314 can perform a beneficial purpose of allowing volatiles to vent (out gas).

[0165] The mask 310 is held in any suitable manner either in direct face-to-face contact with the substrate 302 , or ever so slightly spaced therefrom.

[0166] Then, the cells 312 are filled with solder material 320 . (The middle cell 312 in the figure is shown without solder material 320 , for illustrative clarity.)

[0167] It is within the scope of the invention that the cells 320 of the mask 310 are filled with solder material either when the mask is in face-to-face contact with the substrate 302 , or “off-line” (prior to bringing the mask into face-to-face contact, or near contact, with the substrate.

[0168] At this point in the process, the technique of the present invention deviates significantly from the techniques ( 100 , 200 , 250 ) described hereinabove.

[0169] FIG. 3E illustrates a next step in the process, wherein the assembly of the mask 310 and the substrate 302 , with solder material 320 loaded into the cells 312 of the mask 310 is inverted, so that the substrate 302 is physically atop above the mask 310 , as is illustrated in the figure. In this “upside-down” orientation, the solder material 320 will not fall out of the cells 312 in the mask 310 , because it is “sticky”, being a combination of solid particles and relatively viscous (at room temperature) flux material. The solder material 320 has the general consistency of toothpaste. It should be noted that in this figure ( FIG. 3E ) the middle cell 312 is shown filled with solder material 320 .

[0170] Alternatively, it is within the scope of the invention that a pressure (or “contact”) plate is placed against the mask, as described with respect to other embodiments of the invention.

[0171] As illustrated, this upside-down assembly of the mask 310 and the substrate 302 , with solder material 320 loaded into the cells 312 of the mask 310 is brought into contact with a heater stage 330 (compare 130 , 230 ) which is either brought up to or which has been pre-heated to a temperature which is greater than the melting point of the solid particles in the solder material 320 .

[0172] It is generally preferred that the solder material is gradually rather than abruptly reflowed. For example, by bringing its temperature up to less than its melt point to allow it to “condition” prior to causing it to reflow. It is within the scope of the invention that any suitable heat profile can be used.

[0173] For example, “63/37” lead/tin solder has a melting temperature of approximately 183° C. (Centigrade). In which case, the heater stage 330 may be preheated to 140°-150° C. for conditioning the solder material, then brought up to a temperature of at least 215° C., preferably to a temperature which is 20° C.-40° C. higher than the melting temperature of the solid particles of the solder material (i.e., the heater stage 330 is preferably heated to approximately 220° C.-225° C. for reflowing the aforementioned 63/37 solder material).

[0174] The upside-down assembly of the mask 310 and the substrate 302 , with solder material 320 loaded into the cells 312 of the mask 310 is held in contact with a heater stage 330 for a sufficient period of time “t” for the solid particles in the solder material 320 to melt, and preferably not much longer. Given the dynamics of the overall system, this period of time “t” is preferably determined empirically. However, since the heater stage 330 was already preheated, and since the solder material 320 and the solder mask 310 are both fairly good conductors of heat, and based on experimental trials of the technique of the present invention, it is contemplated that, for most anticipated microelectronic applications of the present invention, a period of time “t” of 5-20 seconds will be sufficient time for the solder material 320 to liquefy. However, in the case of a board (substrate) having heatsinks, for example a thick copper heatsink, the time “t” required to form the solder balls on the substrate may more than 20 seconds, for example 30 seconds.

[0175] FIG. 3F illustrates a next step of the process wherein, after the solid particles in the solder material 320 have liquefied, the heater stage 330 is removed from being in further contact with the upside-down assembly of the mask 310 and the substrate 302 . This can be done either by lifting the upside-down assembly of the mask 310 and the substrate 302 , or by lowering the heater stage 330 . The liquefied solder particles of the solder material 320 will begin to cool off and coalesce into one solid mass, typically generally in the form of a sphere.

[0176] FIGS. 3G and 3H illustrate the solder balls 340 that are formed by the process of the present invention described hereinabove. In FIG. 3 G, the mask 310 is still in place. In FIG. 3 H, the mask has been removed, and the ball bumped substrate has been re-flipped over.

[0177] While FIG. 3G illustrates an “ideal” situation where the resulting solder balls are perfectly centered within their respective cells, the real world tends not conform so neatly to perfection. As illustrated in the schematic illustration of FIG. 31, a solder ball 342 which is slightly off-center in a round cell 344 (compare 312 b ) will exhibit an arcuate area of contact with the side wall of the cell. In contrast thereto, as illustrated in the schematic illustration of FIG. 3J, a solder ball 346 which is slightly off-center in a square cell 348 (compare 312 c ) will exhibit only minimal (e.g., point) contact with the side wall of the cell. The cumulative effect of a number of solder balls misaligned with the mask openings (cells) and being in contact with the mask can have an adverse undesirable effect on subsequent separation of the mask from the substrate.

