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[0001] This application incorporates by reference, and claims priority to, and the benefit of, U.S. Provisional Patent Application Serial Nos. 60/215,584, filed on Jun. 30, 2000, and 60/242,127, filed on Oct. 20, 2000.
[0002] The invention relates generally to equipment for semiconductor wafer processing, for example, mechanisms and apparatus for handling pods or containers for housing silicon wafers or substrates. In particular, the invention relates to pod door openers and related equipment used to remove and store the sealed pod door during wafer processing.
[0003] The manufacture of integrated circuits (I.C.'s) begins with blank, unpatterned semiconductor wafers. These wafers undergo a number of sometimes critical process steps before being formed into the final I.C. form. A substandard wafer can affect the number of usable I.C.'s on a wafer, commonly referred to as yield. It is, therefore, desirable to have a machine for testing wafers to ensure the wafers meet a customer's standards and to maximize wafer yield.
[0004] The testing of wafers is often accomplished by an automated process, in which robots continuously handle and test the wafers. Robotic testing and handling tends to be more efficient than manual testing and handling of wafers, since robots can be much faster, more precise, and less contaminating than human operators when handling wafers. In wafer handling processes, wafers are typically transported using carriers such as wafer cassettes or wafer pods. Pods differ from cassettes in that the pods typically are sealed to prevent contamination of the wafers enclosed therein.
[0005] Previously, wafers having a diameter of 200 mm or 8 inches were commonly used in the semiconductor industry for the manufacture of I.C.'s. More recently, 300 mm or 12-inch diameter wafers have been introduced to allow a greater number of integrated circuits to be produced from one wafer, thus lowering the cost of producing the I.C.'s. New equipment and procedures have been developed to handle and process these new, larger wafers. For example, new larger, standard wafer pods, commonly referred to as Front Opening Unified Pods (FOUPs), have been developed. These sealed pods provide a contamination-free storage and transport environment for the wafers. To unload the wafers, the pod is positioned so that the wafers are oriented horizontally, the front door of the pod is opened to a contamination-free environment inside the testing equipment, and a robot end-effector is used to remove a wafer for processing or testing. Other versions of pods are used for smaller sized wafers; for example, Standard Mechanical Interface (SMIF) pods are typically used for 5-inch, 6-inch, and 8-inch wafers.
[0006] This application incorporates by reference in their entirety the disclosures of the following U.S. Pat. Nos.: 6,071,059 Loading and Unloading Station for Semiconductor Processing Installations; 6,053,688 Method and Apparatus for Loading and Unloading Wafers from a Wafer Carrier; and 5,772,386 Loading and Unloading Station for Semiconductor Processing Installations.
[0007] The current state of the art consists of complex pod door openers that require a large spatial working volume. The invention described herein is electromechanically novel, compact, highly reliable, and requires a minimal spatial volume to perform the same functionality as current state of the art systems. For example, the pod door opener is used for removing and storing the pod door during wafer processing, permitting loading and unloading of the 300 mm wafers relative to the pod. The pod requires the use of an apparatus to dock (or undock) the pod, unlatch (or latch) the sealed door, and to hold the pod securely during processing of the wafers. Further, the pod door opener provides a standard interface for mounting the pod to the wafer processing equipment. Semiconductor Equipment and Materials International (SEMI) standards control the mechanical interface requirements to maintain interchangeability and compatibility between pod manufacturers and processing equipment suppliers.
[0008] Various embodiments of the invention are depicted in the configuration, layout, and design of the equipment and systems described and illustrated in the accompanying figures. The invention provides an efficient, unique, compact, highly reliable pod door opener (PDO). A PDO, in accordance with the invention, is less complicated and more reliable than conventional PDOs, operating within a significantly smaller total work volume by axially retracting and lowering the pod door, instead of pivoting the pod door about a transverse axis and then lowering the door.
