DETAILED DESCRIPTION

[0018] Refer now to the drawings, wherein the depicted elements are not necessarily shown to scale and wherein like or similar elements are designated by the same reference numeral through the several views.

[0019] The present invention is described below in the context of measuring microprocessor case temperature using a thermocouple. However, it should be understood by those skilled in the art to which the present invention pertains that the apparatus and methods herein described are also generally applicable to any case temperature measurement of microprocessors, as well as other integrated circuits, wherein a temperature sensing device must be accurately positioned on a lid.

[0020] For reference throughout this specification, FIG. 1 illustrates a thermocouple 2 . Thermocouple 2 , like most thermocouples, includes an insulated portion 4 and a sensing end 6 . Thermocouple 2 has a diameter D, which varies according to model and manufacturer. For measuring temperature, sensing end 6 of thermocouple 2 is placed in contact with a substance for which a temperature measurement is sought. Insulated portion 4 does not sense temperature.

[0021] FIGS. 2 and 3 illustrate a package substrate 10 for receiving a microprocessor die 50 . The substrate 10 and microprocessor die 50 are covered by a lid 20 . The lid 20 serves to retain microprocessor die 50 within the substrate 10 . Lid 20 is most often covered by a heat sink 60 . In this manner, testing of microprocessor die 50 may be accomplished by passing a testing instruction set through substrate 10 and to microprocessor die 50 .

[0022] As discussed above, operation of microprocessor 50 , whether during testing or normal use, generates heat. If not controlled, the heat generated by microprocessor 50 during operation will eventually degrade or destroy microprocessor 50 . One method of controlling the temperature of microprocessor 50 during both testing and normal operation includes placing a heat sink 60 in contact with lid 20 to dissipate heat generated by microprocessor 50 . The rate of heat dissipation provided by heat sink 60 may be regulated by locating a controllable fan (not shown) immediately above heat sink 60 .

[0023] Referring now to FIGS. 1 through 3 , unlike prior apparatus for measuring microprocessor case temperature, the apparatus of the present invention includes a means for simply and accurately positioning the thermocouple 2 near the center of lid 20 . Rather than position thermocouple 2 by approximation, or by inserting it through a vertical hole (not shown) drilled through heat sink 60 , a groove 30 or similar channel-type indentation is formed in lid 20 for accurately positioning thermocouple 2 .

[0024] Depending on the particular thermocouple 2 used for measuring temperature, groove 30 is formed to a depth slightly greater than the diameter D of thermocouple 2 , which provides a groove 30 which is just deep enough to receive and surround the insulated portion 4 of thermocouple 2 . Therefore, when heat sink 60 is placed in contact with lid 20 , thermocouple 2 is not crimped or otherwise damaged by pressure between lid 20 and heat sink 60 . Groove 30 may be formed so as to originate from an edge of lid 20 and extend toward the center of lid 20 . Although groove 30 may originate at any edge or corner of lid 20 , originating groove 30 at roughly the center of a lateral edge of lid 20 causes less disturbance to the normal thermal properties of lid 20 . Similarly, while groove 30 may proceed from its origin near an edge or corner of lid 20 , along practically any path to the approximate center of lid 20 , the shortest direct path to a position near the center of lid 20 is preferred.

[0025] When thermocouple 2 includes a sensing end 6 of different shape or size than the insulated portion 4 , a corresponding shape is formed at the interior end of groove 30 . When thermocouple 2 includes sensing end 6 that is smaller than the insulated portion 4 , a step 40 may be formed at the interior end of groove 30 . When the sensing end 6 of thermocouple 2 is larger than the insulated portion 4 , a notch (not shown) may be formed in place of step 40 . Naturally, when the sensing end 6 of thermocouple 2 is roughly the same size and shape as the insulated portion 4 of thermocouple 2 , groove 30 may be formed of a single size. In any of these three cases, the sensing end 6 of thermocouple 2 should be properly positioned and oriented so as to sense temperature very near to the center of the top surface 25 of the lid 20 .

[0026] In order to facilitate efficient testing of microprocessors, thermocouple 2 may be secured in its proper position within groove 30 and step 40 , typically by bonding thermocouple 2 at its proper position within groove 30 , and step 40 or the notch (not shown) with any standard bonding agent capable of use at relatively high temperatures, e.g., at or below 150 degrees Celsius.

[0027] As discussed above, the sensing end 6 of thermocouple 2 does not directly measure the temperature of microprocessor 50 . Rather, this temperature is derived by measuring temperature at the center of the top surface 25 of lid 20 . In this process, the thermal properties of the lid 20 are compensated for by calibrating temperature measurements so as to provide a close approximation of the actual temperature of the microprocessor 50 .

[0028] Since existing testing packages are calibrated to compensate for the thermal properties of standard designs for lid 20 , which designs would not include a groove 30 , step 40 , or the notch (not shown), the present invention also provides a means for compensating for the thermal effects of forming such a groove 30 , step 40 , or notch (not shown) on lid 20 .

[0029] The effect on microprocessor case temperature caused by groove 30 and step 40 holding thermocouple 2 on the lid 20 is compensated for by locating the groove 30 and step 40 slightly off-center relative to the lid 2 . In FIG. 2 , groove 30 and step 40 are shown offset relative to the lid by a distance Δ. It has been shown empirically that choosing a distance Δin the range 1 to 3 mm provides accurate temperature measurement.

[0030] The present invention thus provides an apparatus useful for measuring microprocessor case temperature. In order to measure the temperature of microprocessors according to the present invention, a microprocessor die 50 is placed in a package substrate 10 . Microprocessor 50 and substrate 10 are covered by a lid 20 . Lid 20 includes a groove 30 , and optionally, a step 40 or notch (not shown) adapted for receiving and positioning a thermocouple 2 , as otherwise discussed above.

[0031] Next, thermocouple 2 is placed within groove 30 , and optionally within the step 40 or the notch (not shown). Thermocouple 2 may also be secured in place by bonding with epoxy or other suitable temperature-resistant material. Lid 20 is then covered by a heat sink 60 . Most typically, a controllable fan (not shown) is placed directly above and in close proximity to the heat sink 60 .

[0032] Microprocessor 50 may then be operated for the purpose of testing by passing a testing instruction set passed to microprocessor 50 through substrate 10 . Testing may then proceed and the microprocessor case temperature controlled according to the standard temperature feedback control methods, with temperature measurements provided by thermocouple 2 calibrated as discussed herein.

[0033] As can be seen from the above discussion, for measuring the temperature of microprocessors, the present apparatus and methods of the present invention do not require the difficult and often error-prone methods of positioning a thermocouple by feeding it through a hole drilled in the heat sink 60 . Moreover, by securing thermocouple 2 in place within the groove 30 , the step 40 , or the notch (not shown), testing may be easily and accurately repeated without the necessity of re-positioning thermocouple 2 .

[0034] Accordingly, the present invention provides an apparatus and method for measuring temperature during testing of microprocessors whereby a microprocessor 50 is placed in a substrate 10 , which is covered by lid 20 , the lid 20 including a groove 30 for receiving and accurately positioning a temperature sensitive thermocouple 2 .

[0035] Although the present invention and its advantages have been described in detail, it should be understood that various changes, substitutions, and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.