[0178] A benefit of this “inverted” embodiment of the present invention is that, due to the influence of gravity (i.e., the earth's pull on objects towards the center of the earth), flux material within the solder material 320 , which also has been liquefied, will run down the surface of the solid mass, rather than up to the surface of the substrate 302 . This is in marked contrast to the previous examples wherein it was observed that the tendency was for the liquefied flux to run down onto the substrate ( 102 , 202 , 252 ). This has some important beneficial results, including:

[0179] the substrate (board) 302 does not need to be cleaned;

[0180] the resulting solder balls 340 are “pre-fluxed”; and

[0181] the resulting solder balls 340 have a clean, oxide-free surface for better (subsequent) soldering.

[0182] Another benefit is that the resulting solder balls 340 will have a height (diameter) which is greater than the thickness of the mask 310 . Generally, large solder balls 340 having approximately a 1:1 aspect ratio (height:width) are readily formed on pads of substrates using the technique of the present invention. As a result, the molten solder ball can join itself to the substrate without there needing to be any direct contact between the mask and the substrate. Also, the mask can be removed while the solder is still molten, thereby greatly facilitating mask/substrate separation.

[0183] FIG. 4 illustrates major components of a “bumping” machine 400 for ball bumping substrates, both in the manner described hereinabove as well as using alternate techniques. The machine 400 comprises a stable platform 402 .

[0184] The machine 400 comprises a chuck 404 which is disposed on the platform 402 , for holding a substrate 406 . (The substrate 406 is not a component of the machine 400 .)

[0185] The machine 400 comprises a mask holder 408 for holding a mask (not shown), and which is mounted in an articulated manner to the platform 402 so that it can be moved from a one position to another position.

[0186] The machine 400 comprises a pressure plate holder, such as a simple framework, for holding a pressure plate 410 (compare 120 ), and which is preferably mounted in an articulated manner to the platform 402 so that it can be moved from a one position to another position. In use, it is preferred that the pressure plate be held in intimate contact with the surface of the mask opposite the substrate during reflow of the solder material in the mask.

[0187] A heat source 412 is provided for reflowing solder material in the mask, and which is preferably mounted in an articulated manner to the platform 402 so that it can be moved from a one position to another position. The heat source 412 may be a heater stage, or may be a radiant (e.g., infrared) heat panel, such as may be obtained from Watlow Electric Mfg. Co., St. Louis, Mo, USA.

[0188] A print station 414 , which may be a flat, non-wettable surface, is optionally provided, for off-wafer filling of the cells of the mask with solder material, as mentioned hereinabove.

[0189] One having ordinary skill in the art to which the invention most nearly pertains will understand how to implement the machine 400 , for performing the various techniques described herein, in light of the descriptions set forth herein.

[0190] Inverted Reflow, Inverted Cooling

[0191] FIGS. 4 A- 4 B illustrate a technique 420 for ball bumping substrates. In this technique, the pressure plate is positioned above the heat source, at a location on the machine platform, as illustrated. The mask is positioned on the substrate, which is positioned on the chuck, at another location on the machine platform. With the mask positioned on the substrate, the mask cells may be filled with solder material. Next, the assembly of the chuck/wafer/mask are shuttled into position, upside down, on the pressure plate. The heat source is turned on, and the solder material in the mask melts. Then the heat source is shut off to allow the solder material to cool and coalesce into solder balls. Finally, the mask is separated from the substrate and the substrate is separated from the chuck.

[0192] It should be noted that in this, as well as in certain other embodiments described herein, that heat must pass through the pressure plate to melt the solder material within the mask. In the case of using a heat source which is an infrared-type heat source, a quartz pressure plate may be used. Otherwise, the pressure plate may be molybdenum, stainless steel, or the like.

[0193] It is within the scope of the invention that the mask cells may be pre-filled with solder material, such as by positioning the mask on a print station surface ( 414 , described hereinabove), or by utilizing the pressure plate as a print station (in which case, the heat source should not be “on”).

[0194] It is within the scope of the invention that the heat source may have a flat surface so that it can perform the function of the pressure plate, without an additional component.