[0009] This fully automated system receives conventional semiconductor wafer sealed pods containing up to thirteen or twenty-five wafers, the pod doors incorporating two 90 degree door latches. A robot or other transport device deposits the pod onto a seating plate of the receiving station, which interfaces with a clean room of a semiconductor wafer processing tool, typically under positive pressure to prevent the ingress of contaminants. A locking mechanism locks the pod to the receiving station and pneumatic cylinders or other actuators may be employed to move the pod in a transverse direction to seal the pod against the interface plate and unlock and retract the pod door. A mechanical lead screw and ball nut or other transmission mechanism may be employed to lower the door to provide access for a robotic wafer handler to remove the wafers for processing and thereafter replace the wafers in the pod. The invention can be retrofitted and used in current, conventional semiconductor wafer processing systems providing enhanced reliability and smaller total operating volume.
[0010] In one embodiment, the pod is presented to an interface plate of the apparatus, often referred to as a FIMS (front opening interface mechanical standard) plate by those skilled in the art. The pod is seated on a three pin kinematic mount and locked into place using a centrally disposed pneumatically driven rotary latch once one “presence” and three “in-place” sensors indicate the pod is properly located. The pod is translated and sealed against the processing equipment interface plate using a compact pneumatic cylinder, which is maintained under pressure until the pod is to be retracted. Suction cups with integral locating pins interface positively with the pod door. Once sealed, the pod door is unlatched using a flat pack single pneumatic cylinder to drive a dual output, double acting scotch yoke. A pneumatic cylinder, riding on linear carriage ways, then retracts the door horizontally. A vertically disposed electrical optic sensor confirms that the wafers have not extended beyond the plane of the door and then the door is lowered along the vertical or Z axis, driven by an electric DC servo motor, belt, and centrally disposed lead screw. Advantageously, the electrical and pneumatic control systems may be mounted on the pod side of the interface, to facilitate troubleshooting and repair, as required.
[0011] In one aspect, the invention relates to a pod door opener including a door opening mechanism, a bulkhead having a seal plane and defining an aperture through which the door of a pod passes when removed by the door opening mechanism, and a work volume for the door opening mechanism. The work volume has a height, width, and depth, and the depth does not exceed about 80 mm from the seal plane. In various embodiments, the width does not exceed about 400 mm, generally horizontally centered on the seal plane, and the height does not exceed about 439 mm, generally vertically centered on the seal plane. In further embodiments, the pod door opener is configured to mount to a semiconductor wafer processing tool that permits a work volume for the door opening mechanism to have a depth of up to about 100 mm and/or a width of up to about 414 mm. Also, the bulkhead can be of a monocoque type construction.
[0012] The door opening mechanism moves the pod door in a horizontal direction and a vertical direction and may include a door retraction device. The door retraction device includes a bidirectional propulsion device, such as an electromechanical system, an hydraulic system, a pneumatic system, or combinations thereof. The door opening mechanism may also include a vertical positioning system. The vertical positioning system can include a lead screw, a conformal rolling nut, and a motor. The vertical positioning system could also be a guided telescopic lift device, a linear electric motor, a cam driven system, an hydraulic actuator, a pneumatic actuator, a cable drive system, a magnetically coupled device, or combinations thereof.
[0013] In still other embodiments, the pod door opener can include optionally a pinch avoidance system, a door key latch mechanism for grasping the pod door, and apparatus for sensing the presence and/or placement of the pod. The pinch avoidance system detects an obstruction and can include a frame coupled to the bulkhead and at least one switch disposed between the frame and the bulkhead. The door key latch mechanism includes a door interface plate coupled to the pod door opener, at least one door key latch coupled to the interface plate, a bi-directional propulsion device coupled to the interface plate, and a yoke coupled between the door key latch and the bi-directional propulsion device. The yoke translates a linear motion from the bidirectional propulsion device to a rotary motion on the door key latch. The bi-directional propulsion device can be an electromechanical system, an hydraulic system, a pneumatic system, or combinations thereof. The apparatus for sensing placement and position of the pod can include, for example, at least one flag and at least one sensing devices, such as be a proximity switch, a limit switch, an optical sensor, or similar device.