[0195] Inverted Reflow, Un-Inverted Cooling

[0196] FIG. 4C illustrates a technique 440 for ball bumping substrates. This technique proceeds in the manner of the technique 420 described hereinabove, up to the point of melting the solder material with the substrate inverted, as illustrated in FIG. 4B . Then, rather than allowing the solder material to cool in this orientation, the assembly of the chuck/wafer/mask are repositioned away from the heat source so that the wafer is “right side up” (un-inverted), and the solder material is allowed to cool. Finally, the mask is separated from the substrate and the substrate is separated from the chuck.

[0197] It is within the scope of the invention that the heat source “follows” the assembly of chuck/wafer/mask when it is repositioned, in which case it would be switched “off” to allow the solder material to cool.

[0198] Partially-Inverted Reflow And Cooling

[0199] As mentioned hereinabove with respect to the technique 300 , an advantage of reflowing the solder material in the inverted position, as described by the techniques 420 and 440 is that out gassing may occur in gaps (e.g., 314 ) between the mask and the substrate, thereby permitting relatively rapid heating (melting) of the solder material. However, it is possible that oxides may become trapped in the interface between the solder material and the substrate pad when reflowing in the inverted orientation.

[0200] FIGS. 4D and 4E illustrate an alternate technique 460 for ball bumping substrates. In this technique, rather than inverting the substrate (from 180° to 0°) to reflow the solder material, the substrate is positioned at an angle between 90° (on its side) and 0° (inverted), such as at 45° from inverted, as illustrated. (This also includes orientations for the substrate which are beyond inverted, such as −45°.) As illustrated, the substrate has been rotated 135° from being face (pads) up to being partially face down.

[0201] As best viewed in FIG. 4E, a mask 462 (compare 310 ) having openings (cells) 464 (compare 312 ) extending from a one surface to an opposite surface thereof and filled with solder material 466 , has its one surface disposed against a surface of a substrate 468 having pads 470 . A pressure plate 472 is disposed in intimate contact against the opposite surface of the mask 462 . A middle one of the cells 464 is illustrated without solder material 466 , for illustrative clarity, so that the gap 474 (compare 314 ) can clearly be seen. The assembly of substrate 468 , mask 462 and pressure plate 472 are oriented as shown, and it can be seen that the gap 474 is at the highest point of the cell. This facilitates out gassing of volatiles during reflow. The chuck and the heat source are omitted from the view of FIG. 4 E, for illustrative clarity.

[0202] This technique proceeds in the manner of the techniques 420 and 440 described hereinabove, up to the point of securing the solder-laden mask to the substrate and mounting the pressure plate to the assembly. Then, the assembly is positioned as shown, partially inverted, so that a corner of each cell is the highest point in the cell (see the corner at the gap 474 ). Reflow is performed in this position, using the heat source (not shown). Finally, the mask is separated from the substrate and the substrate is separated from the chuck.

[0203] It is within the scope of the invention that rather than allowing the solder material to cool in the partially-inverted orientation, the assembly of the chuck/wafer/mask are repositioned away from the heat source so that the wafer is “right side up” (un-inverted, 180°), and the solder material is allowed to cool.

[0204] It is within the scope of the invention that the heat source “follows” the assembly of chuck/wafer/mask when it is repositioned, in which case it would be switched “off” to allow the solder material to cool.

[0205] Composite Mask And Pressure Plate

[0206] The benefit of using a pressure plate to capture the solder material in the cells of the mask has been discussed hereinabove. It is generally preferred that the pressure plate be intimately held against the mask so that there are no gaps for leakage, particularly when reflowing inverted or partially inverted.

[0207] According to an aspect of the invention, a composite mask performing the functions of a mask and a pressure (contact) plate are formed as an integral unit, thereby assuring no leakage between the two.

[0208] FIG. 5A illustrates an embodiment of a composite mask 500 , according to the present invention. The composite mask 500 is a rigid planar structure having two portions—a mask portion 510 comparable (e.g.) to the mask 110 described hereinabove, and a pressure plate portion 520 comparable to the pressure plate 120 described hereinabove. A plurality of cells 512 (compare 112 ) extend from a one surface of the composite mask 500 , through the mask portion 510 , to the pressure plate portion 520 . These “blind hole” type openings 512 are filled with solder material 514 (compare 114 ) in the manner described hereinabove.

[0209] The composite mask 500 is suitably formed of a sheet of metal, such as molybdenum, which is etched to have cells 512 extending into a surface thereof (but not all the way through the sheet). Alternatively, the composite mask 500 can be formed from a sheet of metal comprising the pressure plate portion 520 , a surface of which is masked, patterned, and plated up to form the mask portion 510 (with cells 512 ).

[0210] Alternatively, a composite-type mask can be formed from a discrete mask welded or otherwise intimately joined (including adhered) to a discrete pressure plate.