[0014] In another aspect, the invention relates to a kinematic tool interface system for use with a pod door opener. The kinematic tool interface system includes a lower interface, at least one kinematic pin, and a seismic anchoring device. The lower interface includes a kinematic shelf and at least one support bracket. The kinematic shelf and support bracket can be coupled rigidly to a wafer processing tool. The kinematic pin is disposed on the kinematic shelf and is independently adjustable with a range sufficient to accommodate pitch, roll, and yaw adjustments to the pod door opener. The seismic anchoring device is disposed through an underside of the kinematic shelf. In one embodiment, the kinematic tool interface system includes at least one upper interface for securing the pod door opener to the wafer-processing tool.
[0015] These and other objects, along with advantages and features of the present invention herein disclosed, will become apparent through reference to the following description, the accompanying drawings, and the claims. Furthermore, it is to be understood that the features of the various embodiments described herein are not mutually exclusive and can exist in various combinations and permutations.
[0016] In the drawings, like reference characters generally refer to the same parts throughout the different views. Also, the drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention. In the following description, various embodiments of the present invention are described with reference to the following drawings in which:
[0017] FIGS.
[0018]
[0019] FIGS.
[0020]
[0021]
[0022]
[0023] FIGS.
[0024] FIGS.
[0025]
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[0028]
[0029] FIGS.
[0030]
[0031]
[0032] FIGS.
[0033] One tool for use with contamination-free handling of wafers is a load port, also referred to herein as a pod door opener (PDO). The load port allows a wafer carrier or pod to dock to a wafer processing tool while providing a continuous, clean environment for wafers as they are unloaded from the pod by an end-effector mechanism. One typical example of a prior art load port is illustrated in FIGS.
[0034] On the equipment side
[0035] The load port mechanism
[0036]
[0037] For purposes of semiconductor wafer processing with a pod, it is important to have a system that can remove and replace automatically the sealed door of the pod. In the prior art systems, the physical size and complexity of the pod door opener are cumbersome to the end user and prone to malfunction and failure. Additionally, installation and alignment of prior art systems to wafer processing equipment are difficult. The present PDO has been developed to minimize weight and spatial volume requirements. It is also simpler to install and align to semiconductor manufacturing equipment. All major subsystems have been developed in a modular fashion, which reduces the overall complexity of the semiconductor wafer processing equipment.
[0038] FIGS.
[0039] In the embodiment illustrated in FIGS.
[0040] A system overview describing the operation of various aspects of the invention will be described next with respect to
[0041] In normal operation, the pod
[0042] All pod motions as well as the presence and placement functions are managed by a pod drive
[0043] As previously noted, the pod latch
[0044] The door chucking and retraction system
[0045] As previously mentioned, the door chucking process involves the use of two rotary door key latches
[0046] As shown in
[0047] Door retraction is accomplished by a bi-directional propulsion device
[0048] Once retracted, the door
[0049] The door chucking and retraction system
[0050] In one embodiment, the device
[0051] Several alternative techniques are possible to perform the desired functions of the vertical positioning system. Among these are a guided telescoping lift device, other linear propulsion devices, such as linear electric motors, magnetically coupled devices, cables or straps guided by pulleys and controlled with counterweights, cam driven systems, and hydraulic or pneumatic actuators.
[0052] In order to prevent an operator from becoming pinched by the pod docking motion, a pinch avoidance system
[0053] The pinch avoidance system
[0054] Another improvement over current state of the art pod door opening systems is the implementation of a kinematic tool interface system
[0055] The upper interface
[0056] FIGS.
[0057] Having described certain embodiments of the invention, it will be apparent to those of ordinary skill in the art that other embodiments incorporating the concepts disclosed herein may be used without departing from the spirit and scope of the invention. The described embodiments are to be considered in all respects as only illustrative and not restrictive.