[0211] Bridging a Gap

[0212] An interesting feature/capability of the present invention is illustrated in FIGS. 5A and 5B , but is not limited to the use of a composite mask. The composite mask 500 is illustrated disposed beneath a substrate which is in an inverted position, for example the substrate 302 from FIG. 3A (see also FIG. 3E ). Note that no part of the substrate 302 actually is in contact with the composite mask 500 —rather, that there is a small gap 524 between the opposing faces of the substrate and the mask.

[0213] As best viewed in FIG. 5 B, when the solder material 514 reflows and forms a ball, the ball has a diameter (height) which is greater than the thickness of the mask (in this illustrative case, greater than the thickness of the mask portion 510 of composite mask 500 ), so it sticks out of the mask, “bridges” the gap 524 , and wets itself to the pad 304 on the substrate 302 . The solder ball does this while it is in a liquid state, at which point the mask can easily be separated from the substrate, thereafter allowing the solder ball to cool off (solidify).

[0214] Stacked Masks

[0215] FIG. 5C illustrates a mask stack 550 comprising a first or “Liftoff” mask 552 (compare 110 ) having a plurality of cells 554 (compare 112 ) and a second or “volume control” mask 556 having a plurality of cells 558 . For example, the mask 552 is 4 mil thick, and the mask 556 is 3 mil thick. The cells 558 are tapered, as illustrated, to provide reduced hole volume control The orientation of the mask stack 550 as it would be employed for ball bumping a substrate is illustrated by the substrate 560 having pads 562 and a pressure plate 564 .

[0216] The mask stack 500 is beneficial in applications where particularly tall (high aspect ratio) solder balls (columns) are desired to be formed on a substrate, tending to overcome inherent limitations in the aspect ratio of holes that can be formed in masks. The two (or more) masks may be removed one at a time after solder ball formation to reduce liftoff stress.

[0217] There have thus been described, with respect to FIGS. 5A, 5B and 5 C a number of mask “variations”, including a composite mask, a mask which is spaced from the substrate being bumped, and a mask stack. Other mask variations may occur to one having ordinary skill in the art to which the present invention most nearly pertains, in light of the teachings set forth herein.

[0218] High Aspect Ratio Ball Bumps

[0219] Solder balls which are generally spherical, will, by definition, exhibit substantially a 1:1 aspect (height:width) ratio. If they are hemispherical, the solder balls will have an aspect ratio of approximately 0.5:1. The generally spherical shape assumed by solder balls formed as described hereinabove is based on the physics of surface tension, and inherently prevents the formation of “tall” (high aspect ratio) ball bumps by ordinary means. This is a limiting characteristic because, in certain applications, tall (high aspect ratio) solder bumps can be used to great advantage in reflow assembly (e.g., of a packaged semiconductor device to a printed circuit board). As mentioned above, in general it is difficult to form contacts with aspect ratios of greater than 1:1. Some prior art techniques involving “building up” of solder contact height in a series of process steps have managed to produce tall (high aspect ratio) contacts, but such techniques are typically expensive and cumbersome in high-volume production.

[0220] FIG. 1A (described above, see also FIGS. 1D and 1E , below) shows substantially spherical aspect ratio solder balls 130 disposed on pads 104 on a substrate 102 . Each solder ball 130 has a height H which is substantially equal to its diameter D. This is illustrative of a “1:1” aspect ratio.

[0221] FIGS. 6 A- 6 D illustrate a process for forming high aspect ratio (tall) solder bumps, according to the invention. The process benefits from any of the techniques for forming solder balls and bumps disclosed herein.

[0222] FIG. 6A is comparable to FIG. 1 A, above, and shows a substrate 602 after the step of ball bumping (“bump”). Herein it can be observed that the solder balls 630 (compare 130 ) are generally spherical, have a diameter “D1” (compare D, FIG. 1A ) and have a height “H1” (compare H, FIG. 1A ). The solder balls 630 are shown as having been formed on pads 604 (compare 104 ) on the substrate 602 (compare 102 ).

[0223] For example, on a semiconductor wafer, the solder balls 630 have a diameter D 1 of 5 mils and a height H 1 of 4 mils, the pads 604 have a size of 4 mils×4 mils, the solder balls are substantially spherical, and the pads (hence, the solder balls) are disposed at a pitch of 8 mils.

[0224] FIG. 6B illustrates a next step (“encapsulate”). Here, the bumped substrate is encapsulated, or over molded, with a non-conductive material 640 such as plastic, polyimide, or silicone This can be done using spinners, or potting, or dispensing. The thickness H 2 of the material 640 preferably greater than the height H 1 of the solder balls (H 2 >H 1 ). For example, the thickness H